Electromagnetic Modeling of Packaging Layout in Power Electronic Modules

This thesis presents the modeling approaches and the challenges involved in electromagnetic modeling of packaging layout. It discusses the methodologies that are being used today. It then applies these methodologies to analyze, model and characterize three packaging technologies: (i) the wirebond technology, (ii) The Metal Post Interconnected Parallel Plate Structure, and the (iii) Multi Layer Structure. The model developed is validated through experimentation. These models are then used in simulation in order to compare the electrical performance of the packaging technologies. Finally some problems with the existing designs are pointed out, and suggestions (both local and generic) are given to improve the layout design.

Name thesis:degree_name

Master of Science

Level thesis:degree_level

masters

Discipline thesis:degree_discipline

Electrical and Computer Engineering

Department dc:contributor.department

Electrical and Computer Engineering

Grantor dc:publisher

Virginia Tech

Year dc:date.issued

1999

Author dc:creator

• Siddabattula, Kalyan C.

Chair dc:contributor.committeechair

• Boroyevich, Dushan

Committee members dc:contributor.committeemember

• Lu, Guo-Quan
• Lee, Fred C.

• Packaging
• Modeling

Statement dc:rights

• In Copyright

Licence dc:rights.uri

• http://rightsstatements.org/vocab/InC/1.0/

Dc Identifier Other

etd-121399-153938

OAI identifier oai:identifier

oai:vtechworks.lib.vt.edu:10919/36110