{"id":{"repo_id":"mit","oai_identifier":"oai:dspace.mit.edu:1721.1/78161"},"canonical_url":"https://search.dev.ndltd.org/etd/mit/oai:dspace.mit.edu:1721.1/78161","repository":{"repo_id":"mit","name":"MIT","base_url":"https://dspace.mit.edu/oai/request"},"display":{"title":"Elimination of PZT thin film breakage caused by electric current arcing and intrinsic differential strains during poling","abstract":"Historically, substrate breakage during the poling process has been responsible for a 2% yield loss for a contract manufacturer specializing in volume production of lead zirconate titatate (PZT) thin film devices. In this research, two major causes of poling breakage were identified. First, stresses along substrate edges make PZT substrates more susceptible to breakage if any sort of mechanical force is present. It was determined that these stresses were caused by differential strains due to incomplete metal layer coverage. Second, the electrical arcing that is frequently taking place during poling sends a mechanical shock wave through the substrate. Electrical arcing is caused by metal overspray during the sputtering process. Poling breakage was experimentally reduced by 70% by redesigning the shadow mask used during sputtering to eliminate any metal overspray.","abstract_html":"Historically, substrate breakage during the poling process has been responsible for a 2% yield loss for a contract manufacturer specializing in volume production of lead zirconate titatate (PZT) thin film devices. In this research, two major causes of poling breakage were identified. First, stresses along substrate edges make PZT substrates more susceptible to breakage if any sort of mechanical force is present. It was determined that these stresses were caused by differential strains due to incomplete metal layer coverage. Second, the electrical arcing that is frequently taking place during poling sends a mechanical shock wave through the substrate. Electrical arcing is caused by metal overspray during the sputtering process. Poling breakage was experimentally reduced by 70% by redesigning the shadow mask used during sputtering to eliminate any metal overspray.","abstract_has_math":false,"creators":["AlSaeed, Abdulelah (Abdulelah Ibrahim)"],"institution":"Massachusetts Institute of Technology","degree_name":null,"degree_level":null,"degree_discipline":null,"degree_department":"Massachusetts Institute of Technology. Dept. of Mechanical Engineering.","school":null,"contributors":[],"advisors":["Jung-Hoon Chun."],"committee_chairs":[],"committee_members":[],"year":2012,"date_issued":"2012","date_published":"2012","updated_at":"2026-07-22T22:21:58Z","subjects":["Mechanical Engineering."],"languages":["eng"],"rights":["M.I.T. theses are protected by copyright. They may be viewed from this source for any purpose, but reproduction or distribution in any format is prohibited without written permission. See provided URL for inquiries about permission."],"rights_urls":["http://dspace.mit.edu/handle/1721.1/7582"],"identifier_entries":[]},"links":{"outbound_url":"http://hdl.handle.net/1721.1/78161","outbound_label":"Handle","outbound_source":"dc:identifier.uri"},"metadata_groups":[{"id":"people","label":"People","entries":[{"key":"dc:contributor.advisor","label":"Advisor","values":["Jung-Hoon Chun."]},{"key":"dc:contributor.department","label":"Department","values":["Massachusetts Institute of Technology. Dept. of Mechanical Engineering."]},{"key":"dc:contributor.other","label":"Dc Contributor Other","values":["Massachusetts Institute of Technology. Dept. of Mechanical Engineering."]},{"key":"dc:creator","label":"Author","values":["AlSaeed, Abdulelah (Abdulelah Ibrahim)"]}]},{"id":"academic_context","label":"Academic Context","entries":[{"key":"dc:date.accessioned","label":"Dc Date Accessioned","values":["2013-03-28T18:09:35Z"]},{"key":"dc:date.available","label":"Dc Date Available","values":["2013-03-28T18:09:35Z"]},{"key":"dc:date.issued","label":"Date","values":["2012"]},{"key":"dc:publisher","label":"Institution","values":["Massachusetts Institute of Technology"]},{"key":"dc:type","label":"Dc Type","values":["Thesis"]}]},{"id":"subjects_keywords","label":"Subjects and Keywords","entries":[{"key":"dc:subject","label":"Dc Subject","values":["Mechanical Engineering."]