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Massachusetts Institute of Technology

Process characterization of Electrical Discharge Machining of highly doped silicon

Abstract

dc:description.abstract

Electrical Discharge Machining (EDM) is an advanced machining process that removes material via thermal erosion through a plasma arc. The machining process is accomplished through the application of high frequency current (typically through a fine wire or some other electrode) to a conductive workpiece. The electrode is physically separated from the workpiece by some small distance and the potential difference is commonly discharged through an insulating dielectric material such as deionized water or oil. This short duration application of current produces a spark across the gap between the electrode and workpiece, causing vaporization and melting of local material in both the electrode and workpiece. The EDM process is most frequently used for conductive substrates (i.e. metals); however, research has shown that the process may be successfully used on semiconductor substrates such as doped silicon wafers'. The purpose of this research was to characterize the EDM process using Design of Experiments (DOE) statistical methodology on highly doped silicon wafer workpieces for material removal rate (MRR) and surface roughness (Ra) for both Wire EDM (WEDM) and die sinker EDM machines. Once process characterization was completed, confirmation testing was conducted for each machine. The applied spark energy had a significant impact on processing speed for both machines as expected, with the WEDM processing also heavily dependent on selected control speed. Surface roughness was also found to be highly dependent on spark energy for both machines. Evaluation of minimum obtainable feature sizes for some specific geometries as well as evaluation of various effects on the processing of silicon were also conducted.

Degree

thesis:*
Department dc:contributor.department
Massachusetts Institute of Technology. Dept. of Mechanical Engineering.
Grantor dc:publisher
Massachusetts Institute of Technology
Year dc:date.issued
2012

Author and committee

dc:creator, dc:contributor.*
Author dc:creator
  • Crawford, Gregory Allan
Advisor dc:contributor.advisor
  • David E. Hardt.

Subjects

dc:subject × 1

Rights

dc:rights
Statement dc:rights
  • M.I.T. theses are protected by copyright. They may be viewed from this source for any purpose, but reproduction or distribution in any format is prohibited without written permission. See provided URL for inquiries about permission.
Language dc:language.iso
eng

Identifiers

dc:identifier.*
Handle dc:identifier.uri
http://hdl.handle.net/1721.1/74893
OAI identifier oai:identifier
oai:dspace.mit.edu:1721.1/74893

Chain of custody

source
Harvested from
MIT
Base URL
dspace.mit.edu/oai/request
Last updated
2026-07-22
Source record
OAI-PMH GetRecord
citation

Crawford, Gregory Allan. Process characterization of Electrical Discharge Machining of highly doped silicon. Massachusetts Institute of Technology, 2012. http://hdl.handle.net/1721.1/74893