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Massachusetts Institute of Technology

Modeling and analysis of extrusion-spin coating : an efficient and deterministic photoresist coating method in microlithography

Abstract

dc:description.abstract

In the fabrication of microelectronic chips, microlithography is used to transfer a pattern of circuit geometry from mask to semiconductor wafer. An important step in this process is the deposition of a thin and uniform layer of photoresist (often called resist) on which the lithographic image is exposed. Typical photoresist layers are less than 1 pum thick with a variation of 5 [angstroms] for advanced chips. Spin coating is the prevalent coating method to produce the required thickness and uniformity, but it typically wastes over 90% of the photoresist applied. A more efficient method needs to be developed for two reasons. The first is that 80% of the photoresist is an environmentally hazardous solvent. The second is the cost increase of photoresist. As the target of semiconductor industry moves toward the fabrication of smaller devices with larger capacity, the trend in photoresist shifts from i-line to deep UV resists, which allow for narrower linewidths on a chip. The price of this new resist is four to ten times higher than that of i-line resists. Reducing photoresist waste is desirable for both environmental and economical reasons. The current spin coating method has another problem in addition to low coating efficiency. Results from spin coating are unpredictable. The relationships between the inputs (process variables) and outputs (coating thickness and uniformity) can only be obtained by trial and error. Thus, a number of experiments have to be conducted to attain a certain coating thickness and uniformity. A more effective method would yield the predictable coating thicknesses and uniformities for given inputs.

Degree

thesis:*
Department dc:contributor.department
Massachusetts Institute of Technology. Dept. of Mechanical Engineering.
Grantor dc:publisher
Massachusetts Institute of Technology
Year dc:date.issued
2001

Author and committee

dc:creator, dc:contributor.*
Author dc:creator
  • Han, Sangjun, 1972-
Advisor dc:contributor.advisor
  • Jung-Hoon Chun.

Subjects

dc:subject × 1

Rights

dc:rights
Statement dc:rights
  • M.I.T. theses are protected by copyright. They may be viewed from this source for any purpose, but reproduction or distribution in any format is prohibited without written permission. See provided URL for inquiries about permission.
Language dc:language.iso
eng

Identifiers

dc:identifier.*
Handle dc:identifier.uri
http://hdl.handle.net/1721.1/8694
OAI identifier oai:identifier
oai:dspace.mit.edu:1721.1/8694

Chain of custody

source
Harvested from
MIT
Base URL
dspace.mit.edu/oai/request
Last updated
2026-07-22
Source record
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citation

Han, Sangjun, 1972-. Modeling and analysis of extrusion-spin coating : an efficient and deterministic photoresist coating method in microlithography. Massachusetts Institute of Technology, 2001. http://hdl.handle.net/1721.1/8694