{"id":{"repo_id":"uiuc","oai_identifier":"oai:www.ideals.illinois.edu:2142/95323"},"canonical_url":"https://search.dev.ndltd.org/etd/uiuc/oai:www.ideals.illinois.edu:2142/95323","repository":{"repo_id":"uiuc","name":"University of Illinois - Urbana-Champaign","base_url":"https://www.ideals.illinois.edu/oai-pmh"},"display":{"title":"Multiphysics modeling and simulation for large-scale integrated circuits","abstract":"This dissertation is a process of seeking solutions to two important and challenging problems related to the design of modern integrated circuits (ICs): the ever increasing couplings among the multiphysics and the large problem size arising from the escalating complexity of the designs. A multiphysics-based computer-aided design methodology is proposed and realized to address multiple aspects of a design simultaneously, which include electromagnetics, heat transfer, fluid dynamics, and structure mechanics. The multiphysics simulation is based on the finite element method for its unmatched capabilities in handling complicate geometries and material properties. The capability of the multiphysics simulation is demonstrated through its applications in a variety of important problems, including the static and dynamic IR-drop analyses of power distribution networks, the thermal-ware high-frequency characterization of through-silicon-via structures, the full-wave electromagnetic analysis of high-power RF/microwave circuits, the modeling and analysis of three-dimensional ICs with integrated microchannel cooling, the characterization of micro- and nanoscale electrical-mechanical systems, and the modeling of decoupling capacitor derating in the power integrity simulations. To perform the large-scale analysis in a highly efficient manner, a domain decomposition scheme, parallel computing, and an adaptive time-stepping scheme are incorporated into the proposed multiphysics simulation. Significant reduction in computation time is achieved through the two numerical schemes and the parallel computing with multiple processors.","abstract_html":"This dissertation is a process of seeking solutions to two important and challenging problems related to the design of modern integrated circuits (ICs): the ever increasing couplings among the multiphysics and the large problem size arising from the escalating complexity of the designs. A multiphysics-based computer-aided design methodology is proposed and realized to address multiple aspects of a design simultaneously, which include electromagnetics, heat transfer, fluid dynamics, and structure mechanics. The multiphysics simulation is based on the finite element method for its unmatched capabilities in handling complicate geometries and material properties. The capability of the multiphysics simulation is demonstrated through its applications in a variety of important problems, including the static and dynamic IR-drop analyses of power distribution networks, the thermal-ware high-frequency characterization of through-silicon-via structures, the full-wave electromagnetic analysis of high-power RF/microwave circuits, the modeling and analysis of three-dimensional ICs with integrated microchannel cooling, the characterization of micro- and nanoscale electrical-mechanical systems, and the modeling of decoupling capacitor derating in the power integrity simulations. To perform the large-scale analysis in a highly efficient manner, a domain decomposition scheme, parallel computing, and an adaptive time-stepping scheme are incorporated into the proposed multiphysics simulation. Significant reduction in computation time is achieved through the two numerical schemes and the parallel computing with multiple processors.","abstract_has_math":false,"creators":["Lu, Tianjian"],"institution":"University of Illinois at Urbana-Champaign","degree_name":"Ph.D.","degree_level":"Dissertation","degree_discipline":"Electrical & Computer Engr","degree_department":null,"school":null,"contributors":["Jin, Jianming","Schutt-Ainé, José E.","Godddard, Lynford L.","Geubelle, Philippe H."],"advisors":[],"committee_chairs":[],"committee_members":[],"year":2017,"date_issued":"2017-03-01T15:48:49Z","date_published":"2017-03-01T15:48:49Z","updated_at":"2026-07-22T22:26:37Z","subjects":["Thermal