{"id":{"repo_id":"uiuc","oai_identifier":"oai:www.ideals.illinois.edu:2142/99530"},"canonical_url":"https://search.dev.ndltd.org/etd/uiuc/oai:www.ideals.illinois.edu:2142/99530","repository":{"repo_id":"uiuc","name":"University of Illinois - Urbana-Champaign","base_url":"https://www.ideals.illinois.edu/oai-pmh"},"display":{"title":"Autonomic thermal switch based on phase transition alloys","abstract":"Thermal management opens the new era of next generation electronic and thermal devices. Research on nano-scaled autonomic thermal switching is lacking because the suitable material is hard to synthesis. Our approach is utilizing the phase change property of eutectic/eutectoid materials. Triggered by heat, this type of material is possible to be directionally solidified into anisotropic structure, such as ordered lamellae and rods. We have surveyed the whole family of binary eutectic and eutectoid alloys and come up with a few good candidates for thermal switching applications. Two of the materials we studied in this thesis are Cu-P-Ag alloy and Cu-P eutectic alloy. The experimental methods we use are directional solidification and Time-domain Thermo-reflectance (TDTR) measurement. We have achieved large area of ordered lamellar structure up to hundreds of micron meters using Cu-P eutectic alloy. We include a few modern techniques to study the composition of both materials, which could be applied to other candidates for this type of application. The thermal conductivities of both materials are measured using TDTR. The Cu-P-Ag alloy and Cu-P eutectic alloy have thermal conductivity of 13.34 W/mK and 8.23 W/mK respectively. The theoretical estimation of thermal conductivity of Cu-P-Ag is around 40 W/mK, and the theoretical estimation for Cu-P eutectic alloy is around 200 W/mK. Both of our measured values are a little off from our estimated thermal conductivity of composite alloys, but the directional solidified alloys of these types were not measured before. It may due to the fact of surface reaction of our alloys with the environment and caused oxidation and contamination, and TDTR is a surface sensitive technique for thermal conductivity measurement. Other possible thermal measurements like Scanning Thermal Microscopy (SThM) and 3-omega thermal measurement should be included as a comparison in future.","abstract_html":"Thermal management opens the new era of next generation electronic and thermal devices. Research on nano-scaled autonomic thermal switching is lacking because the suitable material is hard to synthesis. Our approach is utilizing the phase change property of eutectic/eutectoid materials. Triggered by heat, this type of material is possible to be directionally solidified into anisotropic structure, such as ordered lamellae and rods. We have surveyed the whole family of binary eutectic and eutectoid alloys and come up with a few good candidates for thermal switching applications. Two of the materials we studied in this thesis are Cu-P-Ag alloy and Cu-P eutectic alloy. The experimental methods we use are directional solidification and Time-domain Thermo-reflectance (TDTR) measurement. We have achieved large area of ordered lamellar structure up to hundreds of micron meters using Cu-P eutectic alloy. We include a few modern techniques to study the composition of both materials, which could be applied to other candidates for this type of application. The thermal conductivities of both materials are measured using TDTR. The Cu-P-Ag alloy and Cu-P eutectic alloy have thermal conductivity of 13.34 W/mK and 8.23 W/mK respectively. The theoretical estimation of thermal conductivity of Cu-P-Ag is around 40 W/mK, and the theoretical estimation for Cu-P eutectic alloy is around 200 W/mK. Both of our measured values are a little off from our estimated thermal conductivity of composite alloys, but the directional solidified alloys of these types were not measured before. It may due to the fact of surface reaction of our alloys with the environment and caused oxidation and contamination, and TDTR is a surface sensitive technique for thermal conductivity measurement. Other possible thermal measurements like Scanning Thermal Microscopy (SThM) and 3-omega thermal measurement should be included as a comparison in future.","abstract_has_math":false,"creators":["Li, Xuejiao"],"institution":"University