{"id":{"repo_id":"uiuc","oai_identifier":"oai:www.ideals.illinois.edu:2142/23076"},"canonical_url":"https://search.dev.ndltd.org/etd/uiuc/oai:www.ideals.illinois.edu:2142/23076","repository":{"repo_id":"uiuc","name":"University of Illinois - Urbana-Champaign","base_url":"https://www.ideals.illinois.edu/oai-pmh"},"display":{"title":"Finite element methods for the electromagnetic modeling of waveguide discontinuities and cavity resonators","abstract":"Restriction data tranferred 2014-07-01T11:29:27-05:00 Original Data Group with Access UIUC Users [automated] Release Date: none Reason: ETDs are only available to UIUC Users without author permission","abstract_html":"Restriction data tranferred 2014-07-01T11:29:27-05:00 Original Data Group with Access UIUC Users [automated] Release Date: none Reason: ETDs are only available to UIUC Users without author permission","abstract_has_math":false,"creators":["Wilkins, Gregory Martine"],"institution":"University of Illinois at Urbana-Champaign","degree_name":"Ph.D.","degree_level":"Dissertation","degree_discipline":"Electrical Engineering","degree_department":null,"school":null,"contributors":["Mittra, Raj"],"advisors":[],"committee_chairs":[],"committee_members":[],"year":2011,"date_issued":"2011-05-07T14:01:18Z","date_published":"2011-05-07T14:01:18Z","updated_at":"2026-07-22T22:25:21Z","subjects":["Engineering, Electronics and Electrical"],"languages":["eng"],"rights":["Copyright 1992 Wilkins, Gregory Martine"],"rights_urls":[],"identifier_entries":[{"key":"dc:identifier","label":"Identifier","values":["AAI9215907","(UMI)AAI9215907"],"render_values":[{"text":"AAI9215907","href":null,"code":true},{"text":"(UMI)AAI9215907","href":null,"code":true}]}]},"links":{"outbound_url":"http://hdl.handle.net/2142/23076","outbound_label":"Handle","outbound_source":"dc:identifier"},"metadata_groups":[{"id":"people","label":"People","entries":[{"key":"dc:contributor","label":"Contributor","values":["Mittra, Raj"]},{"key":"dc:creator","label":"Author","values":["Wilkins, Gregory Martine"]}]},{"id":"academic_context","label":"Academic Context","entries":[{"key":"dc:date","label":"Dc Date","values":["2011-05-07T14:01:18Z","10000-01-01","1992"]},{"key":"dc:type","label":"Dc Type","values":["text"]},{"key":"thesis:degree_discipline","label":"Discipline","values":["Electrical Engineering"]},{"key":"thesis:degree_level","label":"Degree Level","values":["Dissertation"]},{"key":"thesis:degree_name","label":"Degree Name","values":["Ph.D."]},{"key":"thesis:institution_name","label":"Thesis Institution Name","values":["University of Illinois at Urbana-Champaign"]}]},{"id":"subjects_keywords","label":"Subjects and Keywords","entries":[{"key":"dc:subject","label":"Dc Subject","values":["Engineering, Electronics and Electrical"]}]},{"id":"language_rights","label":"Language and Rights","entries":[{"key":"dc:language","label":"Dc Language","values":["eng"]},{"key":"dc:rights","label":"Dc Rights","values":["Copyright 1992 Wilkins, Gregory Martine"]}]},{"id":"identifiers","label":"Identifiers","entries":[{"key":"dc:identifier","label":"Identifier","values":["AAI9215907","(UMI)AAI9215907","http://hdl.handle.net/2142/23076"]}]},{"id":"additional","label":"Additional Metadata","entries":[{"key":"dc:description","label":"Description","values":["Restriction data tranferred 2014-07-01T11:29:27-05:00 Original Data Group with Access UIUC Users [automated] Release Date: none Reason: ETDs are only available to UIUC Users without author permission","ETDs are only available to UIUC Users without author permission","U of I Only","Increases in both the performance requirements of electronic devices and the number of components per device suggest that component size and configuration must be strongly considered in the design process. The layout and construction of device components are pertinent factors for consideration, and component interaction must be incorporated into any complete and accurate research investigation of electronic devices and packaging. In the current research, attention is focused on the electrical design of the devices and the corresponding electromagnetic field behavior within the individual components. In addition, consideration is given to effects due to materials and other parameters upon which circuit elements situated in very-large-scale-integrated (VLSl) circuits are dependent. A full-wave analysis is performed for a variety of configurations, with the finite element method (FEM) serving as a consistent and reliable technique for modeling field behavior within electronic circuit components.","Several geometries are investigated. Problems which may be analyzed with two-dimensional techniques are considered. The coaxial waveguide and junction discontinuities are modeled, from which field patterns and scattering parameters for the device are determined. In this geometry, the transverse electromagnetic mode is dominant. Discussion and implementation of an absorbing boundary condition are also included. A nodal finite element approach is satisfactory in this case. Next, cylindrical geometries which exhibit azimuthal symmetry are studied, and a modified finite element technique requiring both nodal and edge unknowns is utilized. Origins of spurious solutions frequently encountered in the study of circular resonant cavities are discussed, and a transformation of variables is presented to account for this difficulty. Finally, the general three-dimensional cavity and waveguide problems are investigated using an edge-element approach, as before, to eliminate any problems due to spurious solutions. Several resonant cavities and waveguide discontinuity problems are considered. An absorbing boundary condition is again discussed and implemented.","Made available in DSpace on 2011-05-07T14:01:18Z (GMT). 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The layout and construction of device components are pertinent factors for consideration, and component interaction must be incorporated into any complete and accurate research investigation of electronic devices and packaging. In the current research, attention is focused on the electrical design of the devices and the corresponding electromagnetic field behavior within the individual components. In addition, consideration is given to effects due to materials and other parameters upon which circuit elements situated in very-large-scale-integrated (VLSl) circuits are dependent. A full-wave analysis is performed for a variety of configurations, with the finite element method (FEM) serving as a consistent and reliable technique for modeling field behavior within electronic circuit components.","Several geometries are investigated. Problems which may be analyzed with two-dimensional techniques are considered. The coaxial waveguide and junction discontinuities are modeled, from which field patterns and scattering parameters for the device are determined. In this geometry, the transverse electromagnetic mode is dominant. Discussion and implementation of an absorbing boundary condition are also included. A nodal finite element approach is satisfactory in this case. Next, cylindrical geometries which exhibit azimuthal symmetry are studied, and a modified finite element technique requiring both nodal and edge unknowns is utilized. Origins of spurious solutions frequently encountered in the study of circular resonant cavities are discussed, and a transformation of variables is presented to account for this difficulty. Finally, the general three-dimensional cavity and waveguide problems are investigated using an edge-element approach, as before, to eliminate any problems due to spurious solutions. Several resonant cavities and waveguide discontinuity problems are considered. An absorbing boundary condition is again discussed and implemented.","Made available in DSpace on 2011-05-07T14:01:18Z (GMT). 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