Particleboard simulation model to improve machined surface quality

Particleboard (PB) is a widely used panel material because of its physical properties and low cost. Unfortunately, cutting can degrade its surface creating rejects and increasing manufacturing costs. A major challenge is PB’s internal variability. Different particle and glue bond strength combinations can sometimes create high quality surfaces in one area and defects such as edge chipping in nearby areas. This research examines methods of improving surface quality by examining PB characteristics and their interactions with the cutting tool. It also develops an analytical model and software tool that allows the effects of these factors to be simulated, thereby giving practical guidance and reducing the need for costly experiments. When PB is cut and the glue bond strength is weaker than the particle strength, particles are pulled out, leading to surface defects. When instead the glue bond strength is stronger than the particle strength, particles are smoothly cut, leading to a high quality surface. PB is modeled as a matrix of particles each with stochastically assigned material and glue bond strengths. The PB model is layered allowing particles to be misaligned. Voids are modeled as missing particles. PB cutting is modeled in three zones. In the finished material and tool tip zones, particles are compressed elastically and then crushed at constant stress. After failure, chip formation occurs in the chip formation zone. At large rake angles, the chip is modeled as a transversely loaded beam that can fail by cleavage at its base or tensile failure on its surface. At small rake angles, the chip is modeled as the resultant force acting on the plane from the tool tip through to the panel surface. Experimental and simulation results show that cutting forces increase with depth of cut, glue content and particle strength. They decrease with rake angle. Glue bond strength can be increased to the equivalent particle strength through the selection of particle geometry and the subsequent increased glue bond efficiency, which increases the cut surface quality without the need for additional glue. Minimizing the size and frequency of voids and using larger rake angles can also increase surface quality.

Name thesis:degree_name

Doctor of Philosophy - PhD

Level thesis:degree_level

doctoral

Discipline thesis:degree_discipline

Mechanical Engineering

Grantor dc:publisher

University of British Columbia

Year dc:date

2007

Author dc:creator

• Wong, Darrell

Statement dc:rights

• Attribution-NonCommercial-NoDerivatives 4.0 International

Licence

• http://creativecommons.org/licenses/by-nc-nd/4.0/

Language dc:language

eng

Handle dc:identifier

http://hdl.handle.net/2429/247

OAI identifier oai:identifier

oai:circle.library.ubc.ca:2429/247