Modification, curing and flame retardation of epoxy resin networks

Microwave processing, thermoplastic modification with reactive poly(arylene ether sulfone)s and improved flame retardance of di- and higher functionality epoxy resins were investigated. The influence of curing temperature and time on morphological development and fracture behavior was also studied. Arylamine functionalized poly(arylene ether sulfone)s of controlled molecular weight were synthesized as soluble, but reactive thermoplastic modifiers for aromatic amine cured epoxy resins. These materials were characterized via spectroscopy, thermogravimetric analysis, differential scanning calorimetry (DSC), dilute solution viscosity, potentiometric titration of their end groups and model chain extension reactions. Thermoplastic modification of the epoxy networks was demonstrated to afford materials with improved fracture resistance. Two glass transition temperatures were detected in the modified network systems via DSC. Scanning electron microscopy further confirmed the development of a two phase morphology in modified systems and that it could be controlled from a dispersed thermoplastic in a continuous epoxy phase, to a phase inverted morphology as the modifier increased from approximately 15 to 30 weight percent. Improvements in adhesive strength to titanium and fracture toughness were also attributed to the utilization of reactively endcapped polysulfone modifiers and the highest values were obtained with the phase inverted morphology.

Name thesis:degree_name

Ph. D.

Level thesis:degree_level

doctoral

Discipline thesis:degree_discipline

Materials Engineering Science

Department dc:contributor.department

Materials Engineering Science

Grantor dc:publisher

Virginia Tech

Year dc:date.issued

1995

Author dc:creator

• Liptak, Stephen C.

Chairs dc:contributor.committeechair

• McGrath, James E.
• Riffle, Judy S.

Committee members dc:contributor.committeemember

• Loos, Alfred C.
• Kranbuehl, David E.
• Marand, Hervé L.

• fracture resistance
• adhesive strength

Statement dc:rights

• In Copyright

Licence dc:rights.uri

• http://rightsstatements.org/vocab/InC/1.0/

Language dc:language.iso

en

Dc Identifier Other

etd-11082006-133628

OAI identifier oai:identifier

oai:vtechworks.lib.vt.edu:10919/40286