{"id":{"repo_id":"vt","oai_identifier":"oai:vtechworks.lib.vt.edu:10919/35426"},"canonical_url":"https://search.dev.ndltd.org/etd/vt/oai:vtechworks.lib.vt.edu:10919/35426","repository":{"repo_id":"vt","name":"Virginia Tech","base_url":"https://vtechworks.lib.vt.edu/oai/request"},"display":{"title":"Quantitative evaluation of thin film adhesion using the probe test","abstract":"In this study, a test technique, referred to as the probe test, has been developed as a quantitative tool for measuring the adhesion in thin adhesive films and coatings. The technique was initially developed as a qualitative test by the Hewlett-Packard Company for measuring adhesion of thin film microelectronic coatings. In the probe test method, an inclined needle-like probe with a conical tip is advanced underneath the free edge of a thin polymeric coating bonded to a substrate, causing the edge to lift-up from the surface of the substrate. A debond is thus initiated at the loading point and propagates as a semi-circular crack at the interface as the probe slides under the coating. A standard test procedure has been developed for testing thin adhesive coating/substrate systems. The sample system used is a thin film epoxy polymer coated silicon system. The interfacial fracture energy (Gc) (or critical strain energy release rate) has been used as a quantitative measure of adhesion for the given adhesive coating/substrate system. The probe test experiments were conducted using an optical microscope and a WYKO optical profiler. Using the optical microscope, the debond radius was measured for different debond sizes. Using the WYKO optical profiler, the three-dimensional surface topography of the debonded coating around the crack front was measured for different debond sizes. Using the experimental data from the probe test, analytical and numerical (finite element-based) techniques have been developed to determine the interfacial fracture energy (Gc) for the given adhesive coating/substrate system. The analytical techniques were developed based on different plate theory formulations (thin/thick plate - small/large deflection) of the probe test geometry and local curvature measurement at the crack tip. The finite element based techniques were developed using a hybrid numerical-experimental approach and surface-based contact interaction analysis in ABAQUS. The results obtained using thick plate-large deflection formulation correlated with finite element contact interaction analysis results. The probe test can be used with transparent or opaque coatings and thus offers a promising alternative to indentation and other tests methods for characterizing thin film and coating adhesion.","abstract_html":"In this study, a test technique, referred to as the probe test, has been developed as a quantitative tool for measuring the adhesion in thin adhesive films and coatings. The technique was initially developed as a qualitative test by the Hewlett-Packard Company for measuring adhesion of thin film microelectronic coatings. In the probe test method, an inclined needle-like probe with a conical tip is advanced underneath the free edge of a thin polymeric coating bonded to a substrate, causing the edge to lift-up from the surface of the substrate. A debond is thus initiated at the loading point and propagates as a semi-circular crack at the interface as the probe slides under the coating. A standard test procedure has been developed for testing thin adhesive coating/substrate systems. The sample system used is a thin film epoxy polymer coated silicon system. The interfacial fracture energy (Gc) (or critical strain energy release rate) has been used as a quantitative measure of adhesion for the given adhesive coating/substrate system. The probe test experiments were conducted using an optical microscope and a WYKO optical profiler. Using the optical microscope, the debond radius was measured for different debond sizes. Using the WYKO optical profiler, the three-dimensional surface topography of the debonded coating around the crack front was measured for different debond sizes. Using the experimental data from the probe test, analytical and numerical (finite element-based) techniques have been developed to determine the interfacial fracture energy (Gc) for the given adhesive coating/substrate system. The analytical techniques were developed based on different plate theory formulations (thin/thick plate - small/large deflection) of the probe test geometry and local curvature measurement at the crack tip. The finite element based techniques were developed using a hybrid numerical-experimental approach and surface-based contact interaction analysis in ABAQUS. The results obtained using thick