University of Illinois - Chicago
Elastic and Thermoelastic Stresses in Biomedical Sensors and Bicomponent Fibers
Abstract
dc:descriptionThe performance and structural integrity of polymeric systems are strongly influenced by elastic and thermoelastic stresses. This dissertation examines these stresses within a unified framework spanning two areas: the development of composite biomedical sensors and the analysis of bicomponent fibers. To address the clinical need to prevent medical device-related pressure injuries (MDRPIs), a mechanochromic sensor was designed and fabricated from elastomeric films embedded with silica nanoparticles. The sensor exhibits a distinct, reversible transition from transparent to opaque white within pressure levels clinically associated with the onset of tissue ischemia, providing a low-cost, real-time method to identify harmful tissue loading. In parallel, thermoelastic stress-induced delamination in bicomponent fibers, a critical failure mode in advanced textiles, was investigated. A customized blister test was devised to quantify interfacial adhesion energy for industrially relevant polymer pairs such as polypropylene/polyethylene (PP/PE). Analytical models were developed to predict thermoelastic stress distributions across common fiber cross-sections, with the experimentally measured interfacial adhesion serving as the critical threshold for evaluating the predicted stresses and anticipating delamination. The study also assesses the role of compatibilizers in modifying interfacial adhesion and outlines strategies to mitigate delamination and strengthen bicomponent fibers. By integrating experimental characterization with theoretical modeling, this work provides fundamental insight into stress-driven behavior and practical guidance for materials used in healthcare and high-performance fiber technologies.
Author and committee
dc:creator, dc:contributor.*- Author dc:creator
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- Yanyue Wang (1377351)
Subjects
dc:subject × 3Rights
dc:rights- Statement dc:rights
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- In Copyright
- Open Access after 2028-01-01
Identifiers
dc:identifier.*- DOI dc:identifier
- https://doi.org/10.25417/uic.31451662.v1
- OAI identifier oai:identifier
- oai:figshare.com:article/31451662