{"id":{"repo_id":"uiuc","oai_identifier":"oai:www.ideals.illinois.edu:2142/22293"},"canonical_url":"https://search.dev.ndltd.org/etd/uiuc/oai:www.ideals.illinois.edu:2142/22293","repository":{"repo_id":"uiuc","name":"University of Illinois - Urbana-Champaign","base_url":"https://www.ideals.illinois.edu/oai-pmh"},"display":{"title":"In situ studies of copper electrodeposition in the presence of organic additives using atomic force microscopy","abstract":"In the present study we investigated electrodeposition of Cu from sulfuric acid solutions. Three different substrates were used to investigate the effect of various variables on electrodeposition.","abstract_html":"In the present study we investigated electrodeposition of Cu from sulfuric acid solutions. Three different substrates were used to investigate the effect of various variables on electrodeposition.","abstract_has_math":false,"creators":["Schmidt, Wolfgang Uwe"],"institution":"University of Illinois at Urbana-Champaign","degree_name":"Ph.D.","degree_level":"Dissertation","degree_discipline":"Chemical and Biomolecular Engineering","degree_department":null,"school":null,"contributors":["Alkire, Richard C."],"advisors":[],"committee_chairs":[],"committee_members":[],"year":2011,"date_issued":"2011-05-07T13:35:15Z","date_published":"2011-05-07T13:35:15Z","updated_at":"2026-07-22T22:25:19Z","subjects":["Chemistry, Inorganic","Engineering, Chemical"],"languages":["eng"],"rights":["Copyright 1996 Schmidt, Wolfgang Uwe"],"rights_urls":[],"identifier_entries":[{"key":"dc:identifier","label":"Identifier","values":["AAI9624485","(UMI)AAI9624485"],"render_values":[{"text":"AAI9624485","href":null,"code":true},{"text":"(UMI)AAI9624485","href":null,"code":true}]}]},"links":{"outbound_url":"http://hdl.handle.net/2142/22293","outbound_label":"Handle","outbound_source":"dc:identifier"},"metadata_groups":[{"id":"people","label":"People","entries":[{"key":"dc:contributor","label":"Contributor","values":["Alkire, Richard C."]},{"key":"dc:creator","label":"Author","values":["Schmidt, Wolfgang Uwe"]}]},{"id":"academic_context","label":"Academic Context","entries":[{"key":"dc:date","label":"Dc Date","values":["2011-05-07T13:35:15Z","10000-01-01","1996"]},{"key":"dc:type","label":"Dc Type","values":["text"]},{"key":"thesis:degree_discipline","label":"Discipline","values":["Chemical and Biomolecular Engineering"]},{"key":"thesis:degree_level","label":"Degree Level","values":["Dissertation"]},{"key":"thesis:degree_name","label":"Degree Name","values":["Ph.D."]},{"key":"thesis:institution_name","label":"Thesis Institution Name","values":["University of Illinois at Urbana-Champaign"]}]},{"id":"subjects_keywords","label":"Subjects and Keywords","entries":[{"key":"dc:subject","label":"Dc Subject","values":["Chemistry, Inorganic","Engineering, Chemical"]}]},{"id":"language_rights","label":"Language and Rights","entries":[{"key":"dc:language","label":"Dc Language","values":["eng"]},{"key":"dc:rights","label":"Dc Rights","values":["Copyright 1996 Schmidt, Wolfgang Uwe"]}]},{"id":"identifiers","label":"Identifiers","entries":[{"key":"dc:identifier","label":"Identifier","values":["AAI9624485","(UMI)AAI9624485","http://hdl.handle.net/2142/22293"]}]},{"id":"additional","label":"Additional Metadata","entries":[{"key":"dc:description","label":"Description","values":["In the present study we investigated electrodeposition of Cu from sulfuric acid solutions. Three different substrates were used to investigate the effect of various variables on electrodeposition.","In situ atomic force microscopy (AFM) in a fluid flow environment was used to follow electrodeposition of Cu on Pt(100). Imaging dimensions in a flow environment were not affected by fluid flow down to the atomic level. A lifting force was found to influence the AFM tip during imaging. Electrodeposition in a flow environment was observed to proceed through the formation of smaller and a larger number of nuclei than observed to form during electrodeposition in a stagnant solution resulting in a more uniform and smoother deposit.","The initial nucleation and growth of Cu on HOPG was not affected by BTA and thiourea. After full coverage of the surface by Cu, growth proceeded uniquely for each system. (i) Electrodeposition from additive free systems was found to be well represented by diffusion limited three-dimensional nucleation and growth. (ii) BTA containing solutions were found to be well represented by a two rate nucleation model describing growth in the vertical direction as inhibited and lateral growth as charge transfer limited. (iii) Nuclei developing from thiourea containing solutions were found to be well represented by a two rate nucleation model describing vertical growth as inhibited and lateral growth as diffusion limited.","Electrodeposition of Cu on Au(111) was investigated on three levels. Observation of in situ AFM images, scaling analysis of the growing surface and spectral decomposition of the autocovariance description of the surface. The three levels of analysis were found to agree in their description of Cu electrodeposition and mediating