plate-large deflection formulation correlated with finite element contact interaction analysis results. The probe test can be used with transparent or opaque coatings and thus offers a promising alternative to indentation and other tests methods for characterizing thin film and coating adhesion.","abstract_has_math":false,"creators":["Chadha, Harpreet Singh"],"institution":"Virginia Tech","degree_name":"Master of Science","degree_level":"masters","degree_discipline":"Engineering Science and Mechanics","degree_department":"Engineering Science and Mechanics","school":null,"contributors":[],"advisors":[],"committee_chairs":["Dillard, David A."],"committee_members":["Librescu, Liviu","Dillard, John G."],"year":2006,"date_issued":"2006-08-04","date_published":"2006-08-04","updated_at":"2026-07-22T22:19:33Z","subjects":["interfacial fracture energy","fracture mechanics","thin film","adhesion","delamination"],"languages":[],"rights":["In Copyright"],"rights_urls":["http://rightsstatements.org/vocab/InC/1.0/"],"identifier_entries":[{"key":"dc:identifier.other","label":"Dc Identifier Other","values":["etd-10182006-081706"],"render_values":[{"text":"etd-10182006-081706","href":null,"code":true}]}]},"links":{"outbound_url":"http://hdl.handle.net/10919/35426","outbound_label":"Handle","outbound_source":"dc:identifier.uri"},"metadata_groups":[{"id":"people","label":"People","entries":[{"key":"dc:contributor.committeechair","label":"Committee Chair","values":["Dillard, David A."]},{"key":"dc:contributor.committeemember","label":"Committee Member","values":["Librescu, Liviu","Dillard, John G."]},{"key":"dc:contributor.department","label":"Department","values":["Engineering Science and Mechanics"]},{"key":"dc:creator","label":"Author","values":["Chadha, Harpreet Singh"]}]},{"id":"academic_context","label":"Academic Context","entries":[{"key":"dc:date.accessioned","label":"Dc Date Accessioned","values":["2014-03-14T20:46:48Z"]},{"key":"dc:date.available","label":"Dc Date Available","values":["2014-03-14T20:46:48Z","2006-10-26"]},{"key":"dc:date.issued","label":"Date","values":["2006-08-04"]},{"key":"dc:publisher","label":"Institution","values":["Virginia Tech"]},{"key":"dc:type","label":"Dc Type","values":["Thesis"]},{"key":"thesis:degree_discipline","label":"Discipline","values":["Engineering Science and Mechanics"]},{"key":"thesis:degree_level","label":"Degree Level","values":["masters"]},{"key":"thesis:degree_name","label":"Degree Name","values":["Master of Science"]},{"key":"thesis:institution_name","label":"Thesis Institution Name","values":["Virginia Polytechnic Institute and State University"]}]},{"id":"subjects_keywords","label":"Subjects and Keywords","entries":[{"key":"dc:subject","label":"Dc Subject","values":["interfacial fracture energy","fracture mechanics","thin film","adhesion","delamination"]}]},{"id":"language_rights","label":"Language and Rights","entries":[{"key":"dc:rights","label":"Dc Rights","values":["In Copyright"]},{"key":"dc:rights.uri","label":"Rights URI","values":["http://rightsstatements.org/vocab/InC/1.0/"]}]},{"id":"identifiers","label":"Identifiers","entries":[{"key":"dc:identifier.other","label":"Dc Identifier Other","values":["etd-10182006-081706"]},{"key":"dc:identifier.uri","label":"Identifier URI","values":["http://hdl.handle.net/10919/35426"]}]},{"id":"additional","label":"Additional Metadata","entries":[{"key":"dc:description.abstract","label":"Abstract","values":["In this study, a test technique, referred to as the probe test, has been developed as a quantitative tool for measuring the adhesion in thin adhesive films and coatings. The technique was initially developed as a qualitative test by the Hewlett-Packard Company for measuring adhesion of thin film microelectronic coatings. In the probe test method, an inclined needle-like probe with a conical tip is advanced underneath the free edge of a thin polymeric coating bonded to a substrate, causing the edge to lift-up from the surface of the substrate. A debond is thus initiated at the loading point and propagates as a semi-circular crack at the interface as the probe slides under the coating. A standard test procedure has been developed for testing thin adhesive coating/substrate systems. The sample system used is a thin film epoxy polymer coated silicon system. The interfacial fracture energy (Gc) (or critical strain energy release rate) has been used as a quantitative measure of adhesion for the given adhesive coating/substrate system. The probe test experiments were conducted using an optical microscope and a WYKO optical profiler. Using the optical microscope, the debond radius was measured for different debond sizes. Using the WYKO optical profiler, the