{"id":{"repo_id":"mit","oai_identifier":"oai:dspace.mit.edu:1721.1/79315"},"canonical_url":"https://search.dev.ndltd.org/etd/mit/oai:dspace.mit.edu:1721.1/79315","repository":{"repo_id":"mit","name":"MIT","base_url":"https://dspace.mit.edu/oai/request"},"display":{"title":"Manufacturability of lab on chip devices : reagent-filled reservoirs bonding process and its effect on reagents flow pattern","abstract":"In its lab-on-a-chip product, Daktari Diagnostics utilizes \"reagent-filled reservoirs\" as a means of storing and delivering the liquid reagent. During the clinical trials of the product, undesired reagent flow patterns (namely, flow anomaly 1 & flow anomaly 2) were noticed. This work focused on optimizing the bonding process of the reagent-filled reservoirs to the backbone. Also, the relationship between the bonding process parameters and the reagent flow pattern was studied in depth. To achieve the objective of this thesis, an experiment was designed in which independent variables were the heat sealing parameters (x, y, z) and accelerated aging and the dependent variables were bond strength and the reagent flow pattern. Experiments showed that optimal Heat Sealing parameters are: parameter x = 4.5, parameter y = 110 and parameter z = 1.5. At the optimal settings of bonding process, the highest bond strength was attained and the reagent flow improved considerably but flow anomalies were not completely resolved. Also, results showed that accelerated aging affected the bond strength negatively. Accelerated aging also affected the flow pattern negatively, but this effect was not statistically significant.","abstract_html":"In its lab-on-a-chip product, Daktari Diagnostics utilizes "reagent-filled reservoirs" as a means of storing and delivering the liquid reagent. During the clinical trials of the product, undesired reagent flow patterns (namely, flow anomaly 1 & flow anomaly 2) were noticed. This work focused on optimizing the bonding process of the reagent-filled reservoirs to the backbone. Also, the relationship between the bonding process parameters and the reagent flow pattern was studied in depth. To achieve the objective of this thesis, an experiment was designed in which independent variables were the heat sealing parameters (x, y, z) and accelerated aging and the dependent variables were bond strength and the reagent flow pattern. Experiments showed that optimal Heat Sealing parameters are: parameter x = 4.5, parameter y = 110 and parameter z = 1.5. At the optimal settings of bonding process, the highest bond strength was attained and the reagent flow improved considerably but flow anomalies were not completely resolved. Also, results showed that accelerated aging affected the bond strength negatively. Accelerated aging also affected the flow pattern negatively, but this effect was not statistically significant.","abstract_has_math":false,"creators":["Saber, Aabed (Aabed Saud)"],"institution":"Massachusetts Institute of Technology","degree_name":null,"degree_level":null,"degree_discipline":null,"degree_department":"Massachusetts Institute of Technology. Department of Mechanical Engineering.","school":null,"contributors":[],"advisors":["Brian W. Anthony."],"committee_chairs":[],"committee_members":[],"year":2013,"date_issued":"2013","date_published":"2013","updated_at":"2026-07-22T22:21:11Z","subjects":["Mechanical Engineering."],"languages":["eng"],"rights":["M.I.T. theses are protected by copyright. They may be viewed from this source for any purpose, but reproduction or distribution in any format is prohibited without written permission. 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During the clinical trials of the product, undesired reagent flow patterns (namely, flow anomaly 1 & flow anomaly 2) were noticed. This work focused on optimizing the bonding process of the reagent-filled reservoirs to the backbone. Also, the relationship between the bonding process parameters and the reagent flow pattern was studied in depth. To achieve the objective of this thesis, an experiment was designed in which independent variables were the heat sealing parameters (x, y, z) and accelerated aging and the dependent variables were bond strength and the reagent flow pattern. Experiments showed that optimal Heat Sealing parameters are: parameter x = 4.5, parameter y = 110 and parameter z = 1.5. At the optimal settings of bonding process, the highest bond strength was attained and the reagent flow improved considerably but flow anomalies were not completely resolved. Also, results showed that accelerated aging affected the bond strength negatively. Accelerated aging also affected the flow pattern negatively, but this effect was not statistically significant."]},{"key":"dc:description.degree","label":"Dc Description Degree","values":["M.Eng.in Manufacturing"]},{"key":"dc:title","label":"Title","values":["Manufacturability of lab on chip devices : reagent-filled reservoirs bonding process and its effect on reagents flow pattern"]}]}],"canonical_facts":{"dc:contributor.advisor":["Brian W. Anthony."],"dc:contributor.department":["Massachusetts Institute of Technology. Department of Mechanical Engineering."],"dc:contributor.other":["Massachusetts Institute of Technology. Department of Mechanical Engineering."],"dc:creator":["Saber, Aabed (Aabed Saud)"],"dc:date.accessioned":["2013-06-17T19:55:24Z"],"dc:date.available":["2013-06-17T19:55:24Z"],"dc:date.issued":["2013"],"dc:description":["Thesis (M. 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Experiments showed that optimal Heat Sealing parameters are: parameter x = 4.5, parameter y = 110 and parameter z = 1.5. At the optimal settings of bonding process, the highest bond strength was attained and the reagent flow improved considerably but flow anomalies were not completely resolved. Also, results showed that accelerated aging affected the bond strength negatively. Accelerated aging also affected the flow pattern negatively, but this effect was not statistically significant."],"dc:description.degree":["M.Eng.in Manufacturing"],"dc:identifier.uri":["http://hdl.handle.net/1721.1/79315"],"dc:language.iso":["eng"],"dc:publisher":["Massachusetts Institute of Technology"],"dc:rights":["M.I.T. theses are protected by copyright. They may be viewed from this source for any purpose, but reproduction or distribution in any format is prohibited without written permission. See provided URL for inquiries about permission."],"dc:rights.uri":["http://dspace.mit.edu/handle/1721.1/7582"],"dc:subject":["Mechanical Engineering."],"dc:title":["Manufacturability of lab on chip devices : reagent-filled reservoirs bonding process and its effect on reagents flow pattern"],"dc:type":["Thesis"]},"updated_at":"2026-07-22T22:21:11Z"}