{"id":{"repo_id":"uiuc","oai_identifier":"oai:www.ideals.illinois.edu:2142/29553"},"canonical_url":"https://search.dev.ndltd.org/etd/uiuc/oai:www.ideals.illinois.edu:2142/29553","repository":{"repo_id":"uiuc","name":"University of Illinois - Urbana-Champaign","base_url":"https://www.ideals.illinois.edu/oai-pmh"},"display":{"title":"Electrostatic transfer of graphene grown on copper foil and nanosoldering of carbon nanotube junctions","abstract":"This thesis presents novel techniques to enhance the key processing and device issues related to carbon nanoelectronics. Particularly, the presented techniques involve transferring graphene grown on copper foil using electrostatic force and improving the junction resistance of carbon nanotube (CNT) networks by nanosoldering. Typically, transferring graphene grown on metal substrates involves wet etching steps in order to separate graphene from its metal growth substrates. During these wet etching steps, however, residues and wrinkles can be easily introduced in graphene and degrade its quality. By using electrostatic force instead, we attempt to transfer graphene grown on copper foil without involving the wet etching steps, thereby simplifying the transfer technique and improving the quality of transferred graphene. In addition, we further study the interaction between graphene and the copper substrate. For nanosoldering of CNT networks, we propose a novel method to locally deposit metals at the junctions of CNTs in order to lower the junction resistance. As these junctions are the most-resistive regions, we are able to locally heat the junctions by passing currents through the CNT network. In the presence of metal precursors in a vacuum environment, we attempt to deposit metals locally and selectively at these junctions. Our results show that the metals indeed start to form locally at the inter-tube junctions, which indicates that the junctions are the spots of high thermal resistance. The effects of nanosoldering these junctions seem to vary according to the types of metals deposited at the junctions, and are subjects for further study.","abstract_html":"This thesis presents novel techniques to enhance the key processing and device issues related to carbon nanoelectronics. Particularly, the presented techniques involve transferring graphene grown on copper foil using electrostatic force and improving the junction resistance of carbon nanotube (CNT) networks by nanosoldering. Typically, transferring graphene grown on metal substrates involves wet etching steps in order to separate graphene from its metal growth substrates. During these wet etching steps, however, residues and wrinkles can be easily introduced in graphene and degrade its quality. By using electrostatic force instead, we attempt to transfer graphene grown on copper foil without involving the wet etching steps, thereby simplifying the transfer technique and improving the quality of transferred graphene. In addition, we further study the interaction between graphene and the copper substrate. For nanosoldering of CNT networks, we propose a novel method to locally deposit metals at the junctions of CNTs in order to lower the junction resistance. As these junctions are the most-resistive regions, we are able to locally heat the junctions by passing currents through the CNT network. In the presence of metal precursors in a vacuum environment, we attempt to deposit metals locally and selectively at these junctions. Our results show that the metals indeed start to form locally at the inter-tube junctions, which indicates that the junctions are the spots of high thermal resistance. The effects of nanosoldering these junctions seem to vary according to the types of metals deposited at the junctions, and are subjects for further study.","abstract_has_math":false,"creators":["Do, Jae Won"],"institution":"University of Illinois at Urbana-Champaign","degree_name":"M.S.","degree_level":"Thesis","degree_discipline":"Electrical & Computer Engr","degree_department":null,"school":null,"contributors":["Lyding, Joseph W."],"advisors":[],"committee_chairs":[],"committee_members":[],"year":2012,"date_issued":"2012-02-01T00:55:07Z","date_published":"2012-02-01T00:55:07Z","updated_at":"2026-07-22T22:25:27Z","subjects":["graphene","graphene transfer","electrostatics","graphene growth","graphene on copper","carbon nanotubes","nanosoldering","carbon nanotube junctions","carbon nanotube junction resistance","local chemical vapor deposition"],"languages":["en"],"rights":["Copyright 2011 Jae Won Do"],"rights_urls":[],"identifier_entries":[]},"links":{"outbound_url":"http://hdl.handle.net/2142/29553","outbound_label":"Handle","outbound_source":"dc:identifier"},"metadata_groups":[{"id":"people","label":"People","entries":[{"key":"dc:contributor","label":"Contributor","values":["Lyding, Joseph W."]},{"key":"dc:creator","label":"Author","values":["Do, Jae Won"]}]},{"id":"academic_context","label":"Academic Context","entries":[{"key":"dc:date","label":"Dc Date","values":["2012-02-01T00:55:07Z","2014-02-01T11:00:34Z","2011-12"]},{"key":"dc:type","label":"Dc Type","values":["Dissertation / Thesis","text"]},{"key":"thesis:degree_discipline","label":"Discipline","values":["Electrical & Computer Engr"]},{"key":"thesis:degree_level","label":"Degree Level","values":["Thesis"]},{"key":"thesis:degree_name","label":"Degree Name","values":["M.S."]},{"key":"thesis:institution_name","label":"Thesis Institution Name","values":["University of Illinois at Urbana-Champaign"]}]},{"id":"subjects_keywords","label":"Subjects and Keywords","entries":[{"key":"dc:subject","label":"Dc Subject","values":["graphene","graphene transfer","electrostatics","graphene growth","graphene on copper","carbon nanotubes","nanosoldering","carbon nanotube junctions","carbon nanotube junction resistance","local chemical vapor deposition"]}]},{"id":"language_rights","label":"Language and Rights","entries":[{"key":"dc:language","label":"Dc Language","values":["en"]},{"key":"dc:rights","label":"Dc Rights","values":["Copyright 2011 Jae Won Do"]}]},{"id":"identifiers","label":"Identifiers","entries":[{"key":"dc:identifier","label":"Identifier","values":["http://hdl.handle.net/2142/29553"]}]},{"id":"additional","label":"Additional Metadata","entries":[{"key":"dc:description","label":"Description","values":["This thesis presents novel techniques to enhance the key processing and device issues related to carbon nanoelectronics. 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As these junctions are the most-resistive regions, we are able to locally heat the junctions by passing currents through the CNT network. In the presence of metal precursors in a vacuum environment, we attempt to deposit metals locally and selectively at these junctions. Our results show that the metals indeed start to form locally at the inter-tube junctions, which indicates that the junctions are the spots of high thermal resistance. The effects of nanosoldering these junctions seem to vary according to the types of metals deposited at the junctions, and are subjects for further study.","Item withdrawn by Mark Zulauf (zulauf@illinois.edu) on 2011-11-30T15:48:04Z Item was in collections: University of Illinois Theses & Dissertations (ID: 1) No. of bitstreams: 1 DO_JAE WON.pdf: 3829959 bytes, checksum: 9eae200d3f9b92e250a1afdd420441ef (MD5)","Made available in DSpace on 2012-02-01T00:55:07Z (GMT). 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As these junctions are the most-resistive regions, we are able to locally heat the junctions by passing currents through the CNT network. In the presence of metal precursors in a vacuum environment, we attempt to deposit metals locally and selectively at these junctions. Our results show that the metals indeed start to form locally at the inter-tube junctions, which indicates that the junctions are the spots of high thermal resistance. The effects of nanosoldering these junctions seem to vary according to the types of metals deposited at the junctions, and are subjects for further study.","Item withdrawn by Mark Zulauf (zulauf@illinois.edu) on 2011-11-30T15:48:04Z Item was in collections: University of Illinois Theses & Dissertations (ID: 1) No. of bitstreams: 1 DO_JAE WON.pdf: 3829959 bytes, checksum: 9eae200d3f9b92e250a1afdd420441ef (MD5)","Made available in DSpace on 2012-02-01T00:55:07Z (GMT). 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