{"id":{"repo_id":"uiuc","oai_identifier":"oai:www.ideals.illinois.edu:2142/99120"},"canonical_url":"https://search.dev.ndltd.org/etd/uiuc/oai:www.ideals.illinois.edu:2142/99120","repository":{"repo_id":"uiuc","name":"University of Illinois - Urbana-Champaign","base_url":"https://www.ideals.illinois.edu/oai-pmh"},"display":{"title":"Near-field wireless power transfer to and communication with chip-scale devices","abstract":"Submission published under a 24 month embargo labeled 'U of I Access', the embargo will last until 2019-08-01","abstract_html":"Submission published under a 24 month embargo labeled 'U of I Access', the embargo will last until 2019-08-01","abstract_has_math":false,"creators":["Arakawa, Brandon E"],"institution":"University of Illinois at Urbana-Champaign","degree_name":"M.S.","degree_level":"Thesis","degree_discipline":"Electrical & Computer Engr","degree_department":null,"school":null,"contributors":["Gong, Songbin"],"advisors":[],"committee_chairs":[],"committee_members":[],"year":2018,"date_issued":"2018-03-02T19:59:45Z","date_published":"2018-03-02T19:59:45Z","updated_at":"2026-07-22T22:24:37Z","subjects":["Wireless power transfer","Energy harvesting","Rectifiers"],"languages":["en"],"rights":["Copyright 2017 Brandon Arakawa"],"rights_urls":[],"identifier_entries":[]},"links":{"outbound_url":"http://hdl.handle.net/2142/99120","outbound_label":"Handle","outbound_source":"dc:identifier"},"metadata_groups":[{"id":"people","label":"People","entries":[{"key":"dc:contributor","label":"Contributor","values":["Gong, Songbin"]},{"key":"dc:creator","label":"Author","values":["Arakawa, Brandon E"]}]},{"id":"academic_context","label":"Academic Context","entries":[{"key":"dc:date","label":"Dc Date","values":["2018-03-02T19:59:45Z","2020-03-03T10:15:22Z","2017-07-19","2017-08"]},{"key":"dc:type","label":"Dc Type","values":["text"]},{"key":"thesis:degree_discipline","label":"Discipline","values":["Electrical & Computer Engr"]},{"key":"thesis:degree_level","label":"Degree Level","values":["Thesis"]},{"key":"thesis:degree_name","label":"Degree Name","values":["M.S."]},{"key":"thesis:institution_name","label":"Thesis Institution Name","values":["University of Illinois at Urbana-Champaign"]}]},{"id":"subjects_keywords","label":"Subjects and Keywords","entries":[{"key":"dc:subject","label":"Dc Subject","values":["Wireless power transfer","Energy harvesting","Rectifiers"]}]},{"id":"language_rights","label":"Language and Rights","entries":[{"key":"dc:language","label":"Dc Language","values":["en"]},{"key":"dc:rights","label":"Dc Rights","values":["Copyright 2017 Brandon Arakawa"]}]},{"id":"identifiers","label":"Identifiers","entries":[{"key":"dc:identifier","label":"Identifier","values":["http://hdl.handle.net/2142/99120"]}]},{"id":"additional","label":"Additional Metadata","entries":[{"key":"dc:description","label":"Description","values":["Submission published under a 24 month embargo labeled 'U of I Access', the embargo will last until 2019-08-01","The student, Brandon Arakawa, accepted the attached license on 2017-07-19 at 15:34.","The student, Brandon Arakawa, submitted this Thesis for approval on 2017-07-19 at 15:37.","This Thesis was approved for publication on 2017-07-19 at 16:39.","DSpace SAF Submission Ingestion Package generated from Vireo submission #11514 on 2018-03-02 at 13:02:31","Made available in DSpace on 2018-03-02T19:59:45Z (GMT). No. of bitstreams: 2 ARAKAWA-THESIS-2017.pdf: 3126169 bytes, checksum: b7d1ccc74be5cefa2c84f500c5dda5ff (MD5) LICENSE.txt: 4212 bytes, checksum: 7a0bf09f56b9b1225c0604ea4c981758 (MD5) Previous issue date: 2017-07-19","Embargo set by: Seth Robbins for item 105074 Lift date: 2020-03-02T19:59:52Z Reason: Author requested U of Illinois access only (OA after 2yrs) in Vireo ETD system","This thesis addresses the design challenges of achieving simultaneous near-field wireless power transfer to and communication with chip-scale devices that have a form factor on the order of 100s of microns and a thickness of 10s of microns. One application that requires this technology is the supply chain security for electronic components, in which a wireless chip-scale device is embedded within the package of a host electronic component in order to verify the provenance of the host as it passes through the supply chain. The need for wireless capabilities in such an application arises from the small form factor of the chip-scale device and its lack of space for a battery, while the authentication process for security assurance requires wireless data communication with the chip-scale device. Simultaneously achieving both capabilities involves the co-design of both the power and data transceivers with an optimized near-field coupling scheme. The organization of the thesis is as follows. Chapter 2 covers electromagnetic coupling theory to achieve wireless power transfer. A tri-coil design approach is introduced to improve the wireless power transfer