{"id":{"repo_id":"uiuc","oai_identifier":"oai:www.ideals.illinois.edu:2142/82916"},"canonical_url":"https://search.dev.ndltd.org/etd/uiuc/oai:www.ideals.illinois.edu:2142/82916","repository":{"repo_id":"uiuc","name":"University of Illinois - Urbana-Champaign","base_url":"https://www.ideals.illinois.edu/oai-pmh"},"display":{"title":"Heteroepitaxial Growth and Morphology of Thin Metal Films","abstract":"In the growth of Cu and Co bilayer nanostructures, a metastable fcc alloy was observed to form despite the well-established immiscibility of Cu and Co in the relevant temperature range &sim;600&deg;C. It is established in this study that the alloy forms during the epitaxial growth of Co on Cu by a surface pump mechanism that also creates remarkable microstructures in the form of volcano-like hills and caverns. In the deposition of Co at 500&deg;C, even on smooth flat Cu, pinholes assemble at the intersections of ripened islands which form domains of the two alternative fcc stackings, ABC &cdots; or ACB &cdots; . A driving force for alloying exists because the surface energy is reduced by 0.8 J/m2 when Cu covers Co. This free energy reduction pumps Cu from the covered Cu film, through the pinholes by surface diffusion, onto the outer surface of the Co, where it is trapped as metastable alloy by the Co flux from the evaporation source. The limited surface diffusion localizes the alloyed material close to the pinhole in a volcano-like profile. The removal of Cu leaves compact voids in the form of hexagonally facetted cavities directly beneath the volcanoes.","abstract_html":"In the growth of Cu and Co bilayer nanostructures, a metastable fcc alloy was observed to form despite the well-established immiscibility of Cu and Co in the relevant temperature range &amp;sim;600&amp;deg;C. It is established in this study that the alloy forms during the epitaxial growth of Co on Cu by a surface pump mechanism that also creates remarkable microstructures in the form of volcano-like hills and caverns. In the deposition of Co at 500&amp;deg;C, even on smooth flat Cu, pinholes assemble at the intersections of ripened islands which form domains of the two alternative fcc stackings, ABC &amp;cdots; or ACB &amp;cdots; . A driving force for alloying exists because the surface energy is reduced by 0.8 J/m2 when Cu covers Co. This free energy reduction pumps Cu from the covered Cu film, through the pinholes by surface diffusion, onto the outer surface of the Co, where it is trapped as metastable alloy by the Co flux from the evaporation source. The limited surface diffusion localizes the alloyed material close to the pinhole in a volcano-like profile. The removal of Cu leaves compact voids in the form of hexagonally facetted cavities directly beneath the volcanoes.","abstract_has_math":false,"creators":["Zhou, Guoliang"],"institution":"University of Illinois at Urbana-Champaign","degree_name":"Ph.D.","degree_level":"Dissertation","degree_discipline":"Materials Science and Engineering","degree_department":null,"school":null,"contributors":["Flynn, C.P."],"advisors":[],"committee_chairs":[],"committee_members":[],"year":2015,"date_issued":"2015-09-25T20:53:36Z","date_published":"2015-09-25T20:53:36Z","updated_at":"2026-07-22T22:26:20Z","subjects":["Physics, Condensed Matter"],"languages":["eng"],"rights":[],"rights_urls":[],"identifier_entries":[{"key":"dc:identifier","label":"Identifier","values":["(MiAaPQ)AAI9912439"],"render_values":[{"text":"(MiAaPQ)AAI9912439","href":null,"code":true}]}]},"links":{"outbound_url":"http://hdl.handle.net/2142/82916","outbound_label":"Handle","outbound_source":"dc:identifier"},"metadata_groups":[{"id":"people","label":"People","entries":[{"key":"dc:contributor","label":"Contributor","values":["Flynn, C.P."]},{"key":"dc:creator","label":"Author","values":["Zhou, Guoliang"]}]},{"id":"academic_context","label":"Academic Context","entries":[{"key":"dc:date","label":"Dc Date","values":["2015-09-25T20:53:36Z","10000-01-01","1998"]},{"key":"dc:type","label":"Dc Type","values":["text"]},{"key":"thesis:degree_discipline","label":"Discipline","values":["Materials Science and Engineering"]},{"key":"thesis:degree_level","label":"Degree Level","values":["Dissertation"]},{"key":"thesis:degree_name","label":"Degree Name","values":["Ph.D."]