{"id":{"repo_id":"vt","oai_identifier":"oai:vtechworks.lib.vt.edu:10919/42532"},"canonical_url":"https://search.dev.ndltd.org/etd/vt/oai:vtechworks.lib.vt.edu:10919/42532","repository":{"repo_id":"vt","name":"Virginia Tech","base_url":"https://vtechworks.lib.vt.edu/oai/request"},"display":{"title":"The Role of residual stresses in ceramic substrate materials for hybrid thick film applications","abstract":"This work presents introductory research to provide the relationship between electrical measurements and residual stresses caused by hybrid processing. X-ray diffraction is used to measure residual stresses in the ceramic substrate as well as metallization of wideband coplanar thick film probes. The probes are also tested for electrical performance using Time Domain Reflectometry (TDR) technique. This thesis presents results that indicate that significant tensile residual stresses were generated on the back of the substrate, particularly during the laser scribing phase of the finished device. Significant tensile stresses were also observed in the Silver-Palladium (Ag-Pd) metallization. TDR measurements indicated significant response variations which were attributed to these induced stresses. Attempts were also made to reduce these stresses by an annealing process in order to improve the TDR response uniformity.","abstract_html":"This work presents introductory research to provide the relationship between electrical measurements and residual stresses caused by hybrid processing. X-ray diffraction is used to measure residual stresses in the ceramic substrate as well as metallization of wideband coplanar thick film probes. The probes are also tested for electrical performance using Time Domain Reflectometry (TDR) technique. This thesis presents results that indicate that significant tensile residual stresses were generated on the back of the substrate, particularly during the laser scribing phase of the finished device. Significant tensile stresses were also observed in the Silver-Palladium (Ag-Pd) metallization. TDR measurements indicated significant response variations which were attributed to these induced stresses. Attempts were also made to reduce these stresses by an annealing process in order to improve the TDR response uniformity.","abstract_has_math":false,"creators":["Schulz, Noel Nunnally"],"institution":"Virginia Tech","degree_name":"Master of Science","degree_level":"masters","degree_discipline":"Electrical Engineering","degree_department":"Electrical Engineering","school":null,"contributors":[],"advisors":[],"committee_chairs":[],"committee_members":[],"year":1990,"date_issued":"1990","date_published":"1990","updated_at":"2026-07-22T22:20:09Z","subjects":[],"languages":["en"],"rights":["In Copyright"],"rights_urls":["http://rightsstatements.org/vocab/InC/1.0/"],"identifier_entries":[{"key":"dc:identifier.other","label":"Dc Identifier Other","values":["etd-05092009-040342"],"render_values":[{"text":"etd-05092009-040342","href":null,"code":true}]}]},"links":{"outbound_url":"http://hdl.handle.net/10919/42532","outbound_label":"Handle","outbound_source":"dc:identifier.uri"},"metadata_groups":[{"id":"people","label":"People","entries":[{"key":"dc:contributor.department","label":"Department","values":["Electrical Engineering"]},{"key":"dc:creator","label":"Author","values":["Schulz, Noel Nunnally"]}]},{"id":"academic_context","label":"Academic Context","entries":[{"key":"dc:date.accessioned","label":"Dc Date Accessioned","values":["2014-03-14T21:35:44Z"]},{"key":"dc:date.available","label":"Dc Date Available","values":["2014-03-14T21:35:44Z","2009-05-09"]},{"key":"dc:date.issued","label":"Date","values":["1990"]},{"key":"dc:publisher","label":"Institution","values":["Virginia Tech"]},{"key":"dc:type","label":"Dc Type","values":["Thesis"]},{"key":"dc:type.dcmitype","label":"Dc Type Dcmitype","values":["Text"]},{"key":"thesis:degree_discipline","label":"Discipline","values":["Electrical Engineering"]},{"key":"thesis:degree_level","label":"Degree Level","values":["masters"]},{"key":"thesis:degree_name","label":"Degree Name","values":["Master of