The Design and Manufacture of a Light Emitting Diode Package for General Lighting

Lighting technologies have evolved over the years to become higher quality, more efficient sources of light. LEDs are poised to become the market standard for general lighting because they are the most power efficient form of lighting and do not contain hazardous materials. Unfortunately, LEDs pose unique problems because advanced thermal management is required to remove the high heat fluxes generated by such relatively small devices. These problems have already been overcome with complex packaging and exotic materials, but high costs are preventing this technology from displacing current lighting technologies. The purpose of this study is to develop a low-cost LED lighting package capable of successfully managing heat. Several designs were created and analyzed based on cost, thermal performance, ease of manufacturing, and reliability. A unique design was created which meet these requirements. This design was eventually assembled as a prototype and initial testing was conducted. This thesis reviews the design process and eventual results of the LED package design.

Name thesis:degree_name

MS in Industrial Engineering

Discipline thesis:degree_discipline

Industrial and Manufacturing Engineering

Year dc:date.available

2010

Author dc:creator

• Krist, Michael S

Contributors dc:contributor

• Jianbiao Pan

• LED
• general lighting
• thermal management
• junction temperature
• thermal interface material
• Electrical and Electronics

Identifier

10.15368/theses.2010.5

OAI identifier oai:identifier

oai:digitalcommons.calpoly.edu:theses-1267