{"id":{"repo_id":"uiuc","oai_identifier":"oai:www.ideals.illinois.edu:2142/21422"},"canonical_url":"https://search.dev.ndltd.org/etd/uiuc/oai:www.ideals.illinois.edu:2142/21422","repository":{"repo_id":"uiuc","name":"University of Illinois - Urbana-Champaign","base_url":"https://www.ideals.illinois.edu/oai-pmh"},"display":{"title":"Localized adsorption of organic additives during copper electrodeposition","abstract":"The confocal laser scanning microscope (CLSM) was used in situ during electrochemical experiments to track localized fluorescence patterns of adsorbed organic agents and correlate such adsorption with the changes in surface morphology accompanying electrolysis. In solutions of 5 $\\mu$M DiOC$\\sb6$(3)/0.01 M $\\rm H\\sb2SO\\sb4$ with and without 0.05 M CuSO$\\sb4$, confocal imaging revealed that DiOC$\\sb6$(3) adsorbed to polycrystalline Au and inhibited cathodic processes occurring there. In the absence of dissolved Cu, DiOC$\\sb6$(3) adsorption on Au remained unaltered by changes in cathodic potential up to $-$750 mV (SSE). During Cu electrodeposition at $-$550 mV and at $-$650 mV (SSE), adsorbed DiOC$\\sb6$(3) restricted nucleation of Cu to a small number of active sites, where Cu grew hemispherically, and DiOC$\\sb6$(3) adsorption was maintained across regions where nucleation had not occurred. Instantaneous nucleation was approached under such conditions. When DiOC$\\sb6$(3) was present, copper growth proceeded according to the Volmer-Weber mechanism at $-$650 mV (SSE). Results from secondary ion mass spectrometry indicated that DiOC$\\sb6$(3), or a derivative of it, was incorporated into the deposit during Cu electrodeposition. When the Cu deposits were dissolved electrochemically at 0 mV (SSE), surfaces of Cu, not Au, became covered with previously incorporated DiOC$\\sb6$(3), which impeded the electrodissolution process. DiI did not exhibit an appreciable electrochemical or morphological effect on Cu electrodeposition. At 5 $\\mu$M, DiI was adsorbed at recesses of the deposit profile when Cu electrodeposition occurred at $-$390 mV (SSE).","abstract_html":"The confocal laser scanning microscope (CLSM) was used in situ during electrochemical experiments to track localized fluorescence patterns of adsorbed organic agents and correlate such adsorption with the changes in surface morphology accompanying electrolysis. In solutions of 5 <span class=\"etd-inline-math\">&mu;</span>M DiOC$\\sb6$(3)/0.01 M $\\rm H\\sb2SO\\sb4$ with and without 0.05 M CuSO$\\sb4$, confocal imaging revealed that DiOC$\\sb6$(3) adsorbed to polycrystalline Au and inhibited cathodic processes occurring there. In the absence of dissolved Cu, DiOC$\\sb6$(3) adsorption on Au remained unaltered by changes in cathodic potential up to $-$750 mV (SSE). During Cu electrodeposition at $-$550 mV and at $-$650 mV (SSE), adsorbed DiOC$\\sb6$(3) restricted nucleation of Cu to a small number of active sites, where Cu grew hemispherically, and DiOC$\\sb6$(3) adsorption was maintained across regions where nucleation had not occurred. Instantaneous nucleation was approached under such conditions. When DiOC$\\sb6$(3) was present, copper growth proceeded according to the Volmer-Weber mechanism at $-$650 mV (SSE). Results from secondary ion mass spectrometry indicated that DiOC$\\sb6$(3), or a derivative of it, was incorporated into the deposit during Cu electrodeposition. When the Cu deposits were dissolved electrochemically at 0 mV (SSE), surfaces of Cu, not Au, became covered with previously incorporated DiOC$\\sb6$(3), which impeded the electrodissolution process. DiI did not exhibit an appreciable electrochemical or morphological effect on Cu electrodeposition. At 5 <span class=\"etd-inline-math\">&mu;</span>M, DiI was adsorbed at recesses of the deposit profile when Cu electrodeposition occurred at $-$390 mV (SSE).","abstract_has_math":true,"creators":["Chung, Dean S."],"institution":"University of Illinois at