Dependence of stress and resistivity of sputtered copper films on deposition conditions

Chen, Tse-Shih

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Rochester Institute of Technology

Dependence of stress and resistivity of sputtered copper films on deposition conditions

dc:creator Chen, Tse-Shih

Degree

thesis:*

Level thesis:degree_level: Thesis

Author and committee

dc:creator, dc:contributor.*

Author dc:creator: Chen, Tse-Shih
Contributors dc:contributor: Entenberg, Alan

Subjects

dc:subject × 4

Thesis
Thin films
Copper films
Stresses and strains

Identifiers

dc:identifier.*

Repository record dc:identifier: https://repository.rit.edu/theses/4195
OAI identifier oai:identifier: oai:repository.rit.edu:theses-5199

Chain of custody

source

Harvested from: Rochester Institute of Technology
Base URL: repository.rit.edu/do/oai/
Last updated: 2026-07-27
Source record: OAI-PMH GetRecord

related terms

Thesis
Thin films
Copper films
rit
Thesis

citation

Chen, Tse-Shih. Dependence of stress and resistivity of sputtered copper films on deposition conditions. Thesis thesis, https://repository.rit.edu/theses/4195

Dependence of stress and resistivity of sputtered copper films on deposition conditions

Degree

Author and committee

Subjects

Identifiers

Chain of custody

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