{"id":{"repo_id":"njit","oai_identifier":"oai:digitalcommons.njit.edu:theses-1362"},"canonical_url":"https://search.dev.ndltd.org/etd/njit/oai:digitalcommons.njit.edu:theses-1362","repository":{"repo_id":"njit","name":"NJIT","base_url":"https://digitalcommons.njit.edu/do/oai/"},"display":{"title":"A two dimensional model of magnetic field assisted assembly","abstract":"A simplified model to simulate the magnetic field distribution for applications in magnetic field assisted assembly of semiconductor device structures, using commercial software (Vizimag), has been implemented. Solenoids have been utilized to serve as electromagnets that are responsible for the assembly process. Magnetic shielding techniques have been deployed to isolate the influence of one solenoid over another. These solenoids are used to move the devices that need to be placed in recesses within the substrate. The bottom of the devices and the recesses are coated with magnetic materials to facilitate the movement and placement of devices within the recesses in the substrate. The semiconductor devices may be made from a variety of materials such as semiconductors, to perform various functionalities.","abstract_html":"A simplified model to simulate the magnetic field distribution for applications in magnetic field assisted assembly of semiconductor device structures, using commercial software (Vizimag), has been implemented. Solenoids have been utilized to serve as electromagnets that are responsible for the assembly process. Magnetic shielding techniques have been deployed to isolate the influence of one solenoid over another. These solenoids are used to move the devices that need to be placed in recesses within the substrate. The bottom of the devices and the recesses are coated with magnetic materials to facilitate the movement and placement of devices within the recesses in the substrate. The semiconductor devices may be made from a variety of materials such as semiconductors, to perform various functionalities.","abstract_has_math":false,"creators":["Devrani, Gaurev"],"institution":null,"degree_name":"Master of Science in Electrical Engineering - (M.S.)","degree_level":null,"degree_discipline":"Electrical and Computer Engineering","degree_department":null,"school":null,"contributors":["N. M. Ravindra","Walid Hubbi","Michael R. Booty"],"advisors":[],"committee_chairs":[],"committee_members":[],"year":2008,"date_issued":"2008-08-31T07:00:00Z","date_published":"2008-08-31T07:00:00Z","updated_at":"2026-07-24T03:23:16Z","subjects":["Magnetic field distribution","Semiconductor device structure","Electrical and Electronics"],"languages":[],"rights":[],"rights_urls":[],"identifier_entries":[]},"links":{"outbound_url":"https://digitalcommons.njit.edu/theses/363","outbound_label":"Repository record","outbound_source":"dc:identifier"},"metadata_groups":[{"id":"people","label":"People","entries":[{"key":"dc:contributor","label":"Contributor","values":["N. M. Ravindra","Walid Hubbi","Michael R. 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Solenoids have been utilized to serve as electromagnets that are responsible for the assembly process. Magnetic shielding techniques have been deployed to isolate the influence of one solenoid over another. These solenoids are used to move the devices that need to be placed in recesses within the substrate. The bottom of the devices and the recesses are coated with magnetic materials to facilitate the movement and placement of devices within the recesses in the substrate. The semiconductor devices may be made from a variety of materials such as semiconductors, to perform various functionalities."]},{"key":"dc:title","label":"Title","values":["A two dimensional model of magnetic field assisted assembly"]}]}],"canonical_facts":{"dc:contributor":["N. M. Ravindra","Walid Hubbi","Michael R. Booty"],"dc:creator":["Devrani, Gaurev"],"dc:description.abstract":["A simplified model to simulate the magnetic field distribution for applications in magnetic field assisted assembly of semiconductor device structures, using commercial software (Vizimag), has been implemented. Solenoids have been utilized to serve as electromagnets that are responsible for the assembly process. Magnetic shielding techniques have been deployed to isolate the influence of one solenoid over another. These solenoids are used to move the devices that need to be placed in recesses within the substrate. The bottom of the devices and the recesses are coated with magnetic materials to facilitate the movement and placement of devices within the recesses in the substrate. The semiconductor devices may be made from a variety of materials such as semiconductors, to perform various functionalities."],"dc:identifier":["https://digitalcommons.njit.edu/theses/363"],"dc:subject":["Magnetic field distribution","Semiconductor device structure","Electrical and Electronics"],"dc:title":["A two dimensional model of magnetic field assisted assembly"],"dc:type":["Thesis"],"thesis:degree_discipline":["Electrical and Computer Engineering"],"thesis:degree_name":["Master of Science in Electrical Engineering - (M.S.)"]},"updated_at":"2026-07-24T03:23:16Z"}