Electronic digital materials

Digital materials are constructions assembled from a small number of types of discrete building blocks; they represent a new way of building functional, multi-material, three-dimensional structures. In this thesis, I focus on the construction of microelectronics from vertically assemble-able two-dimensional parts. With just a conducting and insulating part-type, I show that it is possible to make discretely assembled electrical networks. With a third resistive part-type, I show that it is possible to make any passive electronic component and complex impedance circuitry, including antennas and matching networks. Finally, with four semiconducting part-types I suggest that it is possible to assemble active components like diodes and transistors. This work details the part production processes to create two-dimensional micro-bricks, modeling and assembly strategies to create functional structures from discrete parts, the measurement and evaluation of the bulk properties of the assemblies, and experiments in assembly automation.

Department dc:contributor.department

Program in Media Arts and Sciences (Massachusetts Institute of Technology)

Grantor dc:publisher

Massachusetts Institute of Technology

Year dc:date.issued

2014

Author dc:creator

• Langford, William Kai

Advisor dc:contributor.advisor

• Neil A. Gershenfeld.

• Architecture. Program in Media Arts and Sciences.

Statement dc:rights

• M.I.T. theses are protected by copyright. They may be viewed from this source for any purpose, but reproduction or distribution in any format is prohibited without written permission. See provided URL for inquiries about permission.

Licence dc:rights.uri

• http://dspace.mit.edu/handle/1721.1/7582

Language dc:language.iso

eng

Handle dc:identifier.uri

http://hdl.handle.net/1721.1/95609

OAI identifier oai:identifier

oai:dspace.mit.edu:1721.1/95609