{"id":{"repo_id":"uiuc","oai_identifier":"oai:www.ideals.illinois.edu:2142/87893"},"canonical_url":"https://search.dev.ndltd.org/etd/uiuc/oai:www.ideals.illinois.edu:2142/87893","repository":{"repo_id":"uiuc","name":"University of Illinois - Urbana-Champaign","base_url":"https://www.ideals.illinois.edu/oai-pmh"},"display":{"title":"Design and Materials Applications of Quadruply Hydrogen-Bonding Modules","abstract":"In Chapter 4, the application of the DeUG˙DAN heterocomplex in the arena of surface chemistry is described. Several types of siliceous surfaces and nanoparticles, and polymer beads were covalently modified to bear DeUG. These surfaces were characterized by a number of complementary surface analysis techniques, such as AFM, SIMS and XPS. Self-assembly of DAN and DAN-functionalized polymers on these materials was demonstrated. Additionally, the application of these functionalized surfaces and polymers as interfacial adhesion promoters is described.","abstract_html":"In Chapter 4, the application of the DeUG˙DAN heterocomplex in the arena of surface chemistry is described. Several types of siliceous surfaces and nanoparticles, and polymer beads were covalently modified to bear DeUG. These surfaces were characterized by a number of complementary surface analysis techniques, such as AFM, SIMS and XPS. Self-assembly of DAN and DAN-functionalized polymers on these materials was demonstrated. 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