{"id":{"repo_id":"uiuc","oai_identifier":"oai:www.ideals.illinois.edu:2142/129793"},"canonical_url":"https://search.dev.ndltd.org/etd/uiuc/oai:www.ideals.illinois.edu:2142/129793","repository":{"repo_id":"uiuc","name":"University of Illinois - Urbana-Champaign","base_url":"https://www.ideals.illinois.edu/oai-pmh"},"display":{"title":"A computer vision-based dimension measurement method for visual inspection system in smart manufacturing","abstract":"Submission published under a 24 month embargo labeled 'Closed Access', the embargo will last until 2027-05-01","abstract_html":"Submission published under a 24 month embargo labeled 'Closed Access', the embargo will last until 2027-05-01","abstract_has_math":false,"creators":["Liu, Shitao"],"institution":"University of Illinois Urbana-Champaign","degree_name":"M.S.","degree_level":"Thesis","degree_discipline":"Electrical & Computer Engr","degree_department":null,"school":null,"contributors":["Do, Minh N."],"advisors":[],"committee_chairs":[],"committee_members":[],"year":2025,"date_issued":"2025-05-09","date_published":"2025-05-09","updated_at":"2026-07-22T22:25:05Z","subjects":["Computer Vision","Inspection","Metrology","Smart Manufacturing"],"languages":["en","eng"],"rights":["Copyright 2025 Shitao Liu"],"rights_urls":[],"identifier_entries":[]},"links":{"outbound_url":"https://hdl.handle.net/2142/129793","outbound_label":"Handle","outbound_source":"dc:identifier"},"metadata_groups":[{"id":"people","label":"People","entries":[{"key":"dc:contributor","label":"Contributor","values":["Do, Minh N."]},{"key":"dc:creator","label":"Author","values":["Liu, Shitao"]}]},{"id":"academic_context","label":"Academic Context","entries":[{"key":"dc:date","label":"Dc Date","values":["2025-05-09","2025-05"]},{"key":"dc:type","label":"Dc Type","values":["text"]},{"key":"thesis:degree_discipline","label":"Discipline","values":["Electrical & Computer Engr"]},{"key":"thesis:degree_level","label":"Degree Level","values":["Thesis"]},{"key":"thesis:degree_name","label":"Degree Name","values":["M.S."]},{"key":"thesis:institution_name","label":"Thesis Institution Name","values":["University of Illinois Urbana-Champaign"]}]},{"id":"subjects_keywords","label":"Subjects and Keywords","entries":[{"key":"dc:subject","label":"Dc Subject","values":["Computer Vision","Inspection","Metrology","Smart Manufacturing"]}]},{"id":"language_rights","label":"Language and Rights","entries":[{"key":"dc:language","label":"Dc Language","values":["en","eng"]},{"key":"dc:rights","label":"Dc Rights","values":["Copyright 2025 Shitao Liu"]}]},{"id":"identifiers","label":"Identifiers","entries":[{"key":"dc:identifier","label":"Identifier","values":["https://hdl.handle.net/2142/129793"]}]},{"id":"additional","label":"Additional Metadata","entries":[{"key":"dc:description","label":"Description","values":["Submission published under a 24 month embargo labeled 'Closed Access', the embargo will last until 2027-05-01","The student, Shitao Liu, accepted the attached license on 2025-05-09 at 16:53.","The student, Shitao Liu, submitted this Thesis for approval on 2025-05-09 at 16:56.","This Thesis was approved for publication on 2025-05-09 at 17:02.","DSpace SAF Submission Ingestion Package generated from Vireo submission #22293 on 2025-10-19 at 19:55:54","Accurate dimension inspection is crucial in manufacturing. The proper functionality of the manufactured products is premised on the accurate dimension recognization, localization, and measurement. Traditionally, this task can be conducted by a trained technician. However, as the global electronics market grows and the development of semi-conductor industry progresses, the manufactured products become smaller in size but larger in quantity, which poses a significant challenge to the manufacturers. Thus, developing and deploying an automated inspection system with high accuracy and fidelity is needed to ensure the smooth operation of these manufacturers. In this thesis, I develop a dimension inspection system based on applying computer vision techniques to analyzing the photos of manufactured parts to solve this question. With CAD drawings and sample part images provided by Foxconn Interconnect Technology (FIT), I design a workflow to facilitate the inspection process, from critical feature recognition to data reporting. The backbone of this inspection system is based on image-level signal filtering and geometry detection to ensure the flexibility and generalizability across different CAD designs. The performance of this inspection system was tested on a large dataset of six different dimensions from the USB-C connector FIT manufactures, as well as our proprietary 3D printing dataset, and the result shows the industrial application potential of this system."]},{"key":"dc:format","label":"Dc Format","values":["application/pdf"]},{"key":"dc:title","label":"Title","values":["A computer vision-based dimension measurement method for visual inspection system in smart manufacturing"]}]}],"canonical_facts":{"dc:contributor":["Do, Minh N."],"dc:creator":["Liu, Shitao"],"dc:date":["2025-05-09","2025-05"],"dc:description":["Submission published under a 24 month embargo labeled 'Closed Access', the embargo will last until 2027-05-01","The student, Shitao Liu, accepted the attached license on 2025-05-09 at 16:53.","The student, Shitao Liu, submitted this Thesis for approval on 2025-05-09 at 16:56.","This Thesis was approved for publication on 2025-05-09 at 17:02.","DSpace SAF Submission Ingestion Package generated from Vireo submission #22293 on 2025-10-19 at 19:55:54","Accurate dimension inspection is crucial in manufacturing. The proper functionality of the manufactured products is premised on the accurate dimension recognization, localization, and measurement. Traditionally, this task can be conducted by a trained technician. However, as the global electronics market grows and the development of semi-conductor industry progresses, the manufactured products become smaller in size but larger in quantity, which poses a significant challenge to the manufacturers. Thus, developing and deploying an automated inspection system with high accuracy and fidelity is needed to ensure the smooth operation of these manufacturers. In this thesis, I develop a dimension inspection system based on applying computer vision techniques to analyzing the photos of manufactured parts to solve this question. With CAD drawings and sample part images provided by Foxconn Interconnect Technology (FIT), I design a workflow to facilitate the inspection process, from critical feature recognition to data reporting. The backbone of this inspection system is based on image-level signal filtering and geometry detection to ensure the flexibility and generalizability across different CAD designs. The performance of this inspection system was tested on a large dataset of six different dimensions from the USB-C connector FIT manufactures, as well as our proprietary 3D printing dataset, and the result shows the industrial application potential of this system."],"dc:format":["application/pdf"],"dc:identifier":["https://hdl.handle.net/2142/129793"],"dc:language":["en","eng"],"dc:rights":["Copyright 2025 Shitao Liu"],"dc:subject":["Computer Vision","Inspection","Metrology","Smart Manufacturing"],"dc:title":["A computer vision-based dimension measurement method for visual inspection system in smart manufacturing"],"dc:type":["text"],"thesis:degree_discipline":["Electrical & Computer Engr"],"thesis:degree_level":["Thesis"],"thesis:degree_name":["M.S."],"thesis:institution_name":["University of Illinois Urbana-Champaign"]},"updated_at":"2026-07-22T22:25:05Z"}