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Rochester Institute of Technology

Adhesion of copper to Teflon® FEP and PFA surfaces modified by vacuum UV photo-oxidation downstream from Ar microwave plasma

Degree

thesis:*
Name thesis:degree_name
Materials Science and Engineering (MS)
Level thesis:degree_level
Thesis

Author and committee

dc:creator, dc:contributor.*
Author dc:creator
  • Dasilva, Wagner
Contributors dc:contributor
  • G. Takacs

Identifiers

dc:identifier.*
Repository record dc:identifier
https://repository.rit.edu/theses/7531
OAI identifier oai:identifier
oai:repository.rit.edu:theses-8536

Chain of custody

source
Harvested from
Rochester Institute of Technology
Base URL
repository.rit.edu/do/oai/
Last updated
2026-07-27
Source record
OAI-PMH GetRecord
related terms
citation

Dasilva, Wagner. Adhesion of copper to Teflon® FEP and PFA surfaces modified by vacuum UV photo-oxidation downstream from Ar microwave plasma. Thesis thesis, https://repository.rit.edu/theses/7531