three-dimensional surface topography of the debonded coating around the crack front was measured for different debond sizes. Using the experimental data from the probe test, analytical and numerical (finite element-based) techniques have been developed to determine the interfacial fracture energy (Gc) for the given adhesive coating/substrate system. The analytical techniques were developed based on different plate theory formulations (thin/thick plate - small/large deflection) of the probe test geometry and local curvature measurement at the crack tip. The finite element based techniques were developed using a hybrid numerical-experimental approach and surface-based contact interaction analysis in ABAQUS. The results obtained using thick plate-large deflection formulation correlated with finite element contact interaction analysis results. The probe test can be used with transparent or opaque coatings and thus offers a promising alternative to indentation and other tests methods for characterizing thin film and coating adhesion."]},{"key":"dc:description.degree","label":"Dc Description Degree","values":["Master of Science"]},{"key":"dc:title","label":"Title","values":["Quantitative evaluation of thin film adhesion using the probe test"]}]}],"canonical_facts":{"dc:contributor.committeechair":["Dillard, David A."],"dc:contributor.committeemember":["Librescu, Liviu","Dillard, John G."],"dc:contributor.department":["Engineering Science and Mechanics"],"dc:creator":["Chadha, Harpreet Singh"],"dc:date.accessioned":["2014-03-14T20:46:48Z"],"dc:date.available":["2014-03-14T20:46:48Z","2006-10-26"],"dc:date.issued":["2006-08-04"],"dc:description.abstract":["In this study, a test technique, referred to as the probe test, has been developed as a quantitative tool for measuring the adhesion in thin adhesive films and coatings. The technique was initially developed as a qualitative test by the Hewlett-Packard Company for measuring adhesion of thin film microelectronic coatings. In the probe test method, an inclined needle-like probe with a conical tip is advanced underneath the free edge of a thin polymeric coating bonded to a substrate, causing the edge to lift-up from the surface of the substrate. A debond is thus initiated at the loading point and propagates as a semi-circular crack at the interface as the probe slides under the coating. A standard test procedure has been developed for testing thin adhesive coating/substrate systems. The sample system used is a thin film epoxy polymer coated silicon system. The interfacial fracture energy (Gc) (or critical strain energy release rate) has been used as a quantitative measure of adhesion for the given adhesive coating/substrate system. The probe test experiments were conducted using an optical microscope and a WYKO optical profiler. Using the optical microscope, the debond radius was measured for different debond sizes. Using the WYKO optical profiler, the three-dimensional surface topography of the debonded coating around the crack front was measured for different debond sizes. Using the experimental data from the probe test, analytical and numerical (finite element-based) techniques have been developed to determine the interfacial fracture energy (Gc) for the given adhesive coating/substrate system. The analytical techniques were developed based on different plate theory formulations (thin/thick plate - small/large deflection) of the probe test geometry and local curvature measurement at the crack tip. The finite element based techniques were developed using a hybrid numerical-experimental approach and surface-based contact interaction analysis in ABAQUS. The results obtained using thick plate-large deflection formulation correlated with finite element contact interaction analysis results. The probe test can be used with transparent or opaque coatings and thus offers a promising alternative to indentation and other tests methods for characterizing thin film and coating adhesion."],"dc:description.degree":["Master of Science"],"dc:identifier.other":["etd-10182006-081706"],"dc:identifier.uri":["http://hdl.handle.net/10919/35426"],"dc:publisher":["Virginia Tech"],"dc:rights":["In Copyright"],"dc:rights.uri":["http://rightsstatements.org/vocab/InC/1.0/"],"dc:subject":["interfacial fracture energy","fracture mechanics","thin film","adhesion","delamination"],"dc:title":["Quantitative evaluation of thin film adhesion using the probe test"],"dc:type":["Thesis"],"thesis:degree_discipline":["Engineering Science and Mechanics"],"thesis:degree_level":["masters"],"thesis:degree_name":["Master of Science"],"thesis:institution_name":["Virginia Polytechnic Institute and State University"]},"updated_at":"2026-07-22T22:19:33Z"}