{"id":{"repo_id":"uiuc","oai_identifier":"oai:www.ideals.illinois.edu:2142/18564"},"canonical_url":"https://search.dev.ndltd.org/etd/uiuc/oai:www.ideals.illinois.edu:2142/18564","repository":{"repo_id":"uiuc","name":"University of Illinois - Urbana-Champaign","base_url":"https://www.ideals.illinois.edu/oai-pmh"},"display":{"title":"Dynamic delamination of patterned thin films","abstract":"We present here a novel experimental/numerical protocol to extract the fracture toughness of the thin film/substrate interface. The testing method involves using a laser-induced acoustic stress wave to load the film/substrate fracture plane in tension at very high strain rate (~10^7/s) leading to the inertia-driven interface delamination. A weak adhesive layer is selectively introduced at the interface to serve as a pre-crack exploiting the inertial effect to obtain stable crack growth. The kinetic energy imparted to the weakly bonded region of the film is converted into fracture energy as the thin film delaminates in a controlled fashion. To support the dynamic experiment in extracting the interface fracture toughness values, we develop a numerical scheme based on the combination of spectral representation of the elastodynamic solutions for the substrate and finite element model for the thin film. Cohesive elements are introduced along the bi-material interface to capture the decohesion process. The important role of the inertia on the crack extension and the mixed-mode failure are demonstrated by observing the traction stress evolutions at various points along the bond line. To speed up the simulation process we develop a numerical scheme based on the combination of a nonlinear beam model to capture the elastodynamic response of the thin film and a cohesive failure model to simulate the interface. Numerical results are then validated with experimental measurements of the interface crack evolution history using resistance gage technique. The fracture toughness values measured from the dynamic tests are finally validated with results obtained by using four-point bending technique.","abstract_html":"We present here a novel experimental/numerical protocol to extract the fracture toughness of the thin film/substrate interface. The testing method involves using a laser-induced acoustic stress wave to load the film/substrate fracture plane in tension at very high strain rate (~10^7/s) leading to the inertia-driven interface delamination. A weak adhesive layer is selectively introduced at the interface to serve as a pre-crack exploiting the inertial effect to obtain stable crack growth. The kinetic energy imparted to the weakly bonded region of the film is converted into fracture energy as the thin film delaminates in a controlled fashion. To support the dynamic experiment in extracting the interface fracture toughness values, we develop a numerical scheme based on the combination of spectral representation of the elastodynamic solutions for the substrate and finite element model for the thin film. Cohesive elements are introduced along the bi-material interface to capture the decohesion process. The important role of the inertia on the crack extension and the mixed-mode failure are demonstrated by observing the traction stress evolutions at various points along the bond line. To speed up the simulation process we develop a numerical scheme based on the combination of a nonlinear beam model to capture the elastodynamic response of the thin film and a cohesive failure model to simulate the interface. Numerical results are then validated with experimental measurements of the interface crack evolution history using resistance gage technique. The fracture toughness values measured from the dynamic tests are finally validated with results obtained by using four-point bending technique.","abstract_has_math":false,"creators":["Tran, Phuong"],"institution":"University of Illinois at Urbana-Champaign","degree_name":"Ph.D.","degree_level":"Dissertation","degree_discipline":"Theoretical & Applied Mechans","degree_department":null,"school":null,"contributors":["Geubelle, Philippe H.","Sottos, Nancy R.","Hsia, K. Jimmy","Lambros, John"],"advisors":[],"committee_chairs":[],"committee_members":[],"year":2011,"date_issued":"2011-01-21T22:46:40Z","date_published":"2011-01-21T22:46:40Z","updated_at":"2026-07-22T22:25:11Z","subjects":["Thin