Parametric Modeling, Analysis, Classification, and Optimization of the Laser Polishing Process with Respect to the Working Distance

Laser polishing (LP) is a finishing technique used to enhance the quality of the workpiece surface. LP relies on laser radiation to melt a thin superficial layer of material in order to either smoothen the surface or generate structures on it. The process of surface smoothening is achieved via surface polishing utilizing laser remelting (SP-LRM). The process of structure generation is achieved via surface structuring by means of laser remelting (SS-LRM). The working distance of the laser beam is typically defined as the location of the focal point of the laser beam with respect to the top of the workpiece. The ability to change the working distance of the laser beam offers LP several advantages compared to conventional machining techniques by making the beam a flexible energy delivery tool. This thesis will focus on the development of a parametric model capable to classify and optimize the laser parameters used for surface polishing. Multiple laser-remelted lines were created with different combinations of laser power, feed rate, and working distances. The results show the importance of including the working distance as an essential process parameter since it can change the applied areal remelting power delivered to the surface of the workpiece. Furthermore, this study shows the existence of an optimal range of laser-remelted power to be used in the surface polishing process.

Name thesis:degree_name

M Eng Sci

Discipline thesis:degree_discipline

Mechanical and Materials Engineering

Grantor dc:publisher

The University of Western Ontario

Year dc:date.issued

2022

Author dc:creator

• Meshreqy, Samer

Advisors dc:contributor.advisor

• O. Remus Tutunea-Fatan
• Evgueni V. Bordatchev

• laser remelting
• surface quality improvement
• laser working distance
• topography analysis
• melt pool detection
• surface polishing

Language dc:language.iso

en_ca

Handle dc:identifier.uri

https://hdl.handle.net/20.500.14721/32696

OAI identifier oai:identifier

oai:uwo.scholaris.ca:20.500.14721/32696