},{"key":"thesis:institution_name","label":"Thesis Institution Name","values":["University of Illinois at Urbana-Champaign"]}]},{"id":"subjects_keywords","label":"Subjects and Keywords","entries":[{"key":"dc:subject","label":"Dc Subject","values":["Physics, Condensed Matter"]}]},{"id":"language_rights","label":"Language and Rights","entries":[{"key":"dc:language","label":"Dc Language","values":["eng"]}]},{"id":"identifiers","label":"Identifiers","entries":[{"key":"dc:identifier","label":"Identifier","values":["http://hdl.handle.net/2142/82916","(MiAaPQ)AAI9912439"]}]},{"id":"additional","label":"Additional Metadata","entries":[{"key":"dc:description","label":"Description","values":["In the growth of Cu and Co bilayer nanostructures, a metastable fcc alloy was observed to form despite the well-established immiscibility of Cu and Co in the relevant temperature range &sim;600&deg;C. It is established in this study that the alloy forms during the epitaxial growth of Co on Cu by a surface pump mechanism that also creates remarkable microstructures in the form of volcano-like hills and caverns. In the deposition of Co at 500&deg;C, even on smooth flat Cu, pinholes assemble at the intersections of ripened islands which form domains of the two alternative fcc stackings, ABC &cdots; or ACB &cdots; . A driving force for alloying exists because the surface energy is reduced by 0.8 J/m2 when Cu covers Co. This free energy reduction pumps Cu from the covered Cu film, through the pinholes by surface diffusion, onto the outer surface of the Co, where it is trapped as metastable alloy by the Co flux from the evaporation source. The limited surface diffusion localizes the alloyed material close to the pinhole in a volcano-like profile. The removal of Cu leaves compact voids in the form of hexagonally facetted cavities directly beneath the volcanoes.","Made available in DSpace on 2015-09-25T20:53:36Z (GMT). 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It is established in this study that the alloy forms during the epitaxial growth of Co on Cu by a surface pump mechanism that also creates remarkable microstructures in the form of volcano-like hills and caverns. In the deposition of Co at 500&deg;C, even on smooth flat Cu, pinholes assemble at the intersections of ripened islands which form domains of the two alternative fcc stackings, ABC &cdots; or ACB &cdots; . A driving force for alloying exists because the surface energy is reduced by 0.8 J/m2 when Cu covers Co. This free energy reduction pumps Cu from the covered Cu film, through the pinholes by surface diffusion, onto the outer surface of the Co, where it is trapped as metastable alloy by the Co flux from the evaporation source. The limited surface diffusion localizes the alloyed material close to the pinhole in a volcano-like profile. The removal of Cu leaves compact voids in the form of hexagonally facetted cavities directly beneath the volcanoes.","Made available in DSpace on 2015-09-25T20:53:36Z (GMT). No. of bitstreams: 2 license.txt: 4848 bytes, checksum: 96035ab3f5e1c23cc7138a224ce498bd (MD5) 9912439.pdf: 4519300 bytes, checksum: 1eb739e0de4c86278f8a01fa8d5ee7ee (MD5) Previous issue date: 1998","Embargo set by: Seth Robbins for item 84197 Lift date: Forever Reason: Restricted to the U of I community idenfinitely during batch ingest of legacy ETDs","Restricted to the U of I community idenfinitely during batch ingest of legacy ETDs","U of I Only","212 p.","Thesis (Ph.D.)--University of Illinois at Urbana-Champaign, 1998."],"dc:identifier":["http://hdl.handle.net/2142/82916","(MiAaPQ)AAI9912439"],"dc:language":["eng"],"dc:subject":["Physics, Condensed Matter"],"dc:title":["Heteroepitaxial Growth and Morphology of Thin Metal Films"],"dc:type":["text"],"thesis:degree_discipline":["Materials Science and Engineering"],"thesis:degree_level":["Dissertation"],"thesis:degree_name":["Ph.D."],"thesis:institution_name":["University of Illinois at Urbana-Champaign"]},"updated_at":"2026-07-22T22:26:20Z"}