Urbana-Champaign","degree_name":"Ph.D.","degree_level":"Dissertation","degree_discipline":"Chemical Engineering","degree_department":null,"school":null,"contributors":["Alkire, Richard C."],"advisors":[],"committee_chairs":[],"committee_members":[],"year":2011,"date_issued":"2011-05-07T13:08:12Z","date_published":"2011-05-07T13:08:12Z","updated_at":"2026-07-22T22:25:17Z","subjects":["Engineering, Chemical","Engineering, Materials Science"],"languages":["eng"],"rights":["Copyright 1996 Chung, Dean S."],"rights_urls":[],"identifier_entries":[{"key":"dc:identifier","label":"Identifier","values":["9780591197723","AAI9712231","(UMI)AAI9712231"],"render_values":[{"text":"9780591197723","href":null,"code":true},{"text":"AAI9712231","href":null,"code":true},{"text":"(UMI)AAI9712231","href":null,"code":true}]}]},"links":{"outbound_url":"http://hdl.handle.net/2142/21422","outbound_label":"Handle","outbound_source":"dc:identifier"},"metadata_groups":[{"id":"people","label":"People","entries":[{"key":"dc:contributor","label":"Contributor","values":["Alkire, Richard C."]},{"key":"dc:creator","label":"Author","values":["Chung, Dean S."]}]},{"id":"academic_context","label":"Academic Context","entries":[{"key":"dc:date","label":"Dc Date","values":["2011-05-07T13:08:12Z","10000-01-01","1996"]},{"key":"dc:type","label":"Dc Type","values":["text"]},{"key":"thesis:degree_discipline","label":"Discipline","values":["Chemical Engineering"]},{"key":"thesis:degree_level","label":"Degree Level","values":["Dissertation"]},{"key":"thesis:degree_name","label":"Degree Name","values":["Ph.D."]},{"key":"thesis:institution_name","label":"Thesis Institution Name","values":["University of Illinois at Urbana-Champaign"]}]},{"id":"subjects_keywords","label":"Subjects and Keywords","entries":[{"key":"dc:subject","label":"Dc Subject","values":["Engineering, Chemical","Engineering, Materials Science"]}]},{"id":"language_rights","label":"Language and Rights","entries":[{"key":"dc:language","label":"Dc Language","values":["eng"]},{"key":"dc:rights","label":"Dc Rights","values":["Copyright 1996 Chung, Dean S."]}]},{"id":"identifiers","label":"Identifiers","entries":[{"key":"dc:identifier","label":"Identifier","values":["9780591197723","AAI9712231","(UMI)AAI9712231","http://hdl.handle.net/2142/21422"]}]},{"id":"additional","label":"Additional Metadata","entries":[{"key":"dc:description","label":"Description","values":["The confocal laser scanning microscope (CLSM) was used in situ during electrochemical experiments to track localized fluorescence patterns of adsorbed organic agents and correlate such adsorption with the changes in surface morphology accompanying electrolysis. In solutions of 5 $\\mu$M DiOC$\\sb6$(3)/0.01 M $\\rm H\\sb2SO\\sb4$ with and without 0.05 M CuSO$\\sb4$, confocal imaging revealed that DiOC$\\sb6$(3) adsorbed to polycrystalline Au and inhibited cathodic processes occurring there. In the absence of dissolved Cu, DiOC$\\sb6$(3) adsorption on Au remained unaltered by changes in cathodic potential up to $-$750 mV (SSE). During Cu electrodeposition at $-$550 mV and at $-$650 mV (SSE), adsorbed DiOC$\\sb6$(3) restricted nucleation of Cu to a small number of active sites, where Cu grew hemispherically, and DiOC$\\sb6$(3) adsorption was maintained across regions where nucleation had not occurred. Instantaneous nucleation was approached under such conditions. When DiOC$\\sb6$(3) was present, copper growth proceeded according to the Volmer-Weber mechanism at $-$650 mV (SSE). Results from secondary ion mass spectrometry indicated that DiOC$\\sb6$(3), or a derivative of it, was incorporated into the deposit during Cu electrodeposition. When the Cu deposits were dissolved electrochemically at 0 mV (SSE), surfaces of Cu, not Au, became covered with previously incorporated DiOC$\\sb6$(3), which impeded the electrodissolution process. DiI did not exhibit an appreciable electrochemical or morphological effect on Cu electrodeposition. At 5 $\\mu$M, DiI was adsorbed at recesses of the deposit profile when Cu