film","delamination","interfacial fracture","cohesive model","four-point bend test","fracture toughness","laser spallation"],"languages":["en"],"rights":["Copyright 2010 Phuong Tran"],"rights_urls":[],"identifier_entries":[]},"links":{"outbound_url":"http://hdl.handle.net/2142/18564","outbound_label":"Handle","outbound_source":"dc:identifier"},"metadata_groups":[{"id":"people","label":"People","entries":[{"key":"dc:contributor","label":"Contributor","values":["Geubelle, Philippe H.","Sottos, Nancy R.","Hsia, K. Jimmy","Lambros, John"]},{"key":"dc:creator","label":"Author","values":["Tran, Phuong"]}]},{"id":"academic_context","label":"Academic Context","entries":[{"key":"dc:date","label":"Dc Date","values":["2011-01-21T22:46:40Z","2013-01-22T11:00:25Z","2010-12"]},{"key":"thesis:degree_discipline","label":"Discipline","values":["Theoretical & Applied Mechans"]},{"key":"thesis:degree_level","label":"Degree Level","values":["Dissertation"]},{"key":"thesis:degree_name","label":"Degree Name","values":["Ph.D."]},{"key":"thesis:institution_name","label":"Thesis Institution Name","values":["University of Illinois at Urbana-Champaign"]}]},{"id":"subjects_keywords","label":"Subjects and Keywords","entries":[{"key":"dc:subject","label":"Dc Subject","values":["Thin film","delamination","interfacial fracture","cohesive model","four-point bend test","fracture toughness","laser spallation"]}]},{"id":"language_rights","label":"Language and Rights","entries":[{"key":"dc:language","label":"Dc Language","values":["en"]},{"key":"dc:rights","label":"Dc Rights","values":["Copyright 2010 Phuong Tran"]}]},{"id":"identifiers","label":"Identifiers","entries":[{"key":"dc:identifier","label":"Identifier","values":["http://hdl.handle.net/2142/18564"]}]},{"id":"additional","label":"Additional Metadata","entries":[{"key":"dc:description","label":"Description","values":["We present here a novel experimental/numerical protocol to extract the fracture toughness of the thin film/substrate interface. The testing method involves using a laser-induced acoustic stress wave to load the film/substrate fracture plane in tension at very high strain rate (~10^7/s) leading to the inertia-driven interface delamination. A weak adhesive layer is selectively introduced at the interface to serve as a pre-crack exploiting the inertial effect to obtain stable crack growth. The kinetic energy imparted to the weakly bonded region of the film is converted into fracture energy as the thin film delaminates in a controlled fashion. To support the dynamic experiment in extracting the interface fracture toughness values, we develop a numerical scheme based on the combination of spectral representation of the elastodynamic solutions for the substrate and finite element model for the thin film. Cohesive elements are introduced along the bi-material interface to capture the decohesion process. The important role of the inertia on the crack extension and the mixed-mode failure are demonstrated by observing the traction stress evolutions at various points along the bond line. To speed up the simulation process we develop a numerical scheme based on the combination of a nonlinear beam model to capture the elastodynamic response of the thin film and a cohesive failure model to simulate the interface. Numerical results are then validated with experimental measurements of the interface crack evolution history using resistance gage technique. The fracture toughness values measured from the dynamic tests are finally validated with results obtained by using four-point bending technique.","Item withdrawn by Mark Zulauf (zulauf@illinois.edu) on 2010-09-23T18:03:43Z Item was in collections: University of Illinois Theses & Dissertations (ID: 1) No. of bitstreams: 1 TRAN_PHUONG.pdf: 13556629 bytes, checksum: 0035046f1e854ad18346eaf865e97538 (MD5)","Made available in DSpace on 2011-01-21T22:46:40Z (GMT). No. of bitstreams: 2 TRAN_PHUONG.pdf: 13556545 bytes, checksum: 458632d33fcab28c65505ed0a761e8cd (MD5) license.txt: 4058 bytes, checksum: df481b9342c84c5e2e81979f601011bb (MD5)","Item marked as restricted to the 'UIUC Users [automated]' Group (id=2) by William Ingram (wingram2@illinois.edu) on 2011-01-21T22:48:19Z Item is restricted until 2013-01-21T22:47:37Z","Item reinstated by Sarah Shreeves (sshreeve@illinois.edu) on 2013-01-22T11:00:25Z Item was in collections: