{"id":{"repo_id":"uoit","oai_identifier":"oai:ontariotechu.scholaris.ca:10155/775"},"canonical_url":"https://search.dev.ndltd.org/etd/uoit/oai:ontariotechu.scholaris.ca:10155/775","repository":{"repo_id":"uoit","name":"Ontario Institute of Technology","base_url":"https://ontariotechu.scholaris.ca/server/oai/request"},"display":{"title":"Analysis and feasibility of an evaporative cooling system with sessile droplet evaporation to provide cooling for microprocessors","abstract":"The study investigates the cooling requirements for the Intel Xenon Processor and the Intel Core i7-900 Processor using diffusion based evaporation of sessile droplets. An analytical model is developed to determine the capacity of a single layer of droplets to provide sufficient cooling. It is found that a single layer can provide sufficient cooling for the processors with tiny droplets. A numerical model is developed to analyze a tiered system that fits within the space restrictions corresponding to the current heat sinks with larger droplets and fewer of them. The results of the numerical modelling work found that a minimum of 41 posts connecting each of the tiers were required to cool the Xenon Processor and 42 posts for the Core i7-900 Processor. It was also found that a minimum of 3 tiers were required for the Xenon Processor, with a droplet radius of 2 mm, and 4 tiers for the Core i7.","abstract_html":"The study investigates the cooling requirements for the Intel Xenon Processor and the Intel Core i7-900 Processor using diffusion based evaporation of sessile droplets. An analytical model is developed to determine the capacity of a single layer of droplets to provide sufficient cooling. It is found that a single layer can provide sufficient cooling for the processors with tiny droplets. A numerical model is developed to analyze a tiered system that fits within the space restrictions corresponding to the current heat sinks with larger droplets and fewer of them. The results of the numerical modelling work found that a minimum of 41 posts connecting each of the tiers were required to cool the Xenon Processor and 42 posts for the Core i7-900 Processor. It was also found that a minimum of 3 tiers were required for the Xenon Processor, with a droplet radius of 2 mm, and 4 tiers for the Core i7.","abstract_has_math":false,"creators":["Chakraborty, Soma"],"institution":"University of Ontario Institute of Technology","degree_name":"Master of Applied Science (MASc)","degree_level":null,"degree_discipline":"Mechanical Engineering","degree_department":null,"school":null,"contributors":[],"advisors":["MacDonald, Brendan D.","Rosen, Marc A."],"committee_chairs":[],"committee_members":[],"year":2017,"date_issued":"2017-04-01","date_published":"2017-04-01","updated_at":"2026-07-24T05:35:20Z","subjects":["Evaporative cooling","Sessile droplets","Microprocessors","Evaporation","Thermal management"],"languages":["en"],"rights":[],"rights_urls":[],"identifier_entries":[]},"links":{"outbound_url":"https://hdl.handle.net/10155/775","outbound_label":"Handle","outbound_source":"dc:identifier.uri"},"metadata_groups":[{"id":"people","label":"People","entries":[{"key":"dc:contributor.advisor","label":"Advisor","values":["MacDonald, Brendan D.","Rosen, Marc A."]},{"key":"dc:creator","label":"Author","values":["Chakraborty, Soma"]}]},{"id":"academic_context","label":"Academic Context","entries":[{"key":"dc:date.accessioned","label":"Dc Date Accessioned","values":["2017-07-12T18:28:43Z","2022-03-29T16:41:10Z"]},{"key":"dc:date.available","label":"Dc Date Available","values":["2017-07-12T18:28:43Z","2022-03-29T16:41:10Z"]},{"key":"dc:date.issued","label":"Date","values":["2017-04-01"]},{"key":"dc:type","label":"Dc Type","values":["Thesis"]},{"key":"thesis:degree_discipline","label":"Discipline","values":["Mechanical Engineering"]},{"key":"thesis:degree_name","label":"Degree Name","values":["Master of Applied Science (MASc)"]},{"key":"thesis:institution_name","label":"Thesis Institution Name","values":["University of Ontario Institute of Technology"]}]},{"id":"subjects_keywords","label":"Subjects and Keywords","entries":[{"key":"dc:subject","label":"Dc Subject","values":["Evaporative cooling","Sessile droplets","Microprocessors","Evaporation","Thermal management"]}]},{"id":"language_rights","label":"Language and Rights","entries":[{"key":"dc:language.iso","label":"Language (ISO)","values":["en"]}]},{"id":"identifiers","label":"Identifiers","entries":[{"key":"dc:identifier.uri","label":"Identifier URI","values":["https://hdl.handle.net/10155/775"]}]},{"id":"additional","label":"Additional Metadata","entries":[{"key":"dc:description.abstract","label":"Abstract","values":["The study investigates the cooling requirements for the Intel Xenon Processor and the Intel Core i7-900 Processor using diffusion based evaporation of sessile droplets. An analytical model is developed to determine the capacity of a single layer of droplets to provide sufficient cooling. It is found that a single layer can provide sufficient cooling for the processors with tiny droplets. A numerical model is developed to analyze a tiered system that fits within the space restrictions corresponding to the current heat sinks with larger droplets and fewer of them. The results of the numerical modelling work found that a minimum of 41 posts connecting each of the tiers were required to cool the Xenon Processor and 42 posts for the Core i7-900 Processor. It was also found that a minimum of 3 tiers were required for the Xenon Processor, with a droplet radius of 2 mm, and 4 tiers for the Core i7."]},{"key":"dc:title","label":"Title","values":["Analysis and feasibility of an evaporative cooling system with sessile droplet evaporation to provide cooling for microprocessors"]}]}],"canonical_facts":{"dc:contributor.advisor":["MacDonald, Brendan D.","Rosen, Marc A."],"dc:creator":["Chakraborty, Soma"],"dc:date.accessioned":["2017-07-12T18:28:43Z","2022-03-29T16:41:10Z"],"dc:date.available":["2017-07-12T18:28:43Z","2022-03-29T16:41:10Z"],"dc:date.issued":["2017-04-01"],"dc:description.abstract":["The study investigates the cooling requirements for the Intel Xenon Processor and the Intel Core i7-900 Processor using diffusion based evaporation of sessile droplets. An analytical model is developed to determine the capacity of a single layer of droplets to provide sufficient cooling. It is found that a single layer can provide sufficient cooling for the processors with tiny droplets. A numerical model is developed to analyze a tiered system that fits within the space restrictions corresponding to the current heat sinks with larger droplets and fewer of them. The results of the numerical modelling work found that a minimum of 41 posts connecting each of the tiers were required to cool the Xenon Processor and 42 posts for the Core i7-900 Processor. It was also found that a minimum of 3 tiers were required for the Xenon Processor, with a droplet radius of 2 mm, and 4 tiers for the Core i7."],"dc:identifier.uri":["https://hdl.handle.net/10155/775"],"dc:language.iso":["en"],"dc:subject":["Evaporative cooling","Sessile droplets","Microprocessors","Evaporation","Thermal management"],"dc:title":["Analysis and feasibility of an evaporative cooling system with sessile droplet evaporation to provide cooling for microprocessors"],"dc:type":["Thesis"],"thesis:degree_discipline":["Mechanical Engineering"],"thesis:degree_name":["Master of Applied Science (MASc)"],"thesis:institution_name":["University of Ontario Institute of Technology"]},"updated_at":"2026-07-24T05:35:20Z"}