{"id":{"repo_id":"uiuc","oai_identifier":"oai:www.ideals.illinois.edu:2142/109602"},"canonical_url":"https://search.dev.ndltd.org/etd/uiuc/oai:www.ideals.illinois.edu:2142/109602","repository":{"repo_id":"uiuc","name":"University of Illinois - Urbana-Champaign","base_url":"https://www.ideals.illinois.edu/oai-pmh"},"display":{"title":"Chip scale monolithic integration of inductive and capacitive components by self-rolled-up membrane nanotechnology","abstract":"This work reports a three-dimensional (3D) microwave L-C filter network enabled by a CMOS-compatible two-dimensional (2D) fabrication approach, which combines inductive (L) and capacitive (C) self-rolled-up membrane (S-RuM) components monolithically into a single L-C network structure, thereby greatly reducing the on-chip area footprint. The individual L-C elements are fabricated in-plane using standard semiconductor processing techniques, and subsequently triggered by the built-in stress to self-assemble and roll into cylindrical air-core architectures. By designing the planar structure geometry and constituent layer properties to achieve a specific number of turns with a desired inner diameter when the device is rolled up, the electrical characteristics can be engineered. The network layouts of the L and C components are also reconfigurable by selecting appropriate input, output, and ground contact routing topographies. The devices demonstrated here operate over the range of ~1-10 GHz. Their area and volume footprints are 0.095 mm2 and 0.01 mm3, respectively, which are ~10× smaller than most of the comparable conventional filter designs. These S-RuM-enabled 3D microtubular L-C filter networks represent a significant advancement for miniaturization and integration of RF devices for applications in mobile connectivity.","abstract_html":"This work reports a three-dimensional (3D) microwave L-C filter network enabled by a CMOS-compatible two-dimensional (2D) fabrication approach, which combines inductive (L) and capacitive (C) self-rolled-up membrane (S-RuM) components monolithically into a single L-C network structure, thereby greatly reducing the on-chip area footprint. The individual L-C elements are fabricated in-plane using standard semiconductor processing techniques, and subsequently triggered by the built-in stress to self-assemble and roll into cylindrical air-core architectures. By designing the planar structure geometry and constituent layer properties to achieve a specific number of turns with a desired inner diameter when the device is rolled up, the electrical characteristics can be engineered. The network layouts of the L and C components are also reconfigurable by selecting appropriate input, output, and ground contact routing topographies. The devices demonstrated here operate over the range of ~1-10 GHz. Their area and volume footprints are 0.095 mm2 and 0.01 mm3, respectively, which are ~10× smaller than most of the comparable conventional filter designs. These S-RuM-enabled 3D microtubular L-C filter networks represent a significant advancement for miniaturization and integration of RF devices for applications in mobile connectivity.","abstract_has_math":false,"creators":["Yang, Zhendong"],"institution":"University of Illinois at Urbana-Champaign","degree_name":"M.S.","degree_level":"Thesis","degree_discipline":"Electrical & Computer Engr","degree_department":null,"school":null,"contributors":["Li, Xiuling"],"advisors":[],"committee_chairs":[],"committee_members":[],"year":2021,"date_issued":"2021-03-05T21:45:37Z","date_published":"2021-03-05T21:45:37Z","updated_at":"2026-07-22T22:24:50Z","subjects":["Monolithic, rolled-up, MEMS, L-C network, Inductor, Capacitor"],"languages":["en"],"rights":["Copyright 2020 Zhendong Yang"],"rights_urls":[],"identifier_entries":[]},"links":{"outbound_url":"http://hdl.handle.net/2142/109602","outbound_label":"Handle","outbound_source":"dc:identifier"},"metadata_groups":[{"id":"people","label":"People","entries":[{"key":"dc:contributor","label":"Contributor","values":["Li, Xiuling"]},{"key":"dc:creator","label":"Author","values":["Yang, Zhendong"]}]},{"id":"academic_context","label":"Academic Context","entries":[{"key":"dc:date","label":"Dc Date","values":["2021-03-05T21:45:37Z","2023-03-05T21:47:41Z","2020-12-01","2020-12"]},{"key":"dc:type","label":"Dc Type","values":["text","Thesis"]},{"key":"thesis:degree_discipline","label":"Discipline","values":["Electrical & Computer Engr"]},{"key":"thesis:degree_level","label":"Degree Level","values":["Thesis"]},{"key":"thesis:degree_name","label":"Degree Name","values":["M.S."]