{"id":{"repo_id":"uiuc","oai_identifier":"oai:www.ideals.illinois.edu:2142/102450"},"canonical_url":"https://search.dev.ndltd.org/etd/uiuc/oai:www.ideals.illinois.edu:2142/102450","repository":{"repo_id":"uiuc","name":"University of Illinois - Urbana-Champaign","base_url":"https://www.ideals.illinois.edu/oai-pmh"},"display":{"title":"A mechanically-guided approach to three-dimensional functional mesostructures towards unconventional applications","abstract":"Controlled formation of three-dimensional functional mesostructures (3DFMs) has broad engineering implications in biomedical devices, microelectromechanical systems (MEMS), optics, and energy storage. Most existing 3D techniques, however, not only lack compatibility with essential electronic materials (silicon, metals, ceramics) that exist in solid-state or crystalline forms, but also produce in a slow and inefficient manner. This is in stark contrast to the planar technologies widely adopted by the modern semiconductor industry. I propose to solve these challenges by a novel 3D assembly strategy based on the planar technologies, which involves precisely controlled 2D-to-3D transformations via the substrate-induced mechanical buckling. This lithography-based, mechanically-guided 3D approach is compatible with virtually any engineering thin films including semiconductors, metals, and polymers, applies to a wide range of length scales and geometries and produces in a high throughput. In this dissertation, I present strategies that combine fabrications and mechanics to achieve a set of complex 3D geometries. I also study the potentials of the 3DFMs in micro-robotics. I further demonstrate the unique applications in energy harvesting, bio-integrated systems, and nanoscale sensing. The results may enlighten the development of advanced, multi-functional 3D electronic micro-systems inaccessible to other 3D techniques.","abstract_html":"Controlled formation of three-dimensional functional mesostructures (3DFMs) has broad engineering implications in biomedical devices, microelectromechanical systems (MEMS), optics, and energy storage. Most existing 3D techniques, however, not only lack compatibility with essential electronic materials (silicon, metals, ceramics) that exist in solid-state or crystalline forms, but also produce in a slow and inefficient manner. This is in stark contrast to the planar technologies widely adopted by the modern semiconductor industry. I propose to solve these challenges by a novel 3D assembly strategy based on the planar technologies, which involves precisely controlled 2D-to-3D transformations via the substrate-induced mechanical buckling. This lithography-based, mechanically-guided 3D approach is compatible with virtually any engineering thin films including semiconductors, metals, and polymers, applies to a wide range of length scales and geometries and produces in a high throughput. In this dissertation, I present strategies that combine fabrications and mechanics to achieve a set of complex 3D geometries. I also study the potentials of the 3DFMs in micro-robotics. I further demonstrate the unique applications in energy harvesting, bio-integrated systems, and nanoscale sensing. The results may enlighten the development of advanced, multi-functional 3D electronic micro-systems inaccessible to other 3D techniques.","abstract_has_math":false,"creators":["Nan, Kewang"],"institution":"University of Illinois at Urbana-Champaign","degree_name":"Ph.D.","degree_level":"Dissertation","degree_discipline":"Mechanical Engineering","degree_department":null,"school":null,"contributors":["Rogers, John A.","Braun, Paul V.","Kim, Seok","Li, Xiuling"],"advisors":[],"committee_chairs":[],"committee_members":[],"year":2019,"date_issued":"2019-02-06T19:36:08Z","date_published":"2019-02-06T19:36:08Z","updated_at":"2026-07-22T22:24:40Z","subjects":["mechanically-guided 3D assembly","micro fabrications","flexible and stretchable electronics"],"languages":["en"],"rights":["Copyright 2018 Kewang Nan"],"rights_urls":[],"identifier_entries":[]},"links":{"outbound_url":"http://hdl.handle.net/2142/102450","outbound_label":"Handle","outbound_source":"dc:identifier"},"metadata_groups":[{"id":"people","label":"People","entries":[{"key":"dc:contributor","label":"Contributor","values":["Rogers, John A.","Braun, Paul V.","Kim, Seok","Li, Xiuling"]},{"key":"dc:creator","label":"Author","values":["Nan, Kewang"]}]},{"id":"academic_context","label":"Academic Context","entries":[{"key":"dc:date","label":"Dc Date","values":["2019-02-06T19:36:08Z","2018-11-30","2018-12"]},{"key":"dc:type","label":"Dc Type","values":["text"]},{"key":"thesis:degree_discipline","label":"Discipline","values":["Mechanical Engineering"]},{"key":"thesis:degree_level","label":"Degree Level","values":["Dissertation"]},{"key":"thesis:degree_name","label":"Degree Name","values":["Ph.D."]