{"id":{"repo_id":"uiuc","oai_identifier":"oai:www.ideals.illinois.edu:2142/87748"},"canonical_url":"https://search.dev.ndltd.org/etd/uiuc/oai:www.ideals.illinois.edu:2142/87748","repository":{"repo_id":"uiuc","name":"University of Illinois - Urbana-Champaign","base_url":"https://www.ideals.illinois.edu/oai-pmh"},"display":{"title":"Residual Stress Development and Effect on the Piezoelectric Performance of Sol -Gel Derived Lead Zirconate Titanate (Pzt) Thin Films","abstract":"Additionally two patterning methods, traditional chemical wet-etching and a novel soft lithographic technique, are explored as a means to reduce residual stress within film features. For the soft lithographic technique, film features are created by selective film cracking, a result of poor substrate adhesion promoted by a mediated, self-assembled monolayer. Wafer curvature stress measurements and DIC-based strain measurements of mediated monolayer patterned features reveal that the in-plane stress/strain development is reduced compared to the blanket film case. Critical in-plane strains at crack initiation are also measured using a new digital image correlation technique, in which fluorescent nanoparticles (c.a. 140 nm) provide the speckle pattern. A corresponding increase in the field induced displacements is observed for the film features with reduced residual stress. Overall, the piezoelectric performance of the films is highly dependent on the residual stress in the films and can be enhanced significantly by a reduction in this stress through film patterning.","abstract_html":"Additionally two patterning methods, traditional chemical wet-etching and a novel soft lithographic technique, are explored as a means to reduce residual stress within film features. For the soft lithographic technique, film features are created by selective film cracking, a result of poor substrate adhesion promoted by a mediated, self-assembled monolayer. Wafer curvature stress measurements and DIC-based strain measurements of mediated monolayer patterned features reveal that the in-plane stress/strain development is reduced compared to the blanket film case. Critical in-plane strains at crack initiation are also measured using a new digital image correlation technique, in which fluorescent nanoparticles (c.a. 140 nm) provide the speckle pattern. A corresponding increase in the field induced displacements is observed for the film features with reduced residual stress. Overall, the piezoelectric performance of the films is highly dependent on the residual stress in the films and can be enhanced significantly by a reduction in this stress through film patterning.","abstract_has_math":false,"creators":["Berfield, Thomas A."],"institution":"University of Illinois at Urbana-Champaign","degree_name":"Ph.D.","degree_level":"Dissertation","degree_discipline":"Theoretical and Applied Mechanics","degree_department":null,"school":null,"contributors":["Sottos, Nancy R."],"advisors":[],"committee_chairs":[],"committee_members":[],"year":2015,"date_issued":"2015-09-28T16:23:48Z","date_published":"2015-09-28T16:23:48Z","updated_at":"2026-07-22T22:26:30Z","subjects":["Engineering, Materials Science"],"languages":["eng"],"rights":[],"rights_urls":[],"identifier_entries":[{"key":"dc:identifier","label":"Identifier","values":["(MiAaPQ)AAI3314731"],"render_values":[{"text":"(MiAaPQ)AAI3314731","href":null,"code":true}]}]},"links":{"outbound_url":"http://hdl.handle.net/2142/87748","outbound_label":"Handle","outbound_source":"dc:identifier"},"metadata_groups":[{"id":"people","label":"People","entries":[{"key":"dc:contributor","label":"Contributor","values":["Sottos, Nancy R."]},{"key":"dc:creator","label":"Author","values":["Berfield, Thomas A."]}]},{"id":"academic_context","label":"Academic Context","entries":[{"key":"dc:date","label":"Dc Date","values":["2015-09-28T16:23:48Z","10000-01-01","2008"]},{"key":"dc:type","label":"Dc Type","values":["text"]},{"key":"thesis:degree_discipline","label":"Discipline","values":["Theoretical and Applied Mechanics"]},{"key":"thesis:degree_level","label":"Degree Level","values":["Dissertation"]},{"key":"thesis:degree_name","label":"Degree Name","values":["Ph.D."]