efficiency of the link compared to traditional two-coil designs. The design is verified using simulated and measured results. Additionally, a certain kind of circuit is required to enable a chip-scale device to support simultaneous power and communication. Chapter 3 presents a rectifier topology that achieves this purpose, and a prototype circuit is fabricated and measured to validate the design concepts. Finally, in order for a chip-scale device to be commercially viable, it needs to be compatible with standard CMOS fabrication processes. Chapter 4 discusses design strategies and procedures for multiple CMOS-compatible circuits for chip-scale simultaneous wireless power transfer and communication applications.","Embargo set by: Seth Robbins for item 105074 Lift date: 2020-03-02T20:02:46Z Reason: Author requested U of Illinois access only (OA after 2yrs) in Vireo ETD system","U of I Only Restriction Lifted for Item 105074 on 2020-03-03T10:15:22Z."]},{"key":"dc:format","label":"Dc Format","values":["application/pdf"]},{"key":"dc:title","label":"Title","values":["Near-field wireless power transfer to and communication with chip-scale devices"]}]}],"canonical_facts":{"dc:contributor":["Gong, Songbin"],"dc:creator":["Arakawa, Brandon E"],"dc:date":["2018-03-02T19:59:45Z","2020-03-03T10:15:22Z","2017-07-19","2017-08"],"dc:description":["Submission published under a 24 month embargo labeled 'U of I Access', the embargo will last until 2019-08-01","The student, Brandon Arakawa, accepted the attached license on 2017-07-19 at 15:34.","The student, Brandon Arakawa, submitted this Thesis for approval on 2017-07-19 at 15:37.","This Thesis was approved for publication on 2017-07-19 at 16:39.","DSpace SAF Submission Ingestion Package generated from Vireo submission #11514 on 2018-03-02 at 13:02:31","Made available in DSpace on 2018-03-02T19:59:45Z (GMT). No. of bitstreams: 2 ARAKAWA-THESIS-2017.pdf: 3126169 bytes, checksum: b7d1ccc74be5cefa2c84f500c5dda5ff (MD5) LICENSE.txt: 4212 bytes, checksum: 7a0bf09f56b9b1225c0604ea4c981758 (MD5) Previous issue date: 2017-07-19","Embargo set by: Seth Robbins for item 105074 Lift date: 2020-03-02T19:59:52Z Reason: Author requested U of Illinois access only (OA after 2yrs) in Vireo ETD system","This thesis addresses the design challenges of achieving simultaneous near-field wireless power transfer to and communication with chip-scale devices that have a form factor on the order of 100s of microns and a thickness of 10s of microns. One application that requires this technology is the supply chain security for electronic components, in which a wireless chip-scale device is embedded within the package of a host electronic component in order to verify the provenance of the host as it passes through the supply chain. The need for wireless capabilities in such an application arises from the small form factor of the chip-scale device and its lack of space for a battery, while the authentication process for security assurance requires wireless data communication with the chip-scale device. Simultaneously achieving both capabilities involves the co-design of both the power and data transceivers with an optimized near-field coupling scheme. The organization of the thesis is as follows. Chapter 2 covers electromagnetic coupling theory to achieve wireless power transfer. A tri-coil design approach is introduced to improve the wireless power transfer efficiency of the link compared to traditional two-coil designs. The design is verified using simulated and measured results. Additionally, a certain kind of circuit is required to enable a chip-scale device to support simultaneous power and communication. Chapter 3 presents a rectifier topology that achieves this purpose, and a prototype circuit is fabricated and measured to validate the design concepts. Finally, in order for a chip-scale device to be commercially viable, it needs to be compatible with standard CMOS fabrication processes. Chapter 4 discusses design strategies and procedures for multiple CMOS-compatible circuits for chip-scale simultaneous wireless power transfer and communication applications.","Embargo set by: Seth Robbins for item 105074 Lift date: 2020-03-02T20:02:46Z Reason: Author requested U of Illinois access only (OA after 2yrs) in Vireo ETD system","U of I Only Restriction Lifted for Item 105074 on 2020-03-03T10:15:22Z."],"dc:format":["application/pdf"],"dc:identifier":["http://hdl.handle.net/2142/99120"],"dc:language":["en"],"dc:rights":["Copyright 2017 Brandon Arakawa"],"dc:subject":["Wireless power transfer","Energy harvesting","Rectifiers"],"dc:title":["Near-field wireless power transfer to and communication with chip-scale devices"],"dc:type":["text"],"thesis:degree_discipline":["Electrical & Computer Engr"],"thesis:degree_level":["Thesis"],"thesis:degree_name":["M.S."],"thesis:institution_name":["University of Illinois at Urbana-Champaign"]},"updated_at":"2026-07-22T22:24:37Z"}