stress","Multiphysics","Integrated circuits","Electromagnetics","Heat transfer","Conjugate heat transfer","Electrical-thermal","Microchannel cooling","Coupled electrical-thermal-mechanical","Finite element method","Domain decomposition","Parallel computing"],"languages":["en"],"rights":["Copyright 2016 Tianjian Lu"],"rights_urls":[],"identifier_entries":[]},"links":{"outbound_url":"http://hdl.handle.net/2142/95323","outbound_label":"Handle","outbound_source":"dc:identifier"},"metadata_groups":[{"id":"people","label":"People","entries":[{"key":"dc:contributor","label":"Contributor","values":["Jin, Jianming","Schutt-Ainé, José E.","Godddard, Lynford L.","Geubelle, Philippe H."]},{"key":"dc:creator","label":"Author","values":["Lu, Tianjian"]}]},{"id":"academic_context","label":"Academic Context","entries":[{"key":"dc:date","label":"Dc Date","values":["2017-03-01T15:48:49Z","2016-11-21","2016-12"]},{"key":"dc:type","label":"Dc Type","values":["text"]},{"key":"thesis:degree_discipline","label":"Discipline","values":["Electrical & Computer Engr"]},{"key":"thesis:degree_level","label":"Degree Level","values":["Dissertation"]},{"key":"thesis:degree_name","label":"Degree Name","values":["Ph.D."]},{"key":"thesis:institution_name","label":"Thesis Institution Name","values":["University of Illinois at Urbana-Champaign"]}]},{"id":"subjects_keywords","label":"Subjects and Keywords","entries":[{"key":"dc:subject","label":"Dc Subject","values":["Thermal stress","Multiphysics","Integrated circuits","Electromagnetics","Heat transfer","Conjugate heat transfer","Electrical-thermal","Microchannel cooling","Coupled electrical-thermal-mechanical","Finite element method","Domain decomposition","Parallel computing"]}]},{"id":"language_rights","label":"Language and Rights","entries":[{"key":"dc:language","label":"Dc Language","values":["en"]},{"key":"dc:rights","label":"Dc Rights","values":["Copyright 2016 Tianjian Lu"]}]},{"id":"identifiers","label":"Identifiers","entries":[{"key":"dc:identifier","label":"Identifier","values":["http://hdl.handle.net/2142/95323"]}]},{"id":"additional","label":"Additional Metadata","entries":[{"key":"dc:description","label":"Description","values":["This dissertation is a process of seeking solutions to two important and challenging problems related to the design of modern integrated circuits (ICs): the ever increasing couplings among the multiphysics and the large problem size arising from the escalating complexity of the designs. A multiphysics-based computer-aided design methodology is proposed and realized to address multiple aspects of a design simultaneously, which include electromagnetics, heat transfer, fluid dynamics, and structure mechanics. The multiphysics simulation is based on the finite element method for its unmatched capabilities in handling complicate geometries and material properties. The capability of the multiphysics simulation is demonstrated through its applications in a variety of important problems, including the static and dynamic IR-drop analyses of power distribution networks, the thermal-ware high-frequency characterization of through-silicon-via structures, the full-wave electromagnetic analysis of high-power RF/microwave circuits, the modeling and analysis of three-dimensional ICs with integrated microchannel cooling, the characterization of micro- and nanoscale electrical-mechanical systems, and the modeling of decoupling capacitor derating in the power integrity simulations. To perform the large-scale analysis in a highly efficient manner, a domain decomposition scheme, parallel computing, and an adaptive time-stepping scheme are incorporated into the proposed multiphysics simulation. Significant reduction in computation time is achieved through the two numerical schemes and the parallel computing with multiple processors.","Submission original under an indefinite embargo labeled 'Open Access'. The submission was exported from vireo on 2017-02-28 without embargo terms","The student, Tianjian Lu, accepted the attached license on 2016-11-16 at 12:38.","The student, Tianjian Lu, submitted this Dissertation for approval on 2016-11-16 at 12:59.","This Dissertation was approved for publication on 2016-11-21 at 15:33.","DSpace SAF Submission Ingestion Package generated from Vireo