PI AND EMI ANALYSIS OF 3D IC SYSTEM WITH TSVS AND CO-PACKAGED OPTICS

<p>"With the demand for developing high-capacity, high-density, high-power optical links for data center communications, co-packaged optics is a promising solution. When the three-dimensional (3D) IC and optic engines are integrated into the same package, the design of such systems in terms of signal integrity, power integrity, and electromagnetic interference will be more challenging.</p> <p>This first paper mainly focuses on modeling the bias-voltage-dependent, temperature-dependent, and light-intensity-dependent hysteresis behavior of a through-silicon-vias (TSV) structure in 3D IC and analyzing its effect on the power integrity of a system with 3D IC.</p> <p>This second paper investigates the scaled tendency of the emissions in a router system loaded with hundreds of optical modules, which can be applied for both traditional and future router systems with co-packaged optics. An artificial router mimicking the real system was built to investigate this tendency. Theoretical analysis, a statistical prediction method, and measurement have predicted and verified that the average of the maximal electric field radiated will increase following a 10 log10 N (dB) tendency, where N is the number of optical modules"--Abstract, p. iv</p>

Name thesis:degree_name

Ph. D. in Electrical Engineering

Grantor

Missouri University of Science and Technology

Author dc:creator

• Zhang, Wei

• Electrical and Computer Engineering
• Engineering

Repository record dc:identifier

https://scholarsmine.mst.edu/doctoral_dissertations/3228

OAI identifier oai:identifier

oai:scholarsmine.mst.edu:doctoral_dissertations-4233