Experimental Investigation and Validation of Boiling and Condensation Thermal Resistances in Cylindrical Thermosyphons and Screen-Wick Heat Pipes.

Thermosyphons (TS) and heat pipes (HP) are passive two-phase thermal transport devices capable of transferring high heat loads with small temperature differences in thermal management applications. This thesis aims to improve the design-stage prediction of TS and HP performance, where device behaviour must be estimated from known application requirements, geometry, and operating conditions without device-specific experimental characterization. An experimental investigation was conducted to characterize the thermal resistances governing overall device performance. A comprehensive dataset was obtained for 20 copper–water TS and 10 copper–water HP with copper screen-mesh wicks to quantify pool boiling, falling-film boiling, and condensation resistances. Experiments were performed over fill ratios of 0.35–0.75, aspect ratios of 5.3–12.5, inclination angles from 20° to 90°, and evaporator heat-input rates of 6.8–34.0 W. Based on the observed resistance behaviour, resistance-based predictive equations were evaluated against the present experiments and literature datasets, demonstrating good agreement for performance estimation.

Name thesis:degree_name

M Eng Sci

Discipline thesis:degree_discipline

Mechanical and Materials Engineering

Grantor dc:publisher

The University of Western Ontario

Year dc:date.issued

2026

Author dc:creator

• Sanchez, Sebastian

Advisors dc:contributor.advisor

• DeGroot, Christopher
• Savory, Eric

• Thermosyphon
• Heat Pipe
• Two-phase heat transfer
• Thermal resistance
• Phase-Change heat transfer
• Experimental Investigation
• Fill Ratio
• Aspect Ratio
• Inclination Angle
• Wick

Statement dc:rights

• Attribution 4.0 International

Language dc:language.iso

en

Handle dc:identifier.uri

https://hdl.handle.net/20.500.14721/39504

OAI identifier oai:identifier

oai:uwo.scholaris.ca:20.500.14721/39504