effects of the additives BTA and thiourea. Cu electrodeposition from additive free solutions was observed to be surface diffusion dominated. BTA was observed to inhibit surface diffusion of Cu adatom species on the surface and thus limited the formation of large nuclei. Cu deposits from thiourea containing solutions were observed to proceed through an initial step growth mechanism after which further development of the deposit proceeded through three dimensional nucleation and growth.","Made available in DSpace on 2011-05-07T13:35:15Z (GMT). No. of bitstreams: 2 license.txt: 4922 bytes, checksum: 910b249b4beec47e7ab768910c8f966f (MD5) 9624485.pdf: 9281638 bytes, checksum: f9b2338315cf66344b99ecc3f2b5c9fb (MD5) Previous issue date: 1996","Item marked as restricted to the 'UIUC Users [automated]' Group (id=2) by Howard Ding (hding2@illinois.edu) on 2011-05-07T14:56:38Z Item is restricted indefinitely.","Restriction data tranferred 2014-07-01T11:26:29-05:00 Original Data Group with Access UIUC Users [automated] Release Date: none Reason: ETDs are only available to UIUC Users without author permission","ETDs are only available to UIUC Users without author permission","U of I Only"]},{"key":"dc:title","label":"Title","values":["In situ studies of copper electrodeposition in the presence of organic additives using atomic force microscopy"]}]}],"canonical_facts":{"dc:contributor":["Alkire, Richard C."],"dc:creator":["Schmidt, Wolfgang Uwe"],"dc:date":["2011-05-07T13:35:15Z","10000-01-01","1996"],"dc:description":["In the present study we investigated electrodeposition of Cu from sulfuric acid solutions. Three different substrates were used to investigate the effect of various variables on electrodeposition.","In situ atomic force microscopy (AFM) in a fluid flow environment was used to follow electrodeposition of Cu on Pt(100). Imaging dimensions in a flow environment were not affected by fluid flow down to the atomic level. A lifting force was found to influence the AFM tip during imaging. Electrodeposition in a flow environment was observed to proceed through the formation of smaller and a larger number of nuclei than observed to form during electrodeposition in a stagnant solution resulting in a more uniform and smoother deposit.","The initial nucleation and growth of Cu on HOPG was not affected by BTA and thiourea. After full coverage of the surface by Cu, growth proceeded uniquely for each system. (i) Electrodeposition from additive free systems was found to be well represented by diffusion limited three-dimensional nucleation and growth. (ii) BTA containing solutions were found to be well represented by a two rate nucleation model describing growth in the vertical direction as inhibited and lateral growth as charge transfer limited. (iii) Nuclei developing from thiourea containing solutions were found to be well represented by a two rate nucleation model describing vertical growth as inhibited and lateral growth as diffusion limited.","Electrodeposition of Cu on Au(111) was investigated on three levels. Observation of in situ AFM images, scaling analysis of the growing surface and spectral decomposition of the autocovariance description of the surface. The three levels of analysis were found to agree in their description of Cu electrodeposition and mediating effects of the additives BTA and thiourea. Cu electrodeposition from additive free solutions was observed to be surface diffusion dominated. BTA was observed to inhibit surface diffusion of Cu adatom species on the surface and thus limited the formation of large nuclei. Cu deposits from thiourea containing solutions were observed to proceed through an initial step growth mechanism after which further development of the deposit proceeded through three dimensional nucleation and growth.","Made available in DSpace on 2011-05-07T13:35:15Z (GMT). No. of bitstreams: 2 license.txt: 4922 bytes, checksum: 910b249b4beec47e7ab768910c8f966f (MD5) 9624485.pdf: 9281638 bytes, checksum: f9b2338315cf66344b99ecc3f2b5c9fb (MD5) Previous issue date: 1996","Item marked as restricted to the 'UIUC Users [automated]' Group (id=2) by Howard Ding (hding2@illinois.edu) on 2011-05-07T14:56:38Z Item is restricted indefinitely.","Restriction data tranferred 2014-07-01T11:26:29-05:00 Original Data Group with Access UIUC Users [automated] Release Date: none Reason: ETDs are only available to UIUC Users without author permission","ETDs are only available to UIUC Users without author permission","U of I Only"],"dc:identifier":["AAI9624485","(UMI)AAI9624485","http://hdl.handle.net/2142/22293"],"dc:language":["eng"],"dc:rights":["Copyright 1996 Schmidt, Wolfgang Uwe"],"dc:subject":["Chemistry, Inorganic","Engineering, Chemical"],"dc:title":["In situ studies of copper electrodeposition in the presence of organic additives using atomic force microscopy"],"dc:type":["text"],"thesis:degree_discipline":["Chemical and Biomolecular Engineering"],"thesis:degree_level":["Dissertation"],"thesis:degree_name":["Ph.D."],"thesis:institution_name":["University of Illinois at Urbana-Champaign"]},"updated_at":"2026-07-22T22:25:19Z"}