}]},{"id":"language_rights","label":"Language and Rights","entries":[{"key":"dc:language.iso","label":"Language (ISO)","values":["eng"]},{"key":"dc:rights","label":"Dc Rights","values":["M.I.T. theses are protected by copyright. They may be viewed from this source for any purpose, but reproduction or distribution in any format is prohibited without written permission. See provided URL for inquiries about permission."]},{"key":"dc:rights.uri","label":"Rights URI","values":["http://dspace.mit.edu/handle/1721.1/7582"]}]},{"id":"identifiers","label":"Identifiers","entries":[{"key":"dc:identifier.uri","label":"Identifier URI","values":["http://hdl.handle.net/1721.1/78161"]}]},{"id":"additional","label":"Additional Metadata","entries":[{"key":"dc:description","label":"Description","values":["Thesis (M. Eng.)--Massachusetts Institute of Technology, Dept. of Mechanical Engineering, 2012.","Cataloged from PDF version of thesis.","Includes bibliographical references (p. 66)."]},{"key":"dc:description.abstract","label":"Abstract","values":["Historically, substrate breakage during the poling process has been responsible for a 2% yield loss for a contract manufacturer specializing in volume production of lead zirconate titatate (PZT) thin film devices. In this research, two major causes of poling breakage were identified. First, stresses along substrate edges make PZT substrates more susceptible to breakage if any sort of mechanical force is present. It was determined that these stresses were caused by differential strains due to incomplete metal layer coverage. Second, the electrical arcing that is frequently taking place during poling sends a mechanical shock wave through the substrate. Electrical arcing is caused by metal overspray during the sputtering process. Poling breakage was experimentally reduced by 70% by redesigning the shadow mask used during sputtering to eliminate any metal overspray."]},{"key":"dc:description.degree","label":"Dc Description Degree","values":["M.Eng."]},{"key":"dc:title","label":"Title","values":["Elimination of PZT thin film breakage caused by electric current arcing and intrinsic differential strains during poling"]}]}],"canonical_facts":{"dc:contributor.advisor":["Jung-Hoon Chun."],"dc:contributor.department":["Massachusetts Institute of Technology. Dept. of Mechanical Engineering."],"dc:contributor.other":["Massachusetts Institute of Technology. Dept. of Mechanical Engineering."],"dc:creator":["AlSaeed, Abdulelah (Abdulelah Ibrahim)"],"dc:date.accessioned":["2013-03-28T18:09:35Z"],"dc:date.available":["2013-03-28T18:09:35Z"],"dc:date.issued":["2012"],"dc:description":["Thesis (M. Eng.)--Massachusetts Institute of Technology, Dept. of Mechanical Engineering, 2012.","Cataloged from PDF version of thesis.","Includes bibliographical references (p. 66)."],"dc:description.abstract":["Historically, substrate breakage during the poling process has been responsible for a 2% yield loss for a contract manufacturer specializing in volume production of lead zirconate titatate (PZT) thin film devices. In this research, two major causes of poling breakage were identified. First, stresses along substrate edges make PZT substrates more susceptible to breakage if any sort of mechanical force is present. It was determined that these stresses were caused by differential strains due to incomplete metal layer coverage. Second, the electrical arcing that is frequently taking place during poling sends a mechanical shock wave through the substrate. Electrical arcing is caused by metal overspray during the sputtering process. Poling breakage was experimentally reduced by 70% by redesigning the shadow mask used during sputtering to eliminate any metal overspray."],"dc:description.degree":["M.Eng."],"dc:identifier.uri":["http://hdl.handle.net/1721.1/78161"],"dc:language.iso":["eng"],"dc:publisher":["Massachusetts Institute of Technology"],"dc:rights":["M.I.T. theses are protected by copyright. They may be viewed from this source for any purpose, but reproduction or distribution in any format is prohibited without written permission. See provided URL for inquiries about permission."],"dc:rights.uri":["http://dspace.mit.edu/handle/1721.1/7582"],"dc:subject":["Mechanical Engineering."],"dc:title":["Elimination of PZT thin film breakage caused by electric current arcing and intrinsic differential strains during poling"],"dc:type":["Thesis"]},"updated_at":"2026-07-22T22:21:58Z"}