},{"key":"thesis:institution_name","label":"Thesis Institution Name","values":["University of Illinois at Urbana-Champaign"]}]},{"id":"subjects_keywords","label":"Subjects and Keywords","entries":[{"key":"dc:subject","label":"Dc Subject","values":["Monolithic, rolled-up, MEMS, L-C network, Inductor, Capacitor"]}]},{"id":"language_rights","label":"Language and Rights","entries":[{"key":"dc:language","label":"Dc Language","values":["en"]},{"key":"dc:rights","label":"Dc Rights","values":["Copyright 2020 Zhendong Yang"]}]},{"id":"identifiers","label":"Identifiers","entries":[{"key":"dc:identifier","label":"Identifier","values":["http://hdl.handle.net/2142/109602"]}]},{"id":"additional","label":"Additional Metadata","entries":[{"key":"dc:description","label":"Description","values":["This work reports a three-dimensional (3D) microwave L-C filter network enabled by a CMOS-compatible two-dimensional (2D) fabrication approach, which combines inductive (L) and capacitive (C) self-rolled-up membrane (S-RuM) components monolithically into a single L-C network structure, thereby greatly reducing the on-chip area footprint. The individual L-C elements are fabricated in-plane using standard semiconductor processing techniques, and subsequently triggered by the built-in stress to self-assemble and roll into cylindrical air-core architectures. By designing the planar structure geometry and constituent layer properties to achieve a specific number of turns with a desired inner diameter when the device is rolled up, the electrical characteristics can be engineered. The network layouts of the L and C components are also reconfigurable by selecting appropriate input, output, and ground contact routing topographies. The devices demonstrated here operate over the range of ~1-10 GHz. Their area and volume footprints are 0.095 mm2 and 0.01 mm3, respectively, which are ~10× smaller than most of the comparable conventional filter designs. These S-RuM-enabled 3D microtubular L-C filter networks represent a significant advancement for miniaturization and integration of RF devices for applications in mobile connectivity.","Submission published under a 24 month embargo labeled 'Closed Access', the embargo will last until 2022-12-01","The student, Zhendong Yang, accepted the attached license on 2020-11-25 at 10:23.","The student, Zhendong Yang, submitted this Thesis for approval on 2020-11-25 at 10:32.","This Thesis was approved for publication on 2020-12-01 at 17:24.","DSpace SAF Submission Ingestion Package generated from Vireo submission #15960 on 2021-03-04 at 16:32:27","Made available in DSpace on 2021-03-05T21:45:37Z (GMT). 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The individual L-C elements are fabricated in-plane using standard semiconductor processing techniques, and subsequently triggered by the built-in stress to self-assemble and roll into cylindrical air-core architectures. By designing the planar structure geometry and constituent layer properties to achieve a specific number of turns with a desired inner diameter when the device is rolled up, the electrical characteristics can be engineered. The network layouts of the L and C components are also reconfigurable by selecting appropriate input, output, and ground contact routing topographies. The devices demonstrated here operate over the range of ~1-10 GHz. Their area and volume footprints are 0.095 mm2 and 0.01 mm3, respectively, which are ~10× smaller than most of the comparable conventional filter designs. These S-RuM-enabled 3D microtubular L-C filter networks represent a significant advancement for miniaturization and integration of RF devices for applications in mobile connectivity.","Submission published under a 24 month embargo labeled 'Closed Access', the embargo will last until 2022-12-01","The student, Zhendong Yang, accepted the attached license on 2020-11-25 at 10:23.","The student, Zhendong Yang, submitted this Thesis for approval on 2020-11-25 at 10:32.","This Thesis was approved for publication on 2020-12-01 at 17:24.","DSpace SAF Submission Ingestion Package generated from Vireo submission #15960 on 2021-03-04 at 16:32:27","Made available in DSpace on 2021-03-05T21:45:37Z (GMT). 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