Carbon nanotubes as interconnect for next generation network on chip

Multi-core processors provide better performance when compared with their single-core equivalent. Recently, Networks-on-Chip (NoC) have emerged as a communication methodology for multi core chips. Network-on-Chip uses packet based communication for establishing a communication path between multiple cores connected via interconnects. Clock frequency, energy consumption and chip size are largely determined by these interconnects. According to the International Technology Roadmap for Semiconductors (ITRS), in the next five years up to 80% of microprocessor power will be consumed by interconnects. In the sub 100nm scaling range, interconnect behavior limits the performance and correctness of VLSI systems. The performance of copper interconnects tend to get reduced in the sub 100nm range and hence we need to examine other interconnect options. Single Wall Carbon Nanotubes exhibit better performance in sub 100nm processing technology due to their very large current carrying capacity and large electron mean free paths. This work suggests using Single Wall Carbon Nanotubes (SWCNT) as interconnects for Networks-on-Chip as they consume less energy and gives more throughput and bandwidth when compared with traditional Copper wires.

Name thesis:degree_name

Electrical Engineering

Level thesis:degree_level

Thesis

Discipline thesis:degree_discipline

Electrical and Computer Engineering

Year

2012

Author dc:creator

• Ramalingam Rajasekaran, Manoj Kumar

Contributors dc:contributor

• Zarkesh Ha, Payman
• Krishna, Sanjay
• Fleddermann, Charles
• Suddharth, Steven

Language dc:language

English

Repository record dc:identifier

https://digitalrepository.unm.edu/ece_etds/214

OAI identifier oai:identifier

oai:digitalrepository.unm.edu:ece_etds-1213