},{"key":"thesis:institution_name","label":"Thesis Institution Name","values":["University of Illinois at Urbana-Champaign"]}]},{"id":"subjects_keywords","label":"Subjects and Keywords","entries":[{"key":"dc:subject","label":"Dc Subject","values":["mechanically-guided 3D assembly","micro fabrications","flexible and stretchable electronics"]}]},{"id":"language_rights","label":"Language and Rights","entries":[{"key":"dc:language","label":"Dc Language","values":["en"]},{"key":"dc:rights","label":"Dc Rights","values":["Copyright 2018 Kewang Nan"]}]},{"id":"identifiers","label":"Identifiers","entries":[{"key":"dc:identifier","label":"Identifier","values":["http://hdl.handle.net/2142/102450"]}]},{"id":"additional","label":"Additional Metadata","entries":[{"key":"dc:description","label":"Description","values":["Controlled formation of three-dimensional functional mesostructures (3DFMs) has broad engineering implications in biomedical devices, microelectromechanical systems (MEMS), optics, and energy storage. Most existing 3D techniques, however, not only lack compatibility with essential electronic materials (silicon, metals, ceramics) that exist in solid-state or crystalline forms, but also produce in a slow and inefficient manner. This is in stark contrast to the planar technologies widely adopted by the modern semiconductor industry. I propose to solve these challenges by a novel 3D assembly strategy based on the planar technologies, which involves precisely controlled 2D-to-3D transformations via the substrate-induced mechanical buckling. This lithography-based, mechanically-guided 3D approach is compatible with virtually any engineering thin films including semiconductors, metals, and polymers, applies to a wide range of length scales and geometries and produces in a high throughput. In this dissertation, I present strategies that combine fabrications and mechanics to achieve a set of complex 3D geometries. I also study the potentials of the 3DFMs in micro-robotics. I further demonstrate the unique applications in energy harvesting, bio-integrated systems, and nanoscale sensing. The results may enlighten the development of advanced, multi-functional 3D electronic micro-systems inaccessible to other 3D techniques.","Submission original under an indefinite embargo labeled 'Open Access'. The submission was exported from vireo on 2019-02-05 without embargo terms","The student, Kewang Nan, accepted the attached license on 2018-11-28 at 19:20.","The student, Kewang Nan, submitted this Dissertation for approval on 2018-11-28 at 19:27.","This Dissertation was approved for publication on 2018-11-30 at 17:20.","DSpace SAF Submission Ingestion Package generated from Vireo submission #13140 on 2019-02-05 at 11:09:59","Made available in DSpace on 2019-02-06T19:36:08Z (GMT). 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Most existing 3D techniques, however, not only lack compatibility with essential electronic materials (silicon, metals, ceramics) that exist in solid-state or crystalline forms, but also produce in a slow and inefficient manner. This is in stark contrast to the planar technologies widely adopted by the modern semiconductor industry. I propose to solve these challenges by a novel 3D assembly strategy based on the planar technologies, which involves precisely controlled 2D-to-3D transformations via the substrate-induced mechanical buckling. This lithography-based, mechanically-guided 3D approach is compatible with virtually any engineering thin films including semiconductors, metals, and polymers, applies to a wide range of length scales and geometries and produces in a high throughput. In this dissertation, I present strategies that combine fabrications and mechanics to achieve a set of complex 3D geometries. I also study the potentials of the 3DFMs in micro-robotics. I further demonstrate the unique applications in energy harvesting, bio-integrated systems, and nanoscale sensing. The results may enlighten the development of advanced, multi-functional 3D electronic micro-systems inaccessible to other 3D techniques.","Submission original under an indefinite embargo labeled 'Open Access'. The submission was exported from vireo on 2019-02-05 without embargo terms","The student, Kewang Nan, accepted the attached license on 2018-11-28 at 19:20.","The student, Kewang Nan, submitted this Dissertation for approval on 2018-11-28 at 19:27.","This Dissertation was approved for publication on 2018-11-30 at 17:20.","DSpace SAF Submission Ingestion Package generated from Vireo submission #13140 on 2019-02-05 at 11:09:59","Made available in DSpace on 2019-02-06T19:36:08Z (GMT). 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