{"id":{"repo_id":"uiuc","oai_identifier":"oai:www.ideals.illinois.edu:2142/46758"},"canonical_url":"https://search.dev.ndltd.org/etd/uiuc/oai:www.ideals.illinois.edu:2142/46758","repository":{"repo_id":"uiuc","name":"University of Illinois - Urbana-Champaign","base_url":"https://www.ideals.illinois.edu/oai-pmh"},"display":{"title":"Heterogeneously bonded vertical cavity surface emitting lasers and thermal modeling","abstract":"Typically semiconductor materials used for photonic devices have been limited to those exhibiting a direct bandgap. In order to incorporate indirect bandgap and non-semiconducting materials, extensive research efforts have been put into developing hybrid photonic devices, which consist of different materials for the light emitting region and the substrate. In this dissertation, a post-fabrication bonding technique for integrating semiconductor vertical cavity surface emitting lasers (VCSELs) onto hybrid substrates is demonstrated. This approach provides flexibility regarding the choice of device fabrication and hybrid substrate materials. Light output versus injected current and applied voltage characteristics of lasers are measured before and after the transfer process. VCSEL arrays transferred onto Si substrate show that the transfer technique does not degrade the laser performance. VCSEL transfer onto a polyethylene terephthalate (PET) substrate allows for flexible arrays, but with degraded performance due to excessive thermal dissipation. A VCSEL array with an area of 1.0 x 1.2 mm2 is transferred onto a Cu substrate which has a higher thermal conductivity compared to both GaAs and PET. For the transfer bonding process, the final device yield is enhanced by including an etch stop layer in the epitaxial wafer. In order to study the effect of the thermal conductivity of the substrate on the dissipation of heat from the VCSELs, we present a simple VCSEL electro-thermal model, in which an agreement is obtained between simulation and experiment for lasing wavelength with varying laser diameter. Using this model, the thermal limitations of the VCSEL output on different substrates is discussed","abstract_html":"Typically semiconductor materials used for photonic devices have been limited to those exhibiting a direct bandgap. In order to incorporate indirect bandgap and non-semiconducting materials, extensive research efforts have been put into developing hybrid photonic devices, which consist of different materials for the light emitting region and the substrate. In this dissertation, a post-fabrication bonding technique for integrating semiconductor vertical cavity surface emitting lasers (VCSELs) onto hybrid substrates is demonstrated. This approach provides flexibility regarding the choice of device fabrication and hybrid substrate materials. Light output versus injected current and applied voltage characteristics of lasers are measured before and after the transfer process. VCSEL arrays transferred onto Si substrate show that the transfer technique does not degrade the laser performance. VCSEL transfer onto a polyethylene terephthalate (PET) substrate allows for flexible arrays, but with degraded performance due to excessive thermal dissipation. A VCSEL array with an area of 1.0 x 1.2 mm2 is transferred onto a Cu substrate which has a higher thermal conductivity compared to both GaAs and PET. For the transfer bonding process, the final device yield is enhanced by including an etch stop layer in the epitaxial wafer. In order to study the effect of the thermal conductivity of the substrate on the dissipation of heat from the VCSELs, we present a simple VCSEL electro-thermal model, in which an agreement is obtained between simulation and experiment for lasing wavelength with varying laser diameter. Using this model, the thermal limitations of the VCSEL output on different substrates is discussed","abstract_has_math":false,"creators":["Jeong, Hyejin"],"institution":"University of Illinois at Urbana-Champaign","degree_name":"Ph.D.","degree_level":"Dissertation","degree_discipline":"Electrical