Global ETD Search
Search theses and dissertations gathered from participating repositories worldwide. Every result links back to the library that holds it. No account is needed.
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Showing 1 to 17 of 17 for “"Ball Grid Array"”.
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Influence of Underfill on Ball Grid Array (BGA) Package Fatigue Life
… material properties on the fatigue life of Ball Grid Array (BGA) packages that are subjected to thermal cycling is investigated in this study. A finite element model is created using Ansys by assuming the existence of an infinite array of solder interconnects, cylindrical in shape, …
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Impact of shipping Ball-Grid-Array Notebook processors in tape and reel on the PC supply chain
… notebook processors are packaged in PGA (Pin Grid Array) and 10% are packaged in BGA (Ball Grid Array). Intel has recently made a decision to transform the notebook industry by creating a new system size category called Ultrabook TM . In order to create such a thin form factor, PGA (Pin Grid …
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Analýza závad na DPS pomocí X-RAY
Diplomová práce je zaměřena na BGA (Ball Grid Array) pouzdra a detekci chyb vzniklých při jejich opravách pomocí rentgenového záření. Popisuje obecně BGA pouzdra podle druhu nosného substrátu, techniky připojování čipů, přes montáž samotných pouzder až po proces opravy desek plošných spojů (dále …
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Numerical simulation of interface delamination - with application to IC packaging
… in a thin quad flat pack (TQFP) and a plastic ball grid array (PBGA) package. For TQFP and PBGA, increased initial porosity and vapor pressure cause rises in the void growth and fall in stress carrying capacity of the cell elements, resulting in weakened interfaces. The regions of intense void …
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Reliability evaluation of stacked die BGA assemblies under mechanical bending loads
… presents a reliability evaluation of stacked die ball grid array (BGA) assemblies under mechanical bending loads. The test specimens used in this investigation were four die stacked BGAs assembled on printed circuit boards (PCBs) with eutectic tin-lead solder and gold over nickel finishes, both …
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Development of optical fiber laser array method for assessing quality of chip packages
… all sizes. This new system uses an optical fiber array consisting of two optical fiber probes, instead of the single fiber probe used in the original inspection system. This array is used to generate ultrasonic vibrations in chip packages while laser interferometry measures the induced vibrations …
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Design of a container for the collection of solder balls produced by the Uniform Droplet Spray (UDS) process
… Chip packaging is thought to be a solution. Ball Grid Array (BGA) packaging, a type of surface mount package, provides more 1/0 connections while increasing the reliability and decreasing the size of the electronics component. BGA packaging is an interconnection technology that uses an array …
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Solder Interconnect Life Prediction under Complex Temperature Cycling with Varying Mean and Amplitude
… temperature and power cycling on plastic ball grid array assembled by Sn63Pb37 and SnAg3.0Cu0.5 solder (with spatial thermal gradient). Physical tests were also conducted to quantify the developed modeling approaches.
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Impact of product design choices on supply chain performance in the notebook computer industry
… future demand for processors utilizing a ball-grid-array (BGA) package in notebook computers, which is the lower cost, smaller size packaging technology available today. This project was initiated to understand why with such a seemingly favorable environment for BGA, it still represents a …
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Contact-type mechanical interfaces for high speed digital interconnects
… of this work was to determine the feasibility of Ball Grid Array (BGA) planarization and to investigate the effects of mechanical contacts on signal integrity for highspeed digital signals. As devices become smaller and clock frequencies increase, new technologies for contacting devices are being …
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A study of the thermomechanical reliability of solder joints in surface mount electronics technology
… of components used for the investigation were Ball Grid Array (BGA) and a chip resistor. The designed research studies used the techniques of the Design of Experiment (DoE) and Taguchi methods. After conducting the trial tests that served as control experiments, next was the formation of test …
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Development of a process for the production of fluxless solder spheres for BGA electronics packaging
… production of fluxless solder spheres for BGA (Ball Grid Array) microelectronics packaging technology. The Uniform Droplet Spray (UDS) process produces solder spheres by controlling the breakup of a continuous laminar jet into uniform droplets. which are then rapidly solidified in a liquid bath …
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Computer simulation of electromigration in microelectronics interconnect
… and packaging methods such as flip chip, and Ball Grid Array (BGA). In the industry, EM-aware designs are mainly based on design rules that are derived from empirical laws which do not help understand complicated EM processes and therefore can’t be used to carry out accurate predictions for EM …
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Assessment of Thermal Behavior and Development of Thermal Design Guidelines for Integrated Power Electronics Modules
… behavior of commonly used packages such as pin grid arrays (PGA), ball grid array (BGA), or quad flat pack (QFP) are well-studied, the influence of the Embedded Power packaging architecture on the overall thermal performance of the IPEMs is not well known. This motivates the presentation of this …
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Thermo-mechanical Analysis of a Custom PCB-DBC Hybrid Package for a (650 V, 150 A) e-GaN HEMT
… bonds. A common design alteration seen in solder ball packaging is adding a polymeric material that encapsulates the bonds. If the polymer has a CTE like that of the package substrates and an elastic modulus (E) exceeding 1 GPa, it constrains the thermal warpage and lowers bond fatigue. This …
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Algorithmic studies on PCB routing
… How to escape differential pairs from a pin array is an important issue that has received too little attention in the literature. In this dissertation, we propose a new network flow model that guarantees the correctness when diagonal capacity is taken into consideration. This model leads to …
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Processing and Reliability Assessment of Solder Joint Interconnection for Power Chips
… On the other hand, advanced solder joint area-array technologies, such as flip-chip technology, has emerged in microelectronics industry due to increased speed, higher packaging density, and performance, improved reliability and low cost these technologies offer. With all these benefits to …