Modeling and design of perforated prosthetic sockets ARCHM to increase heat transfer of residual limbs

Heat build-up in prosthetic sockets is a significant problem experienced by many amputees in America, with no central solution in sight. Heat and discomfort accounts for over 70% of problems experienced by lower limb amputees in America. Although there have been advances in prosthetics in the active-power knees and ankles, not even cybernetics can improve the comfort of the prosthesis if there is still a socket. The materials in prosthetic sockets are not conductive enough to relieve the heat inside of the socket. The purpose of this study is to model the temperature variance and heat transfer of an amputee's residual limb and design ways to improve current prosthetic socket technologies. With the addition of small holes, or perforations, in the socket, there will be an increase in the heat transfer by convection, while still maintaining the strength of a carbon fiber prosthesis. Through the use of discrete approximation modeling, the transient temperature inside of the socket layers can be identified and improved through design patterns cut into the socket. Increased heat transfer can be observed as the perforations in the socket become larger, although the larger the holes, the larger the stresses are in the prosthesis. Non-intrusive designs were developed for sockets before and after they are made to increase convection surface area. More modeling needs to be done in 3-dimensional polar coordinates.

Department dc:contributor.department

Massachusetts Institute of Technology. Department of Mechanical Engineering.

Grantor dc:publisher

Massachusetts Institute of Technology

Year dc:date.issued

2015

Author dc:creator

• Carbajal, Luis

Advisor dc:contributor.advisor

• Timothy Gutowski.

• Mechanical Engineering.

Statement dc:rights

• M.I.T. theses are protected by copyright. They may be viewed from this source for any purpose, but reproduction or distribution in any format is prohibited without written permission. See provided URL for inquiries about permission.

Licence dc:rights.uri

• http://dspace.mit.edu/handle/1721.1/7582

Language dc:language.iso

eng

Handle dc:identifier.uri

http://hdl.handle.net/1721.1/98960

OAI identifier oai:identifier

oai:dspace.mit.edu:1721.1/98960