{"id":{"repo_id":"must-thes","oai_identifier":"oai:scholarsmine.mst.edu:doctoral_dissertations-4168"},"canonical_url":"https://search.dev.ndltd.org/etd/must-thes/oai:scholarsmine.mst.edu:doctoral_dissertations-4168","repository":{"repo_id":"must-thes","name":"Missouri University of Science and Technology","base_url":"https://scholarsmine.mst.edu/do/oai/"},"display":{"title":"Characterization and modeling of ESD events, risk and protection","abstract":"<p>“The ESD (Electrostatic discharge) failures have been raising critical reliability problems in electronic devices design. However, not all the ESD scenarios have been specified by the IEC standard and the characterizations of the ESD risk for different scenarios are essential to evaluate the ESD robustness of the devices in the real word. </p><p>The insulation of plastic enclosures provides protection against ESD to the electronic system inside. However, seams between plastic parts are often unavoidable. Different plastic arrangements are constructed to investigate the spark length and current derivatives and to understand the ESD spark behavior for geometries having spark lengths longer than the values predicted by Paschen’s law.</p><p>For the wearable devices, the core difference between the posture assumed for IEC 61000-4-2 human metal discharge and a discharge to a wearable device is the impedance between the charged body and the grounded structure discharged to. The results show that the current measured in the brush-by scenario can reach values twice as high as the current specified in the IEC standard. A simulation model using the measured impedance and Rompe and Weizel’s law provides predictions on the peak current derivative when the spark length is varied. The increasing peak current derivative with shorter spark length indicates stronger field coupling to the devices.</p><p>SEED(System-efficient ESD design) modeling helps the designer to predict the ESD risk at the early stage, an accurate TVS model can be used to study the transient response of the external TVS and the on-chip protection when applied in a typical high-speed input/output (I/O) interface”--Abstract, page iv.</p>","abstract_html":"&lt;p&gt;“The ESD (Electrostatic discharge) failures have been raising critical reliability problems in electronic devices design. However, not all the ESD scenarios have been specified by the IEC standard and the characterizations of the ESD risk for different scenarios are essential to evaluate the ESD robustness of the devices in the real word. &lt;/p&gt;&lt;p&gt;The insulation of plastic enclosures provides protection against ESD to the electronic system inside. However, seams between plastic parts are often unavoidable. Different plastic arrangements are constructed to investigate the spark length and current derivatives and to understand the ESD spark behavior for geometries having spark lengths longer than the values predicted by Paschen’s law.&lt;/p&gt;&lt;p&gt;For the wearable devices, the core difference between the posture assumed for IEC 61000-4-2 human metal discharge and a discharge to a wearable device is the impedance between the charged body and the grounded structure discharged to. The results show that the current measured in the brush-by scenario can reach values twice as high as the current specified in the IEC standard. A simulation model using the measured impedance and Rompe and Weizel’s law provides predictions on the peak current derivative when the spark length is varied. The increasing peak current derivative with shorter spark length indicates stronger field coupling to the devices.&lt;/p&gt;&lt;p&gt;SEED(System-efficient ESD design) modeling helps the designer to predict the ESD risk at the early stage, an accurate TVS model can be used to study the transient response of the external TVS and the on-chip protection when applied in a typical high-speed input/output (I/O) interface”--Abstract, page iv.&lt;/p&gt;","abstract_has_math":false,"creators":["Zhou, Jianchi"],"institution":"Missouri University of Science and Technology","degree_name":"Ph. D. in Electrical Engineering","degree_level":null,"degree_discipline":null,"degree_department":null,"school":null,"contributors":[],"advisors":[],"committee_chairs":[],"committee_members":[],"year":null,"date_issued":"","date_published":null,"updated_at":"2026-07-24T03:18:09Z","subjects":["ESD","Modeling","Electromagnetics and Photonics"],"languages":[],"rights":[],"rights_urls":[],"identifier_entries":[]},"links":{"outbound_url":"https://scholarsmine.mst.edu/doctoral_dissertations/3163","outbound_label":"Repository record","outbound_source":"dc:identifier"},"metadata_groups":[{"id":"people","label":"People","entries":[{"key":"dc:creator","label":"Author","values":["Zhou, Jianchi"]}]},{"id":"academic_context","label":"Academic Context","entries":[{"key":"dc:type","label":"Dc Type","values":["Dissertation - Open Access"]},{"key":"thesis:degree_name","label":"Degree Name","values":["Ph. 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However, not all the ESD scenarios have been specified by the IEC standard and the characterizations of the ESD risk for different scenarios are essential to evaluate the ESD robustness of the devices in the real word. </p><p>The insulation of plastic enclosures provides protection against ESD to the electronic system inside. However, seams between plastic parts are often unavoidable. Different plastic arrangements are constructed to investigate the spark length and current derivatives and to understand the ESD spark behavior for geometries having spark lengths longer than the values predicted by Paschen’s law.</p><p>For the wearable devices, the core difference between the posture assumed for IEC 61000-4-2 human metal discharge and a discharge to a wearable device is the impedance between the charged body and the grounded structure discharged to. The results show that the current measured in the brush-by scenario can reach values twice as high as the current specified in the IEC standard. A simulation model using the measured impedance and Rompe and Weizel’s law provides predictions on the peak current derivative when the spark length is varied. The increasing peak current derivative with shorter spark length indicates stronger field coupling to the devices.</p><p>SEED(System-efficient ESD design) modeling helps the designer to predict the ESD risk at the early stage, an accurate TVS model can be used to study the transient response of the external TVS and the on-chip protection when applied in a typical high-speed input/output (I/O) interface”--Abstract, page iv.</p>"]},{"key":"dc:title","label":"Title","values":["Characterization and modeling of ESD events, risk and protection"]}]}],"canonical_facts":{"dc:creator":["Zhou, Jianchi"],"dc:description.abstract":["<p>“The ESD (Electrostatic discharge) failures have been raising critical reliability problems in electronic devices design. However, not all the ESD scenarios have been specified by the IEC standard and the characterizations of the ESD risk for different scenarios are essential to evaluate the ESD robustness of the devices in the real word. </p><p>The insulation of plastic enclosures provides protection against ESD to the electronic system inside. However, seams between plastic parts are often unavoidable. Different plastic arrangements are constructed to investigate the spark length and current derivatives and to understand the ESD spark behavior for geometries having spark lengths longer than the values predicted by Paschen’s law.</p><p>For the wearable devices, the core difference between the posture assumed for IEC 61000-4-2 human metal discharge and a discharge to a wearable device is the impedance between the charged body and the grounded structure discharged to. The results show that the current measured in the brush-by scenario can reach values twice as high as the current specified in the IEC standard. A simulation model using the measured impedance and Rompe and Weizel’s law provides predictions on the peak current derivative when the spark length is varied. The increasing peak current derivative with shorter spark length indicates stronger field coupling to the devices.</p><p>SEED(System-efficient ESD design) modeling helps the designer to predict the ESD risk at the early stage, an accurate TVS model can be used to study the transient response of the external TVS and the on-chip protection when applied in a typical high-speed input/output (I/O) interface”--Abstract, page iv.</p>"],"dc:identifier":["https://scholarsmine.mst.edu/doctoral_dissertations/3163"],"dc:subject":["ESD","Modeling","Electromagnetics and Photonics"],"dc:title":["Characterization and modeling of ESD events, risk and protection"],"dc:type":["Dissertation - Open Access"],"thesis:degree_name":["Ph. D. in Electrical Engineering"],"thesis:institution_name":["Missouri University of Science and Technology"]},"updated_at":"2026-07-24T03:18:09Z"}