Stress Analysis for Chip Scale Packages with Embedded Active Devices under Thermal Cycling
type: CreativeWork
author: Yeo, Hyunwook
keywords: Chip scale packaging, Electronic apparatus and appliances -- Thermal properties, Electronic packaging, Electronics -- Materials -- Research, Manufacturing, Materials Science and Engineering, Mechanical Engineering
date modified: 2026-07-27T20:32:38Z
provider: Portland State University
publisher: Networked Digital Library of Theses and Dissertations
type: WebPage
source organization: Portland State University