{"id":{"repo_id":"ucf","oai_identifier":"oai:stars.library.ucf.edu:etd-1669"},"canonical_url":"https://search.dev.ndltd.org/etd/ucf/oai:stars.library.ucf.edu:etd-1669","repository":{"repo_id":"ucf","name":"Central Florida","base_url":"https://stars.library.ucf.edu/do/oai/"},"display":{"title":"Design, Fabrication, and Interrogation of Integrated Wireless SAW Temperature Sensors","abstract":"Wireless surface acoustic wave (SAW) sensors offer unique advantages over other sensor technologies because of their inherent ability to operate in harsh environments and completely passive operation, providing a reliable, maintenance-free life cycle. For certain SAW sensor applications the challenge is building a wirelessly interrogatable device with the same lifetime as the SAW substrate. The design of these application intensive sensors is complicated by the degradation of device bond wires, die adhesive, and antenna substrate. In an effort to maximize the benefits of the platform, this dissertation demonstrates wafer-level integrated SAW sensors that directly connect the thin film SAW to a thick film on-wafer antenna. Fully integrated device embodiments are presented that operate over a wide range of temperatures using different fabrication techniques, substrates, and coding principles.","abstract_html":"Wireless surface acoustic wave (SAW) sensors offer unique advantages over other sensor technologies because of their inherent ability to operate in harsh environments and completely passive operation, providing a reliable, maintenance-free life cycle. For certain SAW sensor applications the challenge is building a wirelessly interrogatable device with the same lifetime as the SAW substrate. The design of these application intensive sensors is complicated by the degradation of device bond wires, die adhesive, and antenna substrate. In an effort to maximize the benefits of the platform, this dissertation demonstrates wafer-level integrated SAW sensors that directly connect the thin film SAW to a thick film on-wafer antenna. Fully integrated device embodiments are presented that operate over a wide range of temperatures using different fabrication techniques, substrates, and coding principles.","abstract_has_math":false,"creators":["Gallagher, Mark"],"institution":null,"degree_name":null,"degree_level":null,"degree_discipline":null,"degree_department":null,"school":null,"contributors":["Malocha, Donald C."],"advisors":[],"committee_chairs":[],"committee_members":[],"year":2015,"date_issued":"2015-01-01T08:00:00Z","date_published":"2015-01-01T08:00:00Z","updated_at":"2026-07-24T05:09:09Z","subjects":["Surface acoustic wave; wireless sensors; rfid","Engineering","Dissertations, Academic -- Engineering and Computer Science; Engineering and Computer Science -- Dissertations, Academic"],"languages":["English"],"rights":[],"rights_urls":[],"identifier_entries":[{"key":"dc:identifier","label":"Identifier","values":["CFE0005795"],"render_values":[{"text":"CFE0005795","href":null,"code":true}]}]},"links":{"outbound_url":"https://stars.library.ucf.edu/etd/670","outbound_label":"Repository record","outbound_source":"dc:identifier.uri"},"metadata_groups":[{"id":"people","label":"People","entries":[{"key":"dc:contributor","label":"Contributor","values":["Malocha, Donald C."]},{"key":"dc:creator","label":"Author","values":["Gallagher, Mark"]}]},{"id":"academic_context","label":"Academic Context","entries":[{"key":"dc:type","label":"Dc Type","values":["Doctoral Dissertation (Open Access)"]}]},{"id":"subjects_keywords","label":"Subjects and Keywords","entries":[{"key":"dc:subject","label":"Dc Subject","values":["Surface acoustic wave; wireless sensors; rfid","Engineering","Dissertations, Academic -- Engineering and Computer Science; Engineering and Computer Science -- Dissertations, Academic"]}]},{"id":"language_rights","label":"Language and Rights","entries":[{"key":"dc:language","label":"Dc Language","values":["English"]}]},{"id":"identifiers","label":"Identifiers","entries":[{"key":"dc:identifier","label":"Identifier","values":["CFE0005795"]},{"key":"dc:identifier.uri","label":"Identifier URI","values":["https://stars.library.ucf.edu/etd/670"]}]},{"id":"additional","label":"Additional Metadata","entries":[{"key":"dc:description","label":"Description","values":["<p>If this is your thesis or dissertation, and want to learn how to access it or for more information about readership statistics, contact us at <a href=\"mailto:STARS@ucf.edu\">STARS@ucf.edu</a></p>","Doctor of Philosophy (Ph.D.)","College of Engineering and Computer Science","Electrical Engineering and Computer Science","Engineering and Computer Science"]},{"key":"dc:description.abstract","label":"Abstract","values":["Wireless surface acoustic wave (SAW) sensors offer unique advantages over other sensor technologies because of their inherent ability to operate in harsh environments and completely passive operation, providing a reliable, maintenance-free life cycle. For certain SAW sensor applications the challenge is building a wirelessly interrogatable device with the same lifetime as the SAW substrate. The design of these application intensive sensors is complicated by the degradation of device bond wires, die adhesive, and antenna substrate. In an effort to maximize the benefits of the platform, this dissertation demonstrates wafer-level integrated SAW sensors that directly connect the thin film SAW to a thick film on-wafer antenna. 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