},{"key":"thesis:institution_name","label":"Thesis Institution Name","values":["University of Illinois at Urbana-Champaign"]}]},{"id":"subjects_keywords","label":"Subjects and Keywords","entries":[{"key":"dc:subject","label":"Dc Subject","values":["Engineering, Materials Science"]}]},{"id":"language_rights","label":"Language and Rights","entries":[{"key":"dc:language","label":"Dc Language","values":["eng"]}]},{"id":"identifiers","label":"Identifiers","entries":[{"key":"dc:identifier","label":"Identifier","values":["http://hdl.handle.net/2142/87748","(MiAaPQ)AAI3314731"]}]},{"id":"additional","label":"Additional Metadata","entries":[{"key":"dc:description","label":"Description","values":["Additionally two patterning methods, traditional chemical wet-etching and a novel soft lithographic technique, are explored as a means to reduce residual stress within film features. For the soft lithographic technique, film features are created by selective film cracking, a result of poor substrate adhesion promoted by a mediated, self-assembled monolayer. Wafer curvature stress measurements and DIC-based strain measurements of mediated monolayer patterned features reveal that the in-plane stress/strain development is reduced compared to the blanket film case. Critical in-plane strains at crack initiation are also measured using a new digital image correlation technique, in which fluorescent nanoparticles (c.a. 140 nm) provide the speckle pattern. A corresponding increase in the field induced displacements is observed for the film features with reduced residual stress. Overall, the piezoelectric performance of the films is highly dependent on the residual stress in the films and can be enhanced significantly by a reduction in this stress through film patterning.","Made available in DSpace on 2015-09-28T16:23:48Z (GMT). No. of bitstreams: 2 license.txt: 4848 bytes, checksum: 96035ab3f5e1c23cc7138a224ce498bd (MD5) 3314731.pdf: 12732792 bytes, checksum: 885ce757e79d1b15d41e2bd689166567 (MD5) Previous issue date: 2008","Embargo set by: Seth Robbins for item 89029 Lift date: Forever Reason: Restricted to the U of I community idenfinitely during batch ingest of legacy ETDs","Restricted to the U of I community idenfinitely during batch ingest of legacy ETDs","U of I Only","129 p.","Thesis (Ph.D.)--University of Illinois at Urbana-Champaign, 2008."]},{"key":"dc:title","label":"Title","values":["Residual Stress Development and Effect on the Piezoelectric Performance of Sol -Gel Derived Lead Zirconate Titanate (Pzt) Thin Films"]}]}],"canonical_facts":{"dc:contributor":["Sottos, Nancy R."],"dc:creator":["Berfield, Thomas A."],"dc:date":["2015-09-28T16:23:48Z","10000-01-01","2008"],"dc:description":["Additionally two patterning methods, traditional chemical wet-etching and a novel soft lithographic technique, are explored as a means to reduce residual stress within film features. For the soft lithographic technique, film features are created by selective film cracking, a result of poor substrate adhesion promoted by a mediated, self-assembled monolayer. Wafer curvature stress measurements and DIC-based strain measurements of mediated monolayer patterned features reveal that the in-plane stress/strain development is reduced compared to the blanket film case. Critical in-plane strains at crack initiation are also measured using a new digital image correlation technique, in which fluorescent nanoparticles (c.a. 140 nm) provide the speckle pattern. A corresponding increase in the field induced displacements is observed for the film features with reduced residual stress. Overall, the piezoelectric performance of the films is highly dependent on the residual stress in the films and can be enhanced significantly by a reduction in this stress through film patterning.","Made available in DSpace on 2015-09-28T16:23:48Z (GMT). No. of bitstreams: 2 license.txt: 4848 bytes, checksum: 96035ab3f5e1c23cc7138a224ce498bd (MD5) 3314731.pdf: 12732792 bytes, checksum: 885ce757e79d1b15d41e2bd689166567 (MD5) Previous issue date: 2008","Embargo set by: Seth Robbins for item 89029 Lift date: Forever Reason: Restricted to the U of I community idenfinitely during batch ingest of legacy ETDs","Restricted to the U of I community idenfinitely during batch ingest of legacy ETDs","U of I Only","129 p.","Thesis (Ph.D.)--University of Illinois at Urbana-Champaign, 2008."],"dc:identifier":["http://hdl.handle.net/2142/87748","(MiAaPQ)AAI3314731"],"dc:language":["eng"],"dc:subject":["Engineering, Materials Science"],"dc:title":["Residual Stress Development and Effect on the Piezoelectric Performance of Sol -Gel Derived Lead Zirconate Titanate (Pzt) Thin Films"],"dc:type":["text"],"thesis:degree_discipline":["Theoretical and Applied Mechanics"],"thesis:degree_level":["Dissertation"],"thesis:degree_name":["Ph.D."],"thesis:institution_name":["University of Illinois at Urbana-Champaign"]},"updated_at":"2026-07-22T22:26:30Z"}