of Illinois at Urbana-Champaign","degree_name":"M.S.","degree_level":"Thesis","degree_discipline":"Materials Science & Engr","degree_department":null,"school":null,"contributors":["Braun, Paul V."],"advisors":[],"committee_chairs":[],"committee_members":[],"year":2018,"date_issued":"2018-03-13T17:35:55Z","date_published":"2018-03-13T17:35:55Z","updated_at":"2026-07-22T22:24:37Z","subjects":["Eutectic","Eutectoid"],"languages":["en"],"rights":["Copyright 2017 Xuejiao Li"],"rights_urls":[],"identifier_entries":[]},"links":{"outbound_url":"http://hdl.handle.net/2142/99530","outbound_label":"Handle","outbound_source":"dc:identifier"},"metadata_groups":[{"id":"people","label":"People","entries":[{"key":"dc:contributor","label":"Contributor","values":["Braun, Paul V."]},{"key":"dc:creator","label":"Author","values":["Li, Xuejiao"]}]},{"id":"academic_context","label":"Academic Context","entries":[{"key":"dc:date","label":"Dc Date","values":["2018-03-13T17:35:55Z","2020-03-14T09:15:08Z","2017-12-12","2017-12"]},{"key":"dc:type","label":"Dc Type","values":["text"]},{"key":"thesis:degree_discipline","label":"Discipline","values":["Materials Science & Engr"]},{"key":"thesis:degree_level","label":"Degree Level","values":["Thesis"]},{"key":"thesis:degree_name","label":"Degree Name","values":["M.S."]},{"key":"thesis:institution_name","label":"Thesis Institution Name","values":["University of Illinois at Urbana-Champaign"]}]},{"id":"subjects_keywords","label":"Subjects and Keywords","entries":[{"key":"dc:subject","label":"Dc Subject","values":["Eutectic","Eutectoid"]}]},{"id":"language_rights","label":"Language and Rights","entries":[{"key":"dc:language","label":"Dc Language","values":["en"]},{"key":"dc:rights","label":"Dc Rights","values":["Copyright 2017 Xuejiao Li"]}]},{"id":"identifiers","label":"Identifiers","entries":[{"key":"dc:identifier","label":"Identifier","values":["http://hdl.handle.net/2142/99530"]}]},{"id":"additional","label":"Additional Metadata","entries":[{"key":"dc:description","label":"Description","values":["Thermal management opens the new era of next generation electronic and thermal devices. Research on nano-scaled autonomic thermal switching is lacking because the suitable material is hard to synthesis. Our approach is utilizing the phase change property of eutectic/eutectoid materials. Triggered by heat, this type of material is possible to be directionally solidified into anisotropic structure, such as ordered lamellae and rods. We have surveyed the whole family of binary eutectic and eutectoid alloys and come up with a few good candidates for thermal switching applications. Two of the materials we studied in this thesis are Cu-P-Ag alloy and Cu-P eutectic alloy. The experimental methods we use are directional solidification and Time-domain Thermo-reflectance (TDTR) measurement. We have achieved large area of ordered lamellar structure up to hundreds of micron meters using Cu-P eutectic alloy. We include a few modern techniques to study the composition of both materials, which could be applied to other candidates for this type of application. The thermal conductivities of both materials are measured using TDTR. The Cu-P-Ag alloy and Cu-P eutectic alloy have thermal conductivity of 13.34 W/mK and 8.23 W/mK respectively. The theoretical estimation of thermal conductivity of Cu-P-Ag is around 40 W/mK, and the theoretical estimation for Cu-P eutectic alloy is around 200 W/mK. Both of our measured values are a little off from our estimated thermal conductivity of composite alloys, but the directional solidified alloys of these types were not measured before. It may due to the fact of surface reaction of our alloys with the environment and caused oxidation and contamination, and TDTR is a surface sensitive technique for thermal conductivity measurement. Other possible thermal measurements like Scanning Thermal Microscopy (SThM) and 3-omega thermal measurement should be included as a comparison in future.","Submission published under a 24 month embargo labeled 'Closed Access', the embargo will last until 2019-12-01","The student, Xuejiao Li, accepted the attached license on 2017-12-11 at 20:46.","The student, Xuejiao Li, submitted this Thesis for approval on 2017-12-11 at 20:55.","This Thesis was approved for publication on 2017-12-12 at 12:45.","DSpace SAF Submission Ingestion Package generated from Vireo submission #11949 on 2018-03-13 at 10:38:17","Made available in DSpace on 2018-03-13T17:35:55Z (GMT). No. of bitstreams: 2 LI-THESIS-2017.pdf: 10197733 bytes, checksum: b17d20060a374db554bd01f5037d3057 (MD5) LICENSE.txt: 4207 bytes, checksum: 1dae322b9721001d449c1423742faada (MD5) Previous issue date: 2017-12-12","Embargo set by: Seth Robbins for item 105499 Lift date: 2020-03-13T17:36:05Z Reason: Author requested closed access (OA after 2yrs) in Vireo ETD system","Limited Restriction Lifted for Item 105499 on 2020-03-14T09:15:08Z."]