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University of Missouri--Rolla

Application of voltammetry to copper electrodeposition

Abstract

dc:description.abstract

<p>"A study was undertaken to determine the feasibility of using voltammetry and scanning electron microscopy techniques to characterize copper deposition from an acid-sulfate electrolyte. The main process variables investigated were temperature and addition agents (chloride ion, glue, separan or thiourea) at different concentrations, over a range of current densities. Cathodes employed were either polycrystalline titanium or copper. Some long-time copper deposits were also made using Ti cathodes and the orientations of these deposits were determined by x-ray diffraction.</p> <p>Observations of copper crystals produced during voltammetry scans, on a Ti cathode, indicated that a characteristic morphology was associated with each type of addition agent. Temperature also affected the physical appearance of the deposited copper. With a Cu cathode the crystal morphologies were essentially identical, regardless of the addition agent used. At a constant scanning rate of 1 mV/sec, the various addition agents, on both Ti and Cu cathodes, gave characteristic and reproducible voltammograms. Shifts and relative differences between the polarization curves were also noted with changing temperature.</p> <p>The results of this investigation indicate that there is a definite correlation between type and concentration of addition agent and voltammogram. The substrate used in the deposition process also has an effect. A definite relationship exists between the morphology of the copper and the processing conditions used during deposition. It thus seems that a combination of voltammetry and scanning electron microscopy would be potentially useful in predicting the electrolyzability of commercial copper refining or winning solutions"--Abstract, pages iv-v.</p>

Degree

thesis:*
Name thesis:degree_name
Ph. D. in Metallurgical Engineering
Grantor
University of Missouri--Rolla
Year dc:date.available
2016

Author and committee

dc:creator, dc:contributor.*
Author dc:creator
  • Toth, Louis Francis, Jr.

Subjects

dc:subject × 1

Identifiers

dc:identifier.*
OAI identifier oai:identifier
oai:scholarsmine.mst.edu:doctoral_dissertations-1272

Chain of custody

source
Harvested from
Missouri University of Science and Technology
Base URL
scholarsmine.mst.edu/do/oai/
Last updated
2026-07-24
Source record
OAI-PMH GetRecord
related terms
citation

Toth, Louis Francis, Jr.. Application of voltammetry to copper electrodeposition. University of Missouri--Rolla, 2016. https://scholarsmine.mst.edu/doctoral_dissertations/270