submission #10255 on 2017-02-28 at 14:47:43","Made available in DSpace on 2017-03-01T15:48:49Z (GMT). No. of bitstreams: 4 LU-DISSERTATION-2016.pdf: 23812500 bytes, checksum: 326c51027d9bfa25c87a48414e016c8e (MD5) TianjianLU_PhD_2016.zip: 152363727 bytes, checksum: f412cee513c289dd874c33e11f361439 (MD5) LICENSE.txt: 4208 bytes, checksum: a86bb04ca8419cd369a200f7144ba7ae (MD5) PROQUEST_LICENSE.txt: 4554 bytes, checksum: cd71c8d1770238e49c92a693cee1ba18 (MD5) Previous issue date: 2016-11-21"]},{"key":"dc:format","label":"Dc Format","values":["application/pdf"]},{"key":"dc:title","label":"Title","values":["Multiphysics modeling and simulation for large-scale integrated circuits"]}]}],"canonical_facts":{"dc:contributor":["Jin, Jianming","Schutt-Ainé, José E.","Godddard, Lynford L.","Geubelle, Philippe H."],"dc:creator":["Lu, Tianjian"],"dc:date":["2017-03-01T15:48:49Z","2016-11-21","2016-12"],"dc:description":["This dissertation is a process of seeking solutions to two important and challenging problems related to the design of modern integrated circuits (ICs): the ever increasing couplings among the multiphysics and the large problem size arising from the escalating complexity of the designs. A multiphysics-based computer-aided design methodology is proposed and realized to address multiple aspects of a design simultaneously, which include electromagnetics, heat transfer, fluid dynamics, and structure mechanics. The multiphysics simulation is based on the finite element method for its unmatched capabilities in handling complicate geometries and material properties. The capability of the multiphysics simulation is demonstrated through its applications in a variety of important problems, including the static and dynamic IR-drop analyses of power distribution networks, the thermal-ware high-frequency characterization of through-silicon-via structures, the full-wave electromagnetic analysis of high-power RF/microwave circuits, the modeling and analysis of three-dimensional ICs with integrated microchannel cooling, the characterization of micro- and nanoscale electrical-mechanical systems, and the modeling of decoupling capacitor derating in the power integrity simulations. To perform the large-scale analysis in a highly efficient manner, a domain decomposition scheme, parallel computing, and an adaptive time-stepping scheme are incorporated into the proposed multiphysics simulation. Significant reduction in computation time is achieved through the two numerical schemes and the parallel computing with multiple processors.","Submission original under an indefinite embargo labeled 'Open Access'. The submission was exported from vireo on 2017-02-28 without embargo terms","The student, Tianjian Lu, accepted the attached license on 2016-11-16 at 12:38.","The student, Tianjian Lu, submitted this Dissertation for approval on 2016-11-16 at 12:59.","This Dissertation was approved for publication on 2016-11-21 at 15:33.","DSpace SAF Submission Ingestion Package generated from Vireo submission #10255 on 2017-02-28 at 14:47:43","Made available in DSpace on 2017-03-01T15:48:49Z (GMT). No. of bitstreams: 4 LU-DISSERTATION-2016.pdf: 23812500 bytes, checksum: 326c51027d9bfa25c87a48414e016c8e (MD5) TianjianLU_PhD_2016.zip: 152363727 bytes, checksum: f412cee513c289dd874c33e11f361439 (MD5) LICENSE.txt: 4208 bytes, checksum: a86bb04ca8419cd369a200f7144ba7ae (MD5) PROQUEST_LICENSE.txt: 4554 bytes, checksum: cd71c8d1770238e49c92a693cee1ba18 (MD5) Previous issue date: 2016-11-21"],"dc:format":["application/pdf"],"dc:identifier":["http://hdl.handle.net/2142/95323"],"dc:language":["en"],"dc:rights":["Copyright 2016 Tianjian Lu"],"dc:subject":["Thermal stress","Multiphysics","Integrated circuits","Electromagnetics","Heat transfer","Conjugate heat transfer","Electrical-thermal","Microchannel cooling","Coupled electrical-thermal-mechanical","Finite element method","Domain decomposition","Parallel computing"],"dc:title":["Multiphysics modeling and simulation for large-scale integrated circuits"],"dc:type":["text"],"thesis:degree_discipline":["Electrical & Computer Engr"],"thesis:degree_level":["Dissertation"],"thesis:degree_name":["Ph.D."],"thesis:institution_name":["University of Illinois at Urbana-Champaign"]},"updated_at":"2026-07-22T22:26:37Z"}