{"id":{"repo_id":"uiuc","oai_identifier":"oai:www.ideals.illinois.edu:2142/80938"},"canonical_url":"https://search.dev.ndltd.org/etd/uiuc/oai:www.ideals.illinois.edu:2142/80938","repository":{"repo_id":"uiuc","name":"University of Illinois - Urbana-Champaign","base_url":"https://www.ideals.illinois.edu/oai-pmh"},"display":{"title":"Microelectromechanical and Microfluidic Systems for Scanning Probe Lithography","abstract":"This work addresses two major challenges faced by traditional single-probe SPL technology---lithography throughput and probe coating technique. System-level improvements of SPL have been successfully achieved. First, micromachined, thermally actuated cantilever probe arrays are developed to improve the throughput and flexibility of SPL. Multiple distinct patterns have been generated simultaneously with sub-50-nm line width in dip pen nanolithography (DPN) mode. Then, development of scanning probe contact printing (SPCP) technology and multifunctional probe arrays has expanded the capability of conventional single-functional SPL and demonstrated an excellent example of a highly integrated scanning probe device for pattern generation in DPN and SPCP modes and pattern inspection in AFM and LFM modes. In addition, the development of integrated microfluidic inking chips for chemical ink handling and SPL probe treatment further enhances the power of arrayed scanning probes. The inking chip can potentially coat an array of SPL tips with different inks simultaneously for multi-ink lithography.","abstract_html":"This work addresses two major challenges faced by traditional single-probe SPL technology---lithography throughput and probe coating technique. System-level improvements of SPL have been successfully achieved. First, micromachined, thermally actuated cantilever probe arrays are developed to improve the throughput and flexibility of SPL. Multiple distinct patterns have been generated simultaneously with sub-50-nm line width in dip pen nanolithography (DPN) mode. Then, development of scanning probe contact printing (SPCP) technology and multifunctional probe arrays has expanded the capability of conventional single-functional SPL and demonstrated an excellent example of a highly integrated scanning probe device for pattern generation in DPN and SPCP modes and pattern inspection in AFM and LFM modes. In addition, the development of integrated microfluidic inking chips for chemical ink handling and SPL probe treatment further enhances the power of arrayed scanning probes. The inking chip can potentially coat an array of SPL tips with different inks simultaneously for multi-ink lithography.","abstract_has_math":false,"creators":["Wang, Xuefeng"],"institution":"University of Illinois at Urbana-Champaign","degree_name":"Ph.D.","degree_level":"Dissertation","degree_discipline":"Electrical Engineering","degree_department":null,"school":null,"contributors":["Chang Liu"],"advisors":[],"committee_chairs":[],"committee_members":[],"year":2015,"date_issued":"2015-09-25T20:08:55Z","date_published":"2015-09-25T20:08:55Z","updated_at":"2026-07-22T22:26:15Z","subjects":["Engineering, Electronics and Electrical"],"languages":["eng"],"rights":[],"rights_urls":[],"identifier_entries":[{"key":"dc:identifier","label":"Identifier","values":["(MiAaPQ)AAI3199167"],"render_values":[{"text":"(MiAaPQ)AAI3199167","href":null,"code":true}]}]},"links":{"outbound_url":"http://hdl.handle.net/2142/80938","outbound_label":"Handle","outbound_source":"dc:identifier"},"metadata_groups":[{"id":"people","label":"People","entries":[{"key":"dc:contributor","label":"Contributor","values":["Chang Liu"]},{"key":"dc:creator","label":"Author","values":["Wang, Xuefeng"]}]},{"id":"academic_context","label":"Academic Context","entries":[{"key":"dc:date","label":"Dc Date","values":["2015-09-25T20:08:55Z","10000-01-01","2005"]},{"key":"dc:type","label":"Dc Type","values":["text"]},{"key":"thesis:degree_discipline","label":"Discipline","values":["Electrical Engineering"]},{"key":"thesis:degree_level","label":"Degree Level","values":["Dissertation"]},{"key":"thesis:degree_name","label":"Degree Name","values":["Ph.D."]},{"key":"thesis:institution_name","label":"Thesis Institution Name","values":["University of Illinois at Urbana-Champaign"]}]},{"id":"subjects_keywords","label":"Subjects and Keywords","entries":[{"key":"dc:subject","label":"Dc Subject","values":["Engineering, Electronics and Electrical"]}]},{"id":"language_rights","label":"Language and Rights","entries":[{"key":"dc:language","label":"Dc Language","values":["eng"]}]},{"id":"identifiers","label":"Identifiers","entries":[{"key":"dc:identifier","label":"Identifier","values":["http://hdl.handle.net/2142/80938","(MiAaPQ)AAI3199167"]}]},{"id":"additional","label":"Additional Metadata","entries":[{"key":"dc:description","label":"Description","values":["This work addresses two major challenges faced by traditional single-probe SPL technology---lithography throughput and probe coating technique. 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