and Computer Engineering","degree_department":null,"school":null,"contributors":["Choquette, Kent D.","Goddard, Lynford L.","Kim, Kyekyoon","Rogers, John A."],"advisors":[],"committee_chairs":[],"committee_members":[],"year":2014,"date_issued":"2014-01-16T18:01:28Z","date_published":"2014-01-16T18:01:28Z","updated_at":"2026-07-22T22:25:36Z","subjects":["vertical cavity surface emitting lasers (VCSEL)","semiconductor","laser","fabrication","hybrid","electro-thermal","modeling","COMSOL","bonding","heterogeneous substrate"],"languages":["en"],"rights":["Copyright 2013 Hyejin Jeong"],"rights_urls":[],"identifier_entries":[]},"links":{"outbound_url":"http://hdl.handle.net/2142/46758","outbound_label":"Handle","outbound_source":"dc:identifier"},"metadata_groups":[{"id":"people","label":"People","entries":[{"key":"dc:contributor","label":"Contributor","values":["Choquette, Kent D.","Goddard, Lynford L.","Kim, Kyekyoon","Rogers, John A."]},{"key":"dc:creator","label":"Author","values":["Jeong, Hyejin"]}]},{"id":"academic_context","label":"Academic Context","entries":[{"key":"dc:date","label":"Dc Date","values":["2014-01-16T18:01:28Z","2013-12"]},{"key":"dc:type","label":"Dc Type","values":["text"]},{"key":"thesis:degree_discipline","label":"Discipline","values":["Electrical and Computer Engineering"]},{"key":"thesis:degree_level","label":"Degree Level","values":["Dissertation"]},{"key":"thesis:degree_name","label":"Degree Name","values":["Ph.D."]},{"key":"thesis:institution_name","label":"Thesis Institution Name","values":["University of Illinois at Urbana-Champaign"]}]},{"id":"subjects_keywords","label":"Subjects and Keywords","entries":[{"key":"dc:subject","label":"Dc Subject","values":["vertical cavity surface emitting lasers (VCSEL)","semiconductor","laser","fabrication","hybrid","electro-thermal","modeling","COMSOL","bonding","heterogeneous substrate"]}]},{"id":"language_rights","label":"Language and Rights","entries":[{"key":"dc:language","label":"Dc Language","values":["en"]},{"key":"dc:rights","label":"Dc Rights","values":["Copyright 2013 Hyejin Jeong"]}]},{"id":"identifiers","label":"Identifiers","entries":[{"key":"dc:identifier","label":"Identifier","values":["http://hdl.handle.net/2142/46758"]}]},{"id":"additional","label":"Additional Metadata","entries":[{"key":"dc:description","label":"Description","values":["Typically semiconductor materials used for photonic devices have been limited to those exhibiting a direct bandgap. In order to incorporate indirect bandgap and non-semiconducting materials, extensive research efforts have been put into developing hybrid photonic devices, which consist of different materials for the light emitting region and the substrate. In this dissertation, a post-fabrication bonding technique for integrating semiconductor vertical cavity surface emitting lasers (VCSELs) onto hybrid substrates is demonstrated. This approach provides flexibility regarding the choice of device fabrication and hybrid substrate materials. Light output versus injected current and applied voltage characteristics of lasers are measured before and after the transfer process. VCSEL arrays transferred onto Si substrate show that the transfer technique does not degrade the laser performance. VCSEL transfer onto a polyethylene terephthalate (PET) substrate allows for flexible arrays, but with degraded performance due to excessive thermal dissipation. A VCSEL array with an area of 1.0 x 1.2 mm2 is transferred onto a Cu substrate which has a higher thermal conductivity compared to both GaAs and PET. For the transfer bonding process, the final device yield is enhanced by including an etch stop layer in the epitaxial wafer. In order to study the effect of the thermal conductivity of the substrate on the dissipation of heat from the VCSELs, we present a simple VCSEL electro-thermal model, in which an agreement is obtained between simulation and experiment for lasing wavelength with varying laser diameter. Using this model, the thermal limitations of the VCSEL output on different substrates is discussed","Item withdrawn