Science"]},{"key":"thesis:institution_name","label":"Thesis Institution Name","values":["Virginia Polytechnic Institute and State University"]}]},{"id":"language_rights","label":"Language and Rights","entries":[{"key":"dc:language.iso","label":"Language (ISO)","values":["en"]},{"key":"dc:rights","label":"Dc Rights","values":["In Copyright"]},{"key":"dc:rights.uri","label":"Rights URI","values":["http://rightsstatements.org/vocab/InC/1.0/"]}]},{"id":"identifiers","label":"Identifiers","entries":[{"key":"dc:identifier.other","label":"Dc Identifier Other","values":["etd-05092009-040342"]},{"key":"dc:identifier.uri","label":"Identifier URI","values":["http://hdl.handle.net/10919/42532"]}]},{"id":"additional","label":"Additional Metadata","entries":[{"key":"dc:description.abstract","label":"Abstract","values":["This work presents introductory research to provide the relationship between electrical measurements and residual stresses caused by hybrid processing. X-ray diffraction is used to measure residual stresses in the ceramic substrate as well as metallization of wideband coplanar thick film probes. The probes are also tested for electrical performance using Time Domain Reflectometry (TDR) technique. This thesis presents results that indicate that significant tensile residual stresses were generated on the back of the substrate, particularly during the laser scribing phase of the finished device. Significant tensile stresses were also observed in the Silver-Palladium (Ag-Pd) metallization. TDR measurements indicated significant response variations which were attributed to these induced stresses. Attempts were also made to reduce these stresses by an annealing process in order to improve the TDR response uniformity."]},{"key":"dc:description.degree","label":"Dc Description Degree","values":["Master of Science"]},{"key":"dc:format.medium","label":"Dc Format Medium","values":["BTD"]},{"key":"dc:format.mimetype","label":"Dc Format Mimetype","values":["application/pdf"]},{"key":"dc:title","label":"Title","values":["The Role of residual stresses in ceramic substrate materials for hybrid thick film applications"]}]}],"canonical_facts":{"dc:contributor.department":["Electrical Engineering"],"dc:creator":["Schulz, Noel Nunnally"],"dc:date.accessioned":["2014-03-14T21:35:44Z"],"dc:date.available":["2014-03-14T21:35:44Z","2009-05-09"],"dc:date.issued":["1990"],"dc:description.abstract":["This work presents introductory research to provide the relationship between electrical measurements and residual stresses caused by hybrid processing. X-ray diffraction is used to measure residual stresses in the ceramic substrate as well as metallization of wideband coplanar thick film probes. The probes are also tested for electrical performance using Time Domain Reflectometry (TDR) technique. This thesis presents results that indicate that significant tensile residual stresses were generated on the back of the substrate, particularly during the laser scribing phase of the finished device. Significant tensile stresses were also observed in the Silver-Palladium (Ag-Pd) metallization. TDR measurements indicated significant response variations which were attributed to these induced stresses. Attempts were also made to reduce these stresses by an annealing process in order to improve the TDR response uniformity."],"dc:description.degree":["Master of Science"],"dc:format.medium":["BTD"],"dc:format.mimetype":["application/pdf"],"dc:identifier.other":["etd-05092009-040342"],"dc:identifier.uri":["http://hdl.handle.net/10919/42532"],"dc:language.iso":["en"],"dc:publisher":["Virginia Tech"],"dc:rights":["In Copyright"],"dc:rights.uri":["http://rightsstatements.org/vocab/InC/1.0/"],"dc:title":["The Role of residual stresses in ceramic substrate materials for hybrid thick film applications"],"dc:type":["Thesis"],"dc:type.dcmitype":["Text"],"thesis:degree_discipline":["Electrical Engineering"],"thesis:degree_level":["masters"],"thesis:degree_name":["Master of Science"],"thesis:institution_name":["Virginia Polytechnic Institute and State University"]},"updated_at":"2026-07-22T22:20:09Z"}