Dependence of stress and resistivity of sputtered copper films on deposition conditions
type: CreativeWork
author: Chen, Tse-Shih
keywords: Thesis, Thin films, Copper films, Stresses and strains
date modified: 2026-07-27T20:44:14Z
provider: Rochester Institute of Technology
publisher: Networked Digital Library of Theses and Dissertations
type: WebPage
source organization: Rochester Institute of Technology