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Sheffield Hallam University (United Kingdom).

The control of metal-NiNGaAs and NiNAlAs interfaces by cryogenic processing.

Abstract

dc:description.abstract

The physical and chemical properties of In- and Au- interfaces with In[0.53]Ga[0.47]As/InP(100) and In[0.52]Al[0.48]As(100) formed at room and low temperatures have been studied. Current-voltage measurements have indicated that In contacts to Ino[0.53]Ga[0.47]As(100) formed at 80K exhibit significantly higher Schottky barriers (&phis;b=0.45 eV) than In diodes formed at 294K (&phis;b=0.30 eV), whereas Au diodes formed on In[0.53]Ga[0.47]As(100) at either low temperature or room temperature exhibit Ohmic behaviour. The reactions occurring during interface formation at room and low temperatures have been investigated using soft X-ray photoemission spectroscopy (SXPS) and Transmission Electron Microscopy (TEM).The results presented show that In metallisation of In[0.53]Ga[0.47]As(100) at room temperature results in a predominantly three dimensional mode of growth, accompanied by the out-diffusion of As. Low temperature (125K) metallisation appears to reduce clustering and inhibit As out-diffusion. Examination of the resulting interfaces by TEM confirm the more uniform nature of the metal layers formed at low temperature. Metallisation temperature seems to have little effect on the formation of Au-In[0.53]Ga[0.47]As(100) interfaces, other than to reduce the extent of overlayer clustering, with As out-diffusion apparent for both low and room temperature Au deposition.Interfaces formed between In and In[0.52]Al[0.48]As(100) at both low and room temperature were relatively abrupt with no out-diffusion of substrate species into the metal overlayer. Low temperature metallisation again appeared to reduce overlayer clustering, with TEM studies showing a smaller grain size at low temperature. Au deposition onto In[0.52]Al[0.48]As(100) produced similar interfaces formed at room and low temperature. As diffuses into the Au overlayer to form an Au/As compound at both temperatures, resulting in an interface that is complex and reacted. The degree of overlayer clustering is also thought to be much less pronounced for Au deposition compared to In deposition.Barrier heights measured by SXPS during the study, show good agreement with reported current-voltage measurements for Au and In diodes formed on both In[0.53]Ga[0.47]As/InP(100) and In[0.52]Al[0.48]As(100). Possible mechanisms for the observed adaptation of the pinning position are discussed in the context of current models of Schottky barrier formation.

Degree

thesis:*
Name dc:type.qualificationname
phd
Level dc:type.qualificationlevel
doctoral
Grantor dc:publisher.institution
Sheffield Hallam University (United Kingdom).
Year dc:date.issued
1999

Author and committee

dc:creator, dc:contributor.*
Author dc:creator
  • Cammack, Darren S.

Rights

Language dc:language
en

Chain of custody

source
Harvested from
Sheffield Hallam University
Base URL
shura.shu.ac.uk/cgi/oai2
Last updated
2026-07-24
Source record
OAI-PMH GetRecord
citation

Cammack, Darren S.. The control of metal-NiNGaAs and NiNAlAs interfaces by cryogenic processing.. doctoral thesis, Sheffield Hallam University (United Kingdom)., 1999.