University of Illinois Dissertations and Theses (ID: 204) Dissertations and Theses - Mechanical Science and Engineering (ID: 675) No. of bitstreams: 3 TRAN_PHUONG.pdf.txt: 205993 bytes, checksum: 5afe3aa0d289a52e264d657357d5c78b (MD5) TRAN_PHUONG.pdf: 13556545 bytes, checksum: 458632d33fcab28c65505ed0a761e8cd (MD5) license.txt: 4058 bytes, checksum: df481b9342c84c5e2e81979f601011bb (MD5)","Item released from any restrictions by Sarah Shreeves (sshreeve@illinois.edu) on 2013-01-22T11:00:25Z"]},{"key":"dc:title","label":"Title","values":["Dynamic delamination of patterned thin films"]}]}],"canonical_facts":{"dc:contributor":["Geubelle, Philippe H.","Sottos, Nancy R.","Hsia, K. Jimmy","Lambros, John"],"dc:creator":["Tran, Phuong"],"dc:date":["2011-01-21T22:46:40Z","2013-01-22T11:00:25Z","2010-12"],"dc:description":["We present here a novel experimental/numerical protocol to extract the fracture toughness of the thin film/substrate interface. The testing method involves using a laser-induced acoustic stress wave to load the film/substrate fracture plane in tension at very high strain rate (~10^7/s) leading to the inertia-driven interface delamination. A weak adhesive layer is selectively introduced at the interface to serve as a pre-crack exploiting the inertial effect to obtain stable crack growth. The kinetic energy imparted to the weakly bonded region of the film is converted into fracture energy as the thin film delaminates in a controlled fashion. To support the dynamic experiment in extracting the interface fracture toughness values, we develop a numerical scheme based on the combination of spectral representation of the elastodynamic solutions for the substrate and finite element model for the thin film. Cohesive elements are introduced along the bi-material interface to capture the decohesion process. The important role of the inertia on the crack extension and the mixed-mode failure are demonstrated by observing the traction stress evolutions at various points along the bond line. To speed up the simulation process we develop a numerical scheme based on the combination of a nonlinear beam model to capture the elastodynamic response of the thin film and a cohesive failure model to simulate the interface. Numerical results are then validated with experimental measurements of the interface crack evolution history using resistance gage technique. The fracture toughness values measured from the dynamic tests are finally validated with results obtained by using four-point bending technique.","Item withdrawn by Mark Zulauf (zulauf@illinois.edu) on 2010-09-23T18:03:43Z Item was in collections: University of Illinois Theses & Dissertations (ID: 1) No. of bitstreams: 1 TRAN_PHUONG.pdf: 13556629 bytes, checksum: 0035046f1e854ad18346eaf865e97538 (MD5)","Made available in DSpace on 2011-01-21T22:46:40Z (GMT). No. of bitstreams: 2 TRAN_PHUONG.pdf: 13556545 bytes, checksum: 458632d33fcab28c65505ed0a761e8cd (MD5) license.txt: 4058 bytes, checksum: df481b9342c84c5e2e81979f601011bb (MD5)","Item marked as restricted to the 'UIUC Users [automated]' Group (id=2) by William Ingram (wingram2@illinois.edu) on 2011-01-21T22:48:19Z Item is restricted until 2013-01-21T22:47:37Z","Item reinstated by Sarah Shreeves (sshreeve@illinois.edu) on 2013-01-22T11:00:25Z Item was in collections: University of Illinois Dissertations and Theses (ID: 204) Dissertations and Theses - Mechanical Science and Engineering (ID: 675) No. of bitstreams: 3 TRAN_PHUONG.pdf.txt: 205993 bytes, checksum: 5afe3aa0d289a52e264d657357d5c78b (MD5) TRAN_PHUONG.pdf: 13556545 bytes, checksum: 458632d33fcab28c65505ed0a761e8cd (MD5) license.txt: 4058 bytes, checksum: df481b9342c84c5e2e81979f601011bb (MD5)","Item released from any restrictions by Sarah Shreeves (sshreeve@illinois.edu) on 2013-01-22T11:00:25Z"],"dc:identifier":["http://hdl.handle.net/2142/18564"],"dc:language":["en"],"dc:rights":["Copyright 2010 Phuong Tran"],"dc:subject":["Thin film","delamination","interfacial fracture","cohesive model","four-point bend test","fracture toughness","laser spallation"],"dc:title":["Dynamic delamination of patterned thin films"],"thesis:degree_discipline":["Theoretical & Applied Mechans"],"thesis:degree_level":["Dissertation"],"thesis:degree_name":["Ph.D."],"thesis:institution_name":["University of Illinois at Urbana-Champaign"]},"updated_at":"2026-07-22T22:25:11Z"}