electrodeposition occurred at $-$390 mV (SSE).","Made available in DSpace on 2011-05-07T13:08:12Z (GMT). No. of bitstreams: 2 license.txt: 4922 bytes, checksum: 910b249b4beec47e7ab768910c8f966f (MD5) 9712231.pdf: 4337328 bytes, checksum: 127a74c7935c5637c7266929d2a5369a (MD5) Previous issue date: 1996","Item marked as restricted to the 'UIUC Users [automated]' Group (id=2) by Howard Ding (hding2@illinois.edu) on 2011-05-07T14:50:40Z Item is restricted indefinitely.","Restriction data tranferred 2014-07-01T11:23:10-05:00 Original Data Group with Access UIUC Users [automated] Release Date: none Reason: ETDs are only available to UIUC Users without author permission","ETDs are only available to UIUC Users without author permission","U of I Only"]},{"key":"dc:title","label":"Title","values":["Localized adsorption of organic additives during copper electrodeposition"]}]}],"canonical_facts":{"dc:contributor":["Alkire, Richard C."],"dc:creator":["Chung, Dean S."],"dc:date":["2011-05-07T13:08:12Z","10000-01-01","1996"],"dc:description":["The confocal laser scanning microscope (CLSM) was used in situ during electrochemical experiments to track localized fluorescence patterns of adsorbed organic agents and correlate such adsorption with the changes in surface morphology accompanying electrolysis. In solutions of 5 $\\mu$M DiOC$\\sb6$(3)/0.01 M $\\rm H\\sb2SO\\sb4$ with and without 0.05 M CuSO$\\sb4$, confocal imaging revealed that DiOC$\\sb6$(3) adsorbed to polycrystalline Au and inhibited cathodic processes occurring there. In the absence of dissolved Cu, DiOC$\\sb6$(3) adsorption on Au remained unaltered by changes in cathodic potential up to $-$750 mV (SSE). During Cu electrodeposition at $-$550 mV and at $-$650 mV (SSE), adsorbed DiOC$\\sb6$(3) restricted nucleation of Cu to a small number of active sites, where Cu grew hemispherically, and DiOC$\\sb6$(3) adsorption was maintained across regions where nucleation had not occurred. Instantaneous nucleation was approached under such conditions. When DiOC$\\sb6$(3) was present, copper growth proceeded according to the Volmer-Weber mechanism at $-$650 mV (SSE). Results from secondary ion mass spectrometry indicated that DiOC$\\sb6$(3), or a derivative of it, was incorporated into the deposit during Cu electrodeposition. When the Cu deposits were dissolved electrochemically at 0 mV (SSE), surfaces of Cu, not Au, became covered with previously incorporated DiOC$\\sb6$(3), which impeded the electrodissolution process. DiI did not exhibit an appreciable electrochemical or morphological effect on Cu electrodeposition. At 5 $\\mu$M, DiI was adsorbed at recesses of the deposit profile when Cu electrodeposition occurred at $-$390 mV (SSE).","Made available in DSpace on 2011-05-07T13:08:12Z (GMT). No. of bitstreams: 2 license.txt: 4922 bytes, checksum: 910b249b4beec47e7ab768910c8f966f (MD5) 9712231.pdf: 4337328 bytes, checksum: 127a74c7935c5637c7266929d2a5369a (MD5) Previous issue date: 1996","Item marked as restricted to the 'UIUC Users [automated]' Group (id=2) by Howard Ding (hding2@illinois.edu) on 2011-05-07T14:50:40Z Item is restricted indefinitely.","Restriction data tranferred 2014-07-01T11:23:10-05:00 Original Data Group with Access UIUC Users [automated] Release Date: none Reason: ETDs are only available to UIUC Users without author permission","ETDs are only available to UIUC Users without author permission","U of I Only"],"dc:identifier":["9780591197723","AAI9712231","(UMI)AAI9712231","http://hdl.handle.net/2142/21422"],"dc:language":["eng"],"dc:rights":["Copyright 1996 Chung, Dean S."],"dc:subject":["Engineering, Chemical","Engineering, Materials Science"],"dc:title":["Localized adsorption of organic additives during copper electrodeposition"],"dc:type":["text"],"thesis:degree_discipline":["Chemical Engineering"],"thesis:degree_level":["Dissertation"],"thesis:degree_name":["Ph.D."],"thesis:institution_name":["University of Illinois at Urbana-Champaign"]},"updated_at":"2026-07-22T22:25:17Z"}