Characterizaton of Triethoxyfluorosilane and Tetraethoxysilane Based Aerogels

Aerogels are highly porous, low dielectric constant (low k) materials being considered by the semiconductor industry as an interlayer dielectric. Low k materials are needed to overcome capacitance problems that limit device feature sizes. Precursors triethoxyfluorosilane (TEFS) and tetraethoxysilane (TEOS) were used to prepare bulk aerogels. Samples were prepared by sol-gel methods, and then carbon dioxide supercritically-dried. Effects of varying the water to precursor ratio were studied with respect to aerogel properties and microstructure. Methods of analysis for this study include FTIR-ATR, TEM, RBS, EDS, SEM, dielectric constant determination by impedance and surface area by gas adsorption. Si-F bonds were determined to be present in both acid- and base-catalyzed TEFS as well as HF-catalyzed TEOS. Fluorine promotes a fractal network microstructure as opposed to a particle-like microstructure. Surface area and dielectric constant were determined to increase slightly with increases in the water to precursor ratio.

Grantor dc:publisher

University of North Texas

Year dc:date

2001

Author dc:creator

• Roepsch, Jodi Ann

Contributors dc:contributor

• Reidy, Richard
• Brostow, Witold, 1934-
• D'Souza, Nandika A.
• Gnade, Bruce

• Aerogels.
• aerogels
• low k materials
• TEFS
• dielectrics
• TEOS

Statement dc:rights

• Use restricted to UNT Community
• Copyright
• Roepsch, Jodi Ann
• Copyright is held by the author, unless otherwise noted. All rights reserved.

Language dc:language

English

Identifier

oclc: 51988601
https://digital.library.unt.edu/ark:/67531/metadc2999/
ark: ark:/67531/metadc2999

OAI identifier oai:identifier

info:ark/67531/metadc2999