{"id":{"repo_id":"calpoly","oai_identifier":"oai:digitalcommons.calpoly.edu:theses-1267"},"canonical_url":"https://search.dev.ndltd.org/etd/calpoly/oai:digitalcommons.calpoly.edu:theses-1267","repository":{"repo_id":"calpoly","name":"Cal Poly","base_url":"https://digitalcommons.calpoly.edu/do/oai/"},"display":{"title":"The Design and Manufacture of a Light Emitting Diode Package for General Lighting","abstract":"Lighting technologies have evolved over the years to become higher quality, more efficient sources of light. LEDs are poised to become the market standard for general lighting because they are the most power efficient form of lighting and do not contain hazardous materials. Unfortunately, LEDs pose unique problems because advanced thermal management is required to remove the high heat fluxes generated by such relatively small devices. These problems have already been overcome with complex packaging and exotic materials, but high costs are preventing this technology from displacing current lighting technologies. The purpose of this study is to develop a low-cost LED lighting package capable of successfully managing heat. Several designs were created and analyzed based on cost, thermal performance, ease of manufacturing, and reliability. A unique design was created which meet these requirements. This design was eventually assembled as a prototype and initial testing was conducted. This thesis reviews the design process and eventual results of the LED package design.","abstract_html":"Lighting technologies have evolved over the years to become higher quality, more efficient sources of light. LEDs are poised to become the market standard for general lighting because they are the most power efficient form of lighting and do not contain hazardous materials. Unfortunately, LEDs pose unique problems because advanced thermal management is required to remove the high heat fluxes generated by such relatively small devices. These problems have already been overcome with complex packaging and exotic materials, but high costs are preventing this technology from displacing current lighting technologies. The purpose of this study is to develop a low-cost LED lighting package capable of successfully managing heat. Several designs were created and analyzed based on cost, thermal performance, ease of manufacturing, and reliability. A unique design was created which meet these requirements. This design was eventually assembled as a prototype and initial testing was conducted. This thesis reviews the design process and eventual results of the LED package design.","abstract_has_math":false,"creators":["Krist, Michael S"],"institution":null,"degree_name":"MS in Industrial Engineering","degree_level":null,"degree_discipline":"Industrial and Manufacturing Engineering","degree_department":null,"school":null,"contributors":["Jianbiao Pan"],"advisors":[],"committee_chairs":[],"committee_members":[],"year":2010,"date_issued":"2010-01-01T08:00:00Z","date_published":"2010-01-01T08:00:00Z","updated_at":"2026-07-24T01:31:03Z","subjects":["LED","general lighting","thermal management","junction temperature","thermal interface material","Electrical and Electronics"],"languages":[],"rights":[],"rights_urls":[],"identifier_entries":[{"key":"dc:identifier","label":"Identifier","values":["10.15368/theses.2010.5"],"render_values":[{"text":"10.15368/theses.2010.5","href":"https://doi.org/10.15368/theses.2010.5","code":true}]}]},"links":{"outbound_url":"https://digitalcommons.calpoly.edu/theses/255","outbound_label":"Repository record","outbound_source":"dc:identifier"},"metadata_groups":[{"id":"people","label":"People","entries":[{"key":"dc:contributor","label":"Contributor","values":["Jianbiao Pan"]},{"key":"dc:creator","label":"Author","values":["Krist, Michael S"]}]},{"id":"academic_context","label":"Academic Context","entries":[{"key":"dc:date.available","label":"Dc Date Available","values":["2012-03-18T07:00:00Z"]},{"key":"thesis:degree_discipline","label":"Discipline","values":["Industrial and Manufacturing Engineering"]},{"key":"thesis:degree_name","label":"Degree Name","values":["MS in Industrial Engineering"]}]},{"id":"subjects_keywords","label":"Subjects and Keywords","entries":[{"key":"dc:subject","label":"Dc Subject","values":["LED","general lighting","thermal management","junction temperature","thermal interface material","Electrical and Electronics"]}]},{"id":"identifiers","label":"Identifiers","entries":[{"key":"dc:identifier","label":"Identifier","values":["https://digitalcommons.calpoly.edu/theses/255","10.15368/theses.2010.5"]}]},{"id":"additional","label":"Additional Metadata","entries":[{"key":"dc:description.abstract","label":"Abstract","values":["Lighting technologies have evolved over the years to become higher quality, more efficient sources of light. LEDs are poised to become the market standard for general lighting because they are the most power efficient form of lighting and do not contain hazardous materials. Unfortunately, LEDs pose unique problems because advanced thermal management is required to remove the high heat fluxes generated by such relatively small devices. These problems have already been overcome with complex packaging and exotic materials, but high costs are preventing this technology from displacing current lighting technologies. The purpose of this study is to develop a low-cost LED lighting package capable of successfully managing heat. Several designs were created and analyzed based on cost, thermal performance, ease of manufacturing, and reliability. A unique design was created which meet these requirements. This design was eventually assembled as a prototype and initial testing was conducted. This thesis reviews the design process and eventual results of the LED package design."]},{"key":"dc:title","label":"Title","values":["The Design and Manufacture of a Light Emitting Diode Package for General Lighting"]}]}],"canonical_facts":{"dc:contributor":["Jianbiao Pan"],"dc:creator":["Krist, Michael S"],"dc:date.available":["2012-03-18T07:00:00Z"],"dc:description.abstract":["Lighting technologies have evolved over the years to become higher quality, more efficient sources of light. LEDs are poised to become the market standard for general lighting because they are the most power efficient form of lighting and do not contain hazardous materials. Unfortunately, LEDs pose unique problems because advanced thermal management is required to remove the high heat fluxes generated by such relatively small devices. These problems have already been overcome with complex packaging and exotic materials, but high costs are preventing this technology from displacing current lighting technologies. The purpose of this study is to develop a low-cost LED lighting package capable of successfully managing heat. Several designs were created and analyzed based on cost, thermal performance, ease of manufacturing, and reliability. A unique design was created which meet these requirements. This design was eventually assembled as a prototype and initial testing was conducted. This thesis reviews the design process and eventual results of the LED package design."],"dc:identifier":["https://digitalcommons.calpoly.edu/theses/255","10.15368/theses.2010.5"],"dc:subject":["LED","general lighting","thermal management","junction temperature","thermal interface material","Electrical and Electronics"],"dc:title":["The Design and Manufacture of a Light Emitting Diode Package for General Lighting"],"thesis:degree_discipline":["Industrial and Manufacturing Engineering"],"thesis:degree_name":["MS in Industrial Engineering"]},"updated_at":"2026-07-24T01:31:03Z"}