Improvement of Homogeneity and Adhesion of Diamond-Like Carbon Films on Copper Substrates

Electrodeposition method is used to deposit diamond-like carbon (DLC) films on copper substrates via anodic oxidation at low temperature. These films are characterized using Raman spectroscopy, Fourier transform infrared spectroscopy and scanning electron microscopy. Homogeneity of these films is studied using Raman spectroscopy and scanning electron microscopy. Scotch tape peel tests indicate adherent film on copper substrate. Carbon phase transformation is studied using thermal annealing experiments in conjunction with Raman spectroscopy and scanning electron microscopy. A cathodic electrochemical method is also studied to deposit diamond-like carbon films on copper substrates. However, films deposited by the cathodic route have poor adhesion and quality compared to anodically deposited films. It is also possible to grow diamond phase on copper substrates using acetylene in liquid ammonia via electrodeposition route. An electrochemical method is proposed for boron doping into DLC films.

Grantor dc:publisher

University of North Texas

Year dc:date

2004

Author dc:creator

• Vavilala, Suma

Contributors dc:contributor

• Golden, Teresa D.
• Omary, Mohammad
• Lance, Michael J.

• Thin films.
• Electroplating.
• Copper.
• Raman spectroscopy
• diamond-like carbon
• copper substrate
• electrodeposition
• homogeneity

Statement dc:rights

• Public
• Copyright
• Vavilala, Suma
• Copyright is held by the author, unless otherwise noted. All rights reserved.

Language dc:language

English

Identifier

oclc: 56698635
https://digital.library.unt.edu/ark:/67531/metadc4565/
ark: ark:/67531/metadc4565

OAI identifier oai:identifier

info:ark/67531/metadc4565