},{"key":"dc:format","label":"Dc Format","values":["application/pdf"]},{"key":"dc:title","label":"Title","values":["Autonomic thermal switch based on phase transition alloys"]}]}],"canonical_facts":{"dc:contributor":["Braun, Paul V."],"dc:creator":["Li, Xuejiao"],"dc:date":["2018-03-13T17:35:55Z","2020-03-14T09:15:08Z","2017-12-12","2017-12"],"dc:description":["Thermal management opens the new era of next generation electronic and thermal devices. Research on nano-scaled autonomic thermal switching is lacking because the suitable material is hard to synthesis. Our approach is utilizing the phase change property of eutectic/eutectoid materials. Triggered by heat, this type of material is possible to be directionally solidified into anisotropic structure, such as ordered lamellae and rods. We have surveyed the whole family of binary eutectic and eutectoid alloys and come up with a few good candidates for thermal switching applications. Two of the materials we studied in this thesis are Cu-P-Ag alloy and Cu-P eutectic alloy. The experimental methods we use are directional solidification and Time-domain Thermo-reflectance (TDTR) measurement. We have achieved large area of ordered lamellar structure up to hundreds of micron meters using Cu-P eutectic alloy. We include a few modern techniques to study the composition of both materials, which could be applied to other candidates for this type of application. The thermal conductivities of both materials are measured using TDTR. The Cu-P-Ag alloy and Cu-P eutectic alloy have thermal conductivity of 13.34 W/mK and 8.23 W/mK respectively. The theoretical estimation of thermal conductivity of Cu-P-Ag is around 40 W/mK, and the theoretical estimation for Cu-P eutectic alloy is around 200 W/mK. Both of our measured values are a little off from our estimated thermal conductivity of composite alloys, but the directional solidified alloys of these types were not measured before. It may due to the fact of surface reaction of our alloys with the environment and caused oxidation and contamination, and TDTR is a surface sensitive technique for thermal conductivity measurement. Other possible thermal measurements like Scanning Thermal Microscopy (SThM) and 3-omega thermal measurement should be included as a comparison in future.","Submission published under a 24 month embargo labeled 'Closed Access', the embargo will last until 2019-12-01","The student, Xuejiao Li, accepted the attached license on 2017-12-11 at 20:46.","The student, Xuejiao Li, submitted this Thesis for approval on 2017-12-11 at 20:55.","This Thesis was approved for publication on 2017-12-12 at 12:45.","DSpace SAF Submission Ingestion Package generated from Vireo submission #11949 on 2018-03-13 at 10:38:17","Made available in DSpace on 2018-03-13T17:35:55Z (GMT). No. of bitstreams: 2 LI-THESIS-2017.pdf: 10197733 bytes, checksum: b17d20060a374db554bd01f5037d3057 (MD5) LICENSE.txt: 4207 bytes, checksum: 1dae322b9721001d449c1423742faada (MD5) Previous issue date: 2017-12-12","Embargo set by: Seth Robbins for item 105499 Lift date: 2020-03-13T17:36:05Z Reason: Author requested closed access (OA after 2yrs) in Vireo ETD system","Limited Restriction Lifted for Item 105499 on 2020-03-14T09:15:08Z."],"dc:format":["application/pdf"],"dc:identifier":["http://hdl.handle.net/2142/99530"],"dc:language":["en"],"dc:rights":["Copyright 2017 Xuejiao Li"],"dc:subject":["Eutectic","Eutectoid"],"dc:title":["Autonomic thermal switch based on phase transition alloys"],"dc:type":["text"],"thesis:degree_discipline":["Materials Science & Engr"],"thesis:degree_level":["Thesis"],"thesis:degree_name":["M.S."],"thesis:institution_name":["University of Illinois at Urbana-Champaign"]},"updated_at":"2026-07-22T22:24:37Z"}