by Laura Spradlin (lspradl2@illinois.edu) on 2013-12-03T14:49:51Z Item was in collections: University of Illinois Theses & Dissertations (ID: 1) No. of bitstreams: 1 Jeong_Hyejin.pdf: 11921488 bytes, checksum: bb149d9c49e1816951a54f94bd2399f4 (MD5)","Made available in DSpace on 2014-01-16T18:01:28Z (GMT). No. of bitstreams: 4 Hyejin_Jeong.pdf: 11922128 bytes, checksum: d8b7ca428f83fea4c833e026e46cf7d1 (MD5) Jeong_Hyejin_2013.docx: 17483223 bytes, checksum: b19aa51d4326d2b1079737b829274a48 (MD5) 1_Jeong_Hyejin_2013.docx: 17483223 bytes, checksum: b19aa51d4326d2b1079737b829274a48 (MD5) license.txt: 4063 bytes, checksum: 67a8e3a4e06e93a052d035bc39f5fa50 (MD5)"]},{"key":"dc:title","label":"Title","values":["Heterogeneously bonded vertical cavity surface emitting lasers and thermal modeling"]}]}],"canonical_facts":{"dc:contributor":["Choquette, Kent D.","Goddard, Lynford L.","Kim, Kyekyoon","Rogers, John A."],"dc:creator":["Jeong, Hyejin"],"dc:date":["2014-01-16T18:01:28Z","2013-12"],"dc:description":["Typically semiconductor materials used for photonic devices have been limited to those exhibiting a direct bandgap. In order to incorporate indirect bandgap and non-semiconducting materials, extensive research efforts have been put into developing hybrid photonic devices, which consist of different materials for the light emitting region and the substrate. In this dissertation, a post-fabrication bonding technique for integrating semiconductor vertical cavity surface emitting lasers (VCSELs) onto hybrid substrates is demonstrated. This approach provides flexibility regarding the choice of device fabrication and hybrid substrate materials. Light output versus injected current and applied voltage characteristics of lasers are measured before and after the transfer process. VCSEL arrays transferred onto Si substrate show that the transfer technique does not degrade the laser performance. VCSEL transfer onto a polyethylene terephthalate (PET) substrate allows for flexible arrays, but with degraded performance due to excessive thermal dissipation. A VCSEL array with an area of 1.0 x 1.2 mm2 is transferred onto a Cu substrate which has a higher thermal conductivity compared to both GaAs and PET. For the transfer bonding process, the final device yield is enhanced by including an etch stop layer in the epitaxial wafer. In order to study the effect of the thermal conductivity of the substrate on the dissipation of heat from the VCSELs, we present a simple VCSEL electro-thermal model, in which an agreement is obtained between simulation and experiment for lasing wavelength with varying laser diameter. Using this model, the thermal limitations of the VCSEL output on different substrates is discussed","Item withdrawn by Laura Spradlin (lspradl2@illinois.edu) on 2013-12-03T14:49:51Z Item was in collections: University of Illinois Theses & Dissertations (ID: 1) No. of bitstreams: 1 Jeong_Hyejin.pdf: 11921488 bytes, checksum: bb149d9c49e1816951a54f94bd2399f4 (MD5)","Made available in DSpace on 2014-01-16T18:01:28Z (GMT). No. of bitstreams: 4 Hyejin_Jeong.pdf: 11922128 bytes, checksum: d8b7ca428f83fea4c833e026e46cf7d1 (MD5) Jeong_Hyejin_2013.docx: 17483223 bytes, checksum: b19aa51d4326d2b1079737b829274a48 (MD5) 1_Jeong_Hyejin_2013.docx: 17483223 bytes, checksum: b19aa51d4326d2b1079737b829274a48 (MD5) license.txt: 4063 bytes, checksum: 67a8e3a4e06e93a052d035bc39f5fa50 (MD5)"],"dc:identifier":["http://hdl.handle.net/2142/46758"],"dc:language":["en"],"dc:rights":["Copyright 2013 Hyejin Jeong"],"dc:subject":["vertical cavity surface emitting lasers (VCSEL)","semiconductor","laser","fabrication","hybrid","electro-thermal","modeling","COMSOL","bonding","heterogeneous substrate"],"dc:title":["Heterogeneously bonded vertical cavity surface emitting lasers and thermal modeling"],"dc:type":["text"],"thesis:degree_discipline":["Electrical and Computer Engineering"],"thesis:degree_level":["Dissertation"],"thesis:degree_name":["Ph.D."],"thesis:institution_name":["University of Illinois at Urbana-Champaign"]},"updated_at":"2026-07-22T22:25:36Z"}