{"id":{"repo_id":"uiuc","oai_identifier":"oai:www.ideals.illinois.edu:2142/45581"},"canonical_url":"https://search.dev.ndltd.org/etd/uiuc/oai:www.ideals.illinois.edu:2142/45581","repository":{"repo_id":"uiuc","name":"University of Illinois - Urbana-Champaign","base_url":"https://www.ideals.illinois.edu/oai-pmh"},"display":{"title":"Materials, device designs, and integration approaches for transient, bio-resorbable silicon electronic systems","abstract":"A remarkable feature of a silicon-based electronics is its capability to operate functionally and physically invariant for many practical purposes. Here, we introduce a technology that offers the opposite behavior: it gradually vanishes over time, in a well-controlled, programmed manner. Devices that are ‘transient’ in this sense have potential applications that cannot be addressed with conventional electronic devices, such as implantable biomedical devices that remain for medically useful time periods, but then completely dissolve/resorb into the body. We report a set of materials, manufacturing schemes, device components and theoretical design tools for a silicon-based complementary metal oxide semiconductor (CMOS) technology and power scavenging system with oscillators as a building block of wireless communication, which has this type of ‘transient’ behavior, together with various integrated sensors. A transient silicon device capable of delivering thermal therapy in an implantable mode and its demonstration in animal models illustrate a system-level example of this technology. Another discovery for this type of transient electronics is materials and fabrication procedures that the key device processing steps occur on silicon wafer substrates, in schemes compatible with established methods used in conventional microelectronics. The approach relies on an unusual type of silicon on insulator wafer, and yields devices that use ultrathin sheets of monocrystalline silicon for the semiconductor, thin films of magnesium for the electrodes and interconnects, silicon dioxide and magnesium oxide for the dielectrics and silk for the substrates. A range of component examples, with detailed measurements of their electrical characteristics and dissolution properties, illustrate the capabilities. In vivo toxicity tests demonstrate biocompatibility in sub-dermal implants. The results have significance for broad classes of water-soluble, ‘transient’ electronic devices.","abstract_html":"A remarkable feature of a silicon-based electronics is its capability to operate functionally and physically invariant for many practical purposes. Here, we introduce a technology that offers the opposite behavior: it gradually vanishes over time, in a well-controlled, programmed manner. Devices that are ‘transient’ in this sense have potential applications that cannot be addressed with conventional electronic devices, such as implantable biomedical devices that remain for medically useful time periods, but then completely dissolve/resorb into the body. We report a set of materials, manufacturing schemes, device components and theoretical design tools for a silicon-based complementary metal oxide semiconductor (CMOS) technology and power scavenging system with oscillators as a building block of wireless communication, which has this type of ‘transient’ behavior, together with various integrated sensors. A transient silicon device capable of delivering thermal therapy in an implantable mode and its demonstration in animal models illustrate a system-level example of this technology. Another discovery for this type of transient electronics is materials and fabrication procedures that the key device processing steps occur on silicon wafer substrates, in schemes compatible with established methods used in conventional microelectronics. The approach relies on an unusual type of silicon on insulator wafer, and yields devices that use ultrathin sheets of monocrystalline silicon for the semiconductor, thin films of magnesium for the electrodes and interconnects, silicon dioxide and magnesium oxide for the dielectrics and silk for the substrates. A range of component examples, with detailed measurements of their electrical characteristics and dissolution properties, illustrate the capabilities. In vivo toxicity tests demonstrate biocompatibility in sub-dermal implants. The results have significance for broad classes of water-soluble, ‘transient’ electronic devices.","abstract_has_math":false,"creators":["Hwang, SukWon"],"institution":"University of Illinois at Urbana-Champaign","degree_name":"Ph.D.","degree_level":"Dissertation","degree_discipline":"Materials Science & Engr","degree_department":null,"school":null,"contributors":["Rogers, John A.","Braun, Paul V.","Cheng, Jianjun","Li, Xiuling"],"advisors":[],"committee_chairs":[],"committee_members":[],"year":2013,"date_issued":"2013-08-22T16:48:32Z","date_published":"2013-08-22T16:48:32Z","updated_at":"2026-07-22T22:25:36Z","subjects":["transient electronics","bioresorbable device","biocompatible","silicon dissolution"],"languages":["en"],"rights":["Copyright 2013 SukWon Hwang"],"rights_urls":[],"identifier_entries":[]},"links":{"outbound_url":"http://hdl.handle.net/2142/45581","outbound_label":"Handle","outbound_source":"dc:identifier"},"metadata_groups":[{"id":"people","label":"People","entries":[{"key":"dc:contributor","label":"Contributor","values":["Rogers, John A.","Braun, Paul V.","Cheng, Jianjun","Li, Xiuling"]},{"key":"dc:creator","label":"Author","values":["Hwang, SukWon"]}]},{"id":"academic_context","label":"Academic Context","entries":[{"key":"dc:date","label":"Dc Date","values":["2013-08-22T16:48:32Z","2015-08-22T10:00:46Z","2013-08"]},{"key":"dc:type","label":"Dc Type","values":["text"]},{"key":"thesis:degree_discipline","label":"Discipline","values":["Materials Science & Engr"]},{"key":"thesis:degree_level","label":"Degree Level","values":["Dissertation"]},{"key":"thesis:degree_name","label":"Degree Name","values":["Ph.D."]},{"key":"thesis:institution_name","label":"Thesis Institution Name","values":["University of Illinois at Urbana-Champaign"]}]},{"id":"subjects_keywords","label":"Subjects and Keywords","entries":[{"key":"dc:subject","label":"Dc Subject","values":["transient electronics","bioresorbable device","biocompatible","silicon dissolution"]}]},{"id":"language_rights","label":"Language and Rights","entries":[{"key":"dc:language","label":"Dc Language","values":["en"]},{"key":"dc:rights","label":"Dc Rights","values":["Copyright 2013 SukWon Hwang"]}]},{"id":"identifiers","label":"Identifiers","entries":[{"key":"dc:identifier","label":"Identifier","values":["http://hdl.handle.net/2142/45581"]}]},{"id":"additional","label":"Additional Metadata","entries":[{"key":"dc:description","label":"Description","values":["A remarkable feature of a silicon-based electronics is its capability to operate functionally and physically invariant for many practical purposes. 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Another discovery for this type of transient electronics is materials and fabrication procedures that the key device processing steps occur on silicon wafer substrates, in schemes compatible with established methods used in conventional microelectronics. The approach relies on an unusual type of silicon on insulator wafer, and yields devices that use ultrathin sheets of monocrystalline silicon for the semiconductor, thin films of magnesium for the electrodes and interconnects, silicon dioxide and magnesium oxide for the dielectrics and silk for the substrates. A range of component examples, with detailed measurements of their electrical characteristics and dissolution properties, illustrate the capabilities. In vivo toxicity tests demonstrate biocompatibility in sub-dermal implants. 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Another discovery for this type of transient electronics is materials and fabrication procedures that the key device processing steps occur on silicon wafer substrates, in schemes compatible with established methods used in conventional microelectronics. The approach relies on an unusual type of silicon on insulator wafer, and yields devices that use ultrathin sheets of monocrystalline silicon for the semiconductor, thin films of magnesium for the electrodes and interconnects, silicon dioxide and magnesium oxide for the dielectrics and silk for the substrates. A range of component examples, with detailed measurements of their electrical characteristics and dissolution properties, illustrate the capabilities. In vivo toxicity tests demonstrate biocompatibility in sub-dermal implants. 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