{"id":{"repo_id":"uiuc","oai_identifier":"oai:www.ideals.illinois.edu:2142/85937"},"canonical_url":"https://search.dev.ndltd.org/etd/uiuc/oai:www.ideals.illinois.edu:2142/85937","repository":{"repo_id":"uiuc","name":"University of Illinois - Urbana-Champaign","base_url":"https://www.ideals.illinois.edu/oai-pmh"},"display":{"title":"Multi-Scale Transport Phenomena in Low-Pressure Plasmas","abstract":"To account for the surface effects on the plasma behavior, a mesoscale Monte Carlo simulation has been developed which joins the die-scale surface chemistry with the plasma scale in the HPEM. The presence of etch products in the plasma is seen to perturb the bulk plasma. The presence of photoresist redeposition is seen to have a minor, but important, effect on the etch rate. 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