{"id":{"repo_id":"uiuc","oai_identifier":"oai:www.ideals.illinois.edu:2142/109538"},"canonical_url":"https://search.dev.ndltd.org/etd/uiuc/oai:www.ideals.illinois.edu:2142/109538","repository":{"repo_id":"uiuc","name":"University of Illinois - Urbana-Champaign","base_url":"https://www.ideals.illinois.edu/oai-pmh"},"display":{"title":"ABAQUS simulation and optimization of PMMA hot embossing process","abstract":"Increasing demand for microstructure replication in the industry has led to increasing attention to hot embossing technology. The hot embossing technology has developed a lot for the past few decades and been proved to be capable to replicate microstructure with high efficiency and high accuracy. This thesis is going to establish a numerical hot embossing model that can simulate the hot embossing process. The effect of process parameters will be discussed based on the model. The optimization method for the process parameters will also be performed, which can guide the manufacturing process. Finally, a process defect diagnosis system is designed and tested with the simulation experiments of the hot embossing model.","abstract_html":"Increasing demand for microstructure replication in the industry has led to increasing attention to hot embossing technology. The hot embossing technology has developed a lot for the past few decades and been proved to be capable to replicate microstructure with high efficiency and high accuracy. This thesis is going to establish a numerical hot embossing model that can simulate the hot embossing process. The effect of process parameters will be discussed based on the model. The optimization method for the process parameters will also be performed, which can guide the manufacturing process. Finally, a process defect diagnosis system is designed and tested with the simulation experiments of the hot embossing model.","abstract_has_math":false,"creators":["Cui, Yixiao"],"institution":"University of Illinois at Urbana-Champaign","degree_name":"M.S.","degree_level":"Thesis","degree_discipline":"Mechanical Engineering","degree_department":null,"school":null,"contributors":["Kapoor, Shiv Gopal"],"advisors":[],"committee_chairs":[],"committee_members":[],"year":2021,"date_issued":"2021-03-05T21:42:53Z","date_published":"2021-03-05T21:42:53Z","updated_at":"2026-07-22T22:24:50Z","subjects":["Hot Embossing","Simulation","Optimization","Diagnosis"],"languages":["en"],"rights":["Copyright 2020, Yixiao Cui"],"rights_urls":[],"identifier_entries":[]},"links":{"outbound_url":"http://hdl.handle.net/2142/109538","outbound_label":"Handle","outbound_source":"dc:identifier"},"metadata_groups":[{"id":"people","label":"People","entries":[{"key":"dc:contributor","label":"Contributor","values":["Kapoor, Shiv Gopal"]},{"key":"dc:creator","label":"Author","values":["Cui, Yixiao"]}]},{"id":"academic_context","label":"Academic Context","entries":[{"key":"dc:date","label":"Dc Date","values":["2021-03-05T21:42:53Z","2023-03-05T21:43:00Z","2020-12-10","2020-12"]},{"key":"dc:type","label":"Dc Type","values":["text","Thesis"]},{"key":"thesis:degree_discipline","label":"Discipline","values":["Mechanical Engineering"]},{"key":"thesis:degree_level","label":"Degree Level","values":["Thesis"]},{"key":"thesis:degree_name","label":"Degree Name","values":["M.S."]},{"key":"thesis:institution_name","label":"Thesis Institution Name","values":["University of Illinois at Urbana-Champaign"]}]},{"id":"subjects_keywords","label":"Subjects and Keywords","entries":[{"key":"dc:subject","label":"Dc Subject","values":["Hot Embossing","Simulation","Optimization","Diagnosis"]}]},{"id":"language_rights","label":"Language and Rights","entries":[{"key":"dc:language","label":"Dc Language","values":["en"]},{"key":"dc:rights","label":"Dc Rights","values":["Copyright 2020, Yixiao Cui"]}]},{"id":"identifiers","label":"Identifiers","entries":[{"key":"dc:identifier","label":"Identifier","values":["http://hdl.handle.net/2142/109538"]}]},{"id":"additional","label":"Additional Metadata","entries":[{"key":"dc:description","label":"Description","values":["Increasing demand for microstructure replication in the industry has led to increasing attention to hot embossing technology. 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Finally, a process defect diagnosis system is designed and tested with the simulation experiments of the hot embossing model.","Submission published under a 24 month embargo labeled 'U of I Access', the embargo will last until 2022-12-01","The student, Yixiao Cui, accepted the attached license on 2020-12-09 at 12:17.","The student, Yixiao Cui, submitted this Thesis for approval on 2020-12-09 at 12:17.","This Thesis was approved for publication on 2020-12-10 at 16:49.","DSpace SAF Submission Ingestion Package generated from Vireo submission #16105 on 2021-03-04 at 16:20:49","Made available in DSpace on 2021-03-05T21:42:53Z (GMT). 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The hot embossing technology has developed a lot for the past few decades and been proved to be capable to replicate microstructure with high efficiency and high accuracy. This thesis is going to establish a numerical hot embossing model that can simulate the hot embossing process. The effect of process parameters will be discussed based on the model. The optimization method for the process parameters